公开(公告)号：US20150014043A1

公开(公告)日：2015-01-15

申请号：US14311966

申请日：2014-06-23

Applicant: OMRON CORPORATION

Inventor： Akihiro HOZUMI

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/0999 ,  H05K2201/2045

Abstract: A printed wiring board including a connection part that is connected to a projecting portion of an external member by soldering, the connection part including a first hole in which the projecting portion is inserted, a main land to which the projecting portion is soldered, a metallic pattern that is drawn from the main land, and a sub-land that is connected to the main land through the metallic pattern, wherein the main land is constructed with a metallic film configured to cover a peripheral region of the first hole in at least a front face of the printed wiring board including the front face and a back face, the front face to which the soldering is performed and the back face on a side opposite to the front face, and the metallic film is not formed on a sidewall forming the first hole, and where the sub-land is constructed with a metallic film configured to cover a sidewall formed by a second hole piercing the printed wiring board and a peripheral region of the second hole in both the front face and the back face of the printed wiring board.

Abstract translation: 一种印刷电路板，包括通过焊接连接到外部构件的突出部分的连接部分，所述连接部分包括突出部分被插入的第一孔，突出部分被焊接到的主区域，金属 以及通过金属图案连接到主焊盘的子地面，其中主焊盘构造有金属膜，该金属膜被构造成至少覆盖第一孔的周边区域 印刷电路板的前表面包括正面和背面，执行焊接的正面和与正面相反的一侧的背面，金属膜不形成在形成 第一孔，并且其中子区域被构造成金属膜，金属膜被构造成覆盖由穿过印刷线路板的第二孔和第二孔的外围区域形成的侧壁 e正面和印刷电路板的背面。

公开(公告)号：US08933161B2

公开(公告)日：2015-01-13

申请号：US14005692

申请日：2012-03-16

Applicant: Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

IPC: B60C1/00 ,  C08J5/04 ,  C23C18/20 ,  C23C18/16 ,  C08G69/26 ,  C08K13/04 ,  H05K3/18 ,  B41M5/26 ,  H01Q1/38 ,  C08L77/06 ,  C08K7/04 ,  C23C18/38 ,  C08K9/02 ,  H05K1/03 ,  C08K3/22

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 提供了弯曲强度，弯曲模量和夏氏冲击强度优异的热塑性树脂成型体，其上可以成功地形成镀层。 用于激光直接结构的热塑性树脂组合物包括：相对于100重量份的热塑性树脂，10至150重量份的无机纤维和1至30重量份的激光直接结构化添加剂，所述激光直接结构化添加剂包含 铜，锑和锡中的至少一种，并且具有比无机纤维的莫氏硬度小1.5或更大的莫氏硬度。

公开(公告)号：US08918992B2

公开(公告)日：2014-12-30

申请号：US13557237

申请日：2012-07-25

Applicant: Chu-Hsun Wu

Inventor： Chu-Hsun Wu

IPC: H01K3/10

CPC classification number: G06F1/1626 ,  G06F1/1601 ,  G06F1/1637 ,  G06F2200/1612 ,  H05K1/0215 ,  H05K1/056 ,  H05K2201/0999

Abstract: A circuit layer manufacturing method is applied to a portable computer. The portable computer includes a front bezel, a display module, and a back cover. The front bezel is connected to the back cover for containing the display module. The front bezel includes a metal portion. The metal portion has a flat region corresponding to a side of the back cover. The circuit layer manufacturing method includes forming at least one control circuit layer assembly on the flat region, grounding the control circuit layer assembly to the flat region, and forming a protection layer on the control circuit layer assembly. The control circuit layer assembly includes an insulation layer and a control circuit layer. The control circuit layer is electrically connected to the display module. The insulation layer is formed between the control circuit layer and the flat region for being alternately stacked with the control circuit layer.

Abstract translation: 电路层制造方法应用于便携式计算机。 便携式计算机包括前挡板，显示模块和后盖。 前挡板连接到后盖，用于容纳显示模块。 前挡板包括金属部分。 金属部分具有对应于后盖的一侧的平坦区域。 电路层制造方法包括在平坦区域上形成至少一个控制电路层组件，将控制电路层组件接地到平坦区域，以及在控制电路层组件上形成保护层。 控制电路层组件包括绝缘层和控制电路层。 控制电路层与显示模块电连接。 绝缘层形成在控制电路层和平坦区域之间，以与控制电路层交替堆叠。

公开(公告)号：US20130329374A1

公开(公告)日：2013-12-12

申请号：US13542782

申请日：2012-07-06

Applicant: Keng-Hung Lin ,  Ming-Lun Chang ,  Yu-Min Lin

Inventor： Keng-Hung Lin ,  Ming-Lun Chang ,  Yu-Min Lin

IPC: H05K5/00 ,  H05K7/00

CPC classification number: H05K1/0284 ,  H01L23/10 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/19105 ,  H05K2201/0999 ,  H01L2924/00014

Abstract: A pre-molded cavity 3D packaging module with layout is disclosed. The 3D packaging module includes a pre-molded cavity. A wall and a vertical plane of the pre-molded cavity form an inclined angle of more than 3°. An intersecting region between a bottom and a sidewall of the 3D packaging module has a curved profile to facilitate smooth circuit layout.

