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    MIXER FABRICATION TECHNIQUE AND SYSTEM USING THE SAME
    22.
    发明申请
    MIXER FABRICATION TECHNIQUE AND SYSTEM USING THE SAME 有权
    混合器制造技术和使用它的系统

    公开(公告)号：US20140097882A1

    公开(公告)日：2014-04-10

    申请号：US14047551

    申请日：2013-10-07

    Applicant: Marki Microwave, Inc.

    Inventor： Christopher Ferenc Marki

    IPC: H03D7/02 ,  H05K3/30

    CPC classification number: H03D7/02 ,  H01P5/10 ,  H03D7/1408 ,  H03D7/1458 ,  H03D7/1466 ,  H03D2200/0023 ,  H03H1/00 ,  H05K1/0243 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/30 ,  H05K3/4605 ,  H05K2201/10174 ,  Y10T29/49128

    Abstract: An improved microwave mixer manufactured using multilayer processing includes an integrated circuit that is electrically connected to a top metal layer of a substrate. The microwave mixer includes: a first metal layer; a dielectric substrate on the first metal layer; a second metal layer directly on the substrate, at least two passive circuits arranged on the second metal layer and a top layer metal; a thin dielectric layer on the second metal layer, wherein the top layer metal is directly on the thin dielectric layer; an integrated circuit (IC) attached to the second metal layer, wherein the IC includes at least one combination of non-linear devices, and wherein the IC is directly connected to the passive circuits on the second metal layer; and a protection layer on the IC.

    Abstract translation: 使用多层处理制造的改进的微波混频器包括电连接到衬底的顶部金属层的集成电路。 微波混合器包括：第一金属层; 第一金属层上的电介质基板; 直接在所述基板上的第二金属层，布置在所述第二金属层上的至少两个无源电路和顶层金属; 在所述第二金属层上的薄介电层，其中所述顶层金属直接在所述薄介电层上; 连接到所述第二金属层的集成电路（IC），其中所述IC包括非线性器件的至少一个组合，并且其中所述IC直接连接到所述第二金属层上的无源电路; 和IC上的保护层。

    MULTI-LAYER SEMICONDUCTOR ELEMENT PACKAGE STRUCTURE WITH SURGE PROTECTION FUNCTION AND METHOD FOR MANUFACTURING THE SAME
    25.
    发明申请
    MULTI-LAYER SEMICONDUCTOR ELEMENT PACKAGE STRUCTURE WITH SURGE PROTECTION FUNCTION AND METHOD FOR MANUFACTURING THE SAME 有权
    具有防护功能的多层半导体元件封装结构及其制造方法

    公开(公告)号：US20110220402A1

    公开(公告)日：2011-09-15

    申请号：US12777596

    申请日：2010-05-11

    Applicant: Wei-Kuang FANG

    Inventor： Wei-Kuang FANG

    IPC: H05K1/16 ,  H05K3/00

    CPC classification number: H01L23/49805 ,  H01L23/62 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/0254 ,  H05K1/185 ,  H05K2201/0738 ,  H05K2201/09181 ,  H05K2201/10174 ,  H01L2924/00

    Abstract: A multi-layer semiconductor element package structure with surge protection function includes a substrate unit, an insulated unit, a one-way conduction unit and a protection unit. The substrate unit has at least one top substrate, at least one middle substrate and at least one bottom substrate. The insulated unit has at least one first insulated layer filled between the top substrate and the middle substrate and at least one second insulated layer filled between the middle substrate and the bottom substrate. The one-way conduction unit has a plurality of one-way conduction elements electrically disposed between the top substrate and the middle substrate and enclosed by the first insulated layer. The protection unit has at least one protection element with anti surge current or anti surge voltage function electrically disposed between the middle substrate and the bottom substrate and enclosed by the second insulated layer.

    Abstract translation: 具有浪涌保护功能的多层半导体元件封装结构包括基板单元，绝缘单元，单向导通单元和保护单元。 衬底单元具有至少一个顶部衬底，至少一个中间衬底和至少一个底部衬底。 绝缘单元具有填充在顶部基板和中间基板之间的至少一个第一绝缘层和填充在中间基板和底部基板之间的至少一个第二绝缘层。 单向导通单元具有电气设置在顶部基板和中间基板之间并被第一绝缘层包围的多个单向导电元件。 保护单元具有至少一个具有防浪涌电流或抗浪涌电压功能的保护元件，电气设置在中间基板和底部基板之间并由第二绝缘层包围。

    Multilayer composite body having an electronic function
    26.
    发明授权
    Multilayer composite body having an electronic function 失效
    具有电子功能的多层复合体

    公开(公告)号：US07812343B2

    公开(公告)日：2010-10-12

    申请号：US11911429

    申请日：2006-03-31

    Applicant: Andreas Ullmann ,  Alexander Knobloch ,  Merlin Welker ,  Walter Fix

    Inventor： Andreas Ullmann ,  Alexander Knobloch ,  Merlin Welker ,  Walter Fix

    IPC: H01L35/24

    CPC classification number: H05K1/16 ,  G06K19/07718 ,  G06K19/07749 ,  H01L27/283 ,  H01L27/285 ,  H05K1/0393 ,  H05K2201/10166 ,  H05K2201/10174

    Abstract: A multilayer composite body has an electronic function, in particular, an electronic subassembly comprising a plurality of organic electronic components, such as transistors, diodes, capacitors and so on, having at least one common layer, e.g., a semiconductor layer and/or insulation layer, wherein the common layer may be superfluous in one or more of the components. There thus is provided a structure of an entire subassembly such as an RFID tag, wherein the entire tag with all of its components is implemented in one production process.

    Abstract translation: 多层复合体具有电子功能，特别是包括多个有机电子部件（例如晶体管，二极管，电容器等）的电子组件，其具有至少一个公共层，例如半导体层和/或绝缘体 层，其中所述公共层在一个或多个部件中可能是多余的。 因此，提供了诸如RFID标签的整个子组件的结构，其中具有其所有部件的整个标签在一个生产过程中实现。

    Circuit board configuration
    27.
    发明授权
    Circuit board configuration 有权
    电路板配置

    公开(公告)号：US07672140B2

    公开(公告)日：2010-03-02

    申请号：US12009895

    申请日：2008-01-22

    Applicant: Bruce Lane

    Inventor： Bruce Lane

    IPC: H05K7/00

    CPC classification number: H05K1/184 ,  H05K3/34 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10643

    Abstract: A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace. The circuit board configuration may further comprise an encapsulant at least one end of the electronic component and a conductive material between the oblique sidewall and the electronic component to seal the electronic component inside the slot.

    Abstract translation: 一种电路板配置和方法，其以以电，电和机械方式支撑所述电子部件的方式包装嵌入到所述电路板中的电子部件，所述电子部件包括在所述第一表面上具有第一表面和电路迹线的电路板; 在由所述电路板的第一表面倾斜的至少一个侧壁限定的所述第一表面上形成的凹部或槽; 在所述至少一个倾斜侧壁上的两个或更多个电镀表面并电连接到所述电路迹线; 以及电子部件，其具有安装到所述两个或更多个电镀表面的两个或更多个电接触表面，使得所述电子部件物理地安装到所述倾斜侧壁并与所述电路迹线电连通。 电路板配置还可以包括密封剂电子部件的至少一个端部和在倾斜侧壁和电子部件之间的导电材料，以密封槽内的电子部件。

    Circuit board configuration
    28.
    发明申请
    Circuit board configuration 有权
    电路板配置

    公开(公告)号：US20090183905A1

    公开(公告)日：2009-07-23

    申请号：US12009895

    申请日：2008-01-22

    Applicant: Bruce Ray Lane

    Inventor： Bruce Ray Lane

    IPC: H05K1/18

    CPC classification number: H05K1/184 ,  H05K3/34 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10643

    Abstract: A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace. The circuit board configuration may further comprise an encapsulant at least one end of the electronic component and a conductive material between the oblique sidewall and the electronic component to seal the electronic component inside the slot.

    Abstract translation: 一种电路板配置和方法，其以以电，电和机械方式支撑所述电子部件的方式包装嵌入到所述电路板中的电子部件，所述电子部件包括在所述第一表面上具有第一表面和电路迹线的电路板; 在由所述电路板的第一表面倾斜的至少一个侧壁限定的所述第一表面上形成的凹部或槽; 在所述至少一个倾斜侧壁上的两个或更多个电镀表面并电连接到所述电路迹线; 以及电子部件，其具有安装到所述两个或更多个电镀表面的两个或更多个电接触表面，使得所述电子部件物理地安装到所述倾斜侧壁并与所述电路迹线电连通。 电路板配置还可以包括密封剂电子部件的至少一个端部和在倾斜侧壁和电子部件之间的导电材料，以密封槽内的电子部件。

    SURGE PROTECTION CIRCUIT FOR PASSING DC AND RF SIGNALS
    29.
    发明申请
    SURGE PROTECTION CIRCUIT FOR PASSING DC AND RF SIGNALS 有权
    用于通过直流和射频信号的防护电路

    公开(公告)号：US20090109584A1

    公开(公告)日：2009-04-30

    申请号：US12262107

    申请日：2008-10-30

    Applicant: Jonathan L. Jones ,  Chris Penwell

    Inventor： Jonathan L. Jones ,  Chris Penwell

    IPC: H02H9/04

    CPC classification number: H01P1/203 ,  H05K1/0237 ,  H05K1/0257 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10174

    Abstract: A surge protection circuit may include a tuned circuit board with traces designed to provide a surge protected and RF isolated DC path while propagating RF signals through the PCB dielectric with microstrip lines. The surge protection circuit utilizes high impedance RF decoupling devices such as quarterwave traces or inductors which isolate the multistage DC protection scheme which may include a gas discharge tube, serial surge impeding devices such as inductors and/or resistors, a decoupled air/spark gap device and a Zener diode junction.

    Abstract translation: 浪涌保护电路可以包括调谐电路板，其具有设计成在通过具有微带线的PCB电介质传播RF信号的同时提供浪涌保护和RF隔离DC路径的迹线。 浪涌保护电路使用诸如四分之一波导或电感器的高阻抗RF去耦装置，其隔离多级DC保护方案，其可以包括气体放电管，串联浪涌阻止装置，例如电感器和/或电阻器，去耦空气/火花隙装置 和齐纳二极管结。

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