Abstract translation: 公开了一种具有布局的预成型腔3D封装模块。 3D封装模块包括预模制腔。 预成型腔的壁和垂直面形成大于3°的倾斜角。 3D包装模块的底部和侧壁之间的相交区域具有弯曲轮廓以便于平滑的电路布局。

公开(公告)号：US08550837B2

公开(公告)日：2013-10-08

申请号：US13348916

申请日：2012-01-12

Applicant: Tetsuya Tagawa ,  Takeshi Hirakawa

Inventor： Tetsuya Tagawa ,  Takeshi Hirakawa

IPC: H01R4/50

CPC classification number: H01R12/714 ,  H01R12/7023 ,  H01R12/721 ,  H05K1/0284 ,  H05K2201/0999

Abstract: A configuration in which a stand-alone plug connector is directly fitted to the wall of a product case, and in the fitting state of the stand-alone plug connector, the contact part of a contact comes in contact with the contact part of a wiring pattern conductive path exposed on the surface of a fit connecting hole, and the electrical connection of a signal transmitting medium can be performed in a simple configuration.

Abstract translation: 其中将独立的插头连接器直接安装在产品外壳的壁上，并且在独立插头连接器的嵌合状态下，触点的接触部分与布线的接触部分接触 图案导电通路露出在配合连接孔的表面上，并且信号传输介质的电连接可以以简单的配置进行。

公开(公告)号：US20120235879A1

公开(公告)日：2012-09-20

申请号：US13265154

申请日：2010-04-14

Applicant: Andreas Eder ,  Wilfried Hedderich ,  Thomas Wagner ,  Mads Sager

Inventor： Andreas Eder ,  Wilfried Hedderich ,  Thomas Wagner ,  Mads Sager

IPC: H01Q1/12 ,  H01Q1/40

CPC classification number: H01Q1/40 ,  H01Q1/243 ,  H01Q1/38 ,  H05K2201/0999 ,  Y10T29/49016

Abstract: An antenna shape can be inked onto a thin film and then the thin film can be shaped to form a three dimensional (3D) flex-film. The 3D flex-film can then be integrated into a carrier using conventional molding processes. The resultant housing includes a carrier that supports the 3D flex-film on an inner or outer surface of the carrier. The resultant housing thus allows for improved integration of an antenna with a housing so as to provide a more desirable housing for devices that can benefit from the corresponding antenna, such as, but not limited to, mobile devices.

Abstract translation: 可以将天线形状印刷在薄膜上，然后可以将薄膜成形为形成三维（3D）柔性膜。 然后可以使用常规的成型工艺将3D柔性膜整合到载体中。 所得到的壳体包括在载体的内表面或外表面上支撑3D柔性膜的载体。 所得到的壳体因此允许改进天线与壳体的集成，以便为可以受益于相应天线（例如但不限于移动设备）的设备提供更期望的外壳。

公开(公告)号：US08165645B2

公开(公告)日：2012-04-24

申请号：US12332244

申请日：2008-12-10

Applicant: Byung Hwa Lee ,  Yong Won Yu ,  Hyun Sam Mun ,  Young Suk Kim

Inventor： Byung Hwa Lee ,  Yong Won Yu ,  Hyun Sam Mun ,  Young Suk Kim

IPC: H04M1/00

CPC classification number: H01Q1/243 ,  H05K1/0284 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/0999 ,  H05K2201/10242

Abstract: There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.

Abstract translation: 提供了一种移动通信终端壳体，包括：具有第一表面和与第一表面相对的第二表面的移动通信终端的壳体，以及穿过第一表面和第二表面形成的通孔; 设置在壳体的第一表面上的导电图案; 载体膜，设置在所述壳体的所述第一表面上以覆盖所述导电图案; 和导电环氧树脂填充通孔并且其一端与导电图案接触。

公开(公告)号：US20120060134A1

公开(公告)日：2012-03-08

申请号：US13094680

申请日：2011-04-26

Applicant: Akihisa Shimizu ,  Takahiro Sugai

Inventor： Akihisa Shimizu ,  Takahiro Sugai

IPC: G06F17/50

CPC classification number: H05K3/0005 ,  H05K1/0284 ,  H05K2201/0999

Abstract: According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.

Abstract translation: 根据一个实施例，布线设计支持装置包括显示器，绘图模块和数据创建模块。 显示器被配置为显示三维对象。 绘图模块被配置为绘制连接由显示器显示的三维对象的表面上的两个点的线。 数据创建模块被配置为基于由绘图模块画出的线来创建指示布线的第一三维数据。

公开(公告)号：US20120018186A1

公开(公告)日：2012-01-26

申请号：US13177199

申请日：2011-07-06

Applicant: Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

Inventor： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC: H05K5/02 ,  H01B13/00 ,  B32B37/00

CPC classification number: H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

Abstract: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

Abstract translation: 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US08081425B2

公开(公告)日：2011-12-20

申请号：US12232354

申请日：2008-09-16

Applicant: Hung-Hsiang Chen ,  Yang-Po Chiu

Inventor： Hung-Hsiang Chen ,  Yang-Po Chiu

IPC: H05K5/00 ,  H05K7/00

CPC classification number: H05K3/20 ,  B29C45/14639 ,  B29C45/14827 ,  B29L2031/3481 ,  H05K1/16 ,  H05K2201/09118 ,  H05K2201/0999

Abstract: A portable electronic device and a transferring method of a circuit element thereof are provided. The portable electronic device comprises a main body and a circuit element. The main body has a shell and a control element by a print way. The circuit element is integrated with the shell by transferring and is electrically connected with the control element.

Abstract translation: 提供了一种便携式电子设备及其电路元件的传送方法。 便携式电子装置包括主体和电路元件。 主体通过打印方式具有外壳和控制元件。 电路元件通过转移与壳体集成，并与控制元件电连接。