公开(公告)号：US06621007B2

公开(公告)日：2003-09-16

申请号：US10047429

申请日：2002-01-15

Applicant: Wolfgang Diegmann ,  Ruediger Tiedeck ,  Frank H. Adam

Inventor： Wolfgang Diegmann ,  Ruediger Tiedeck ,  Frank H. Adam

IPC: H01B708

CPC classification number: H05K3/0058 ,  B60R16/0207 ,  H01B7/40 ,  H05K1/0393 ,  H05K2201/209

Abstract: The invention relates to an electrical conductor having a flat cross-section which has an electrically conducting material which is embedded in an electrically insulating material provided with hooks or loops.

公开(公告)号：US06618941B2

公开(公告)日：2003-09-16

申请号：US09928633

申请日：2001-08-13

Applicant: Jeffrey S. Campbell ,  William T. Wike

Inventor： Jeffrey S. Campbell ,  William T. Wike

IPC: H05K302

CPC classification number: H01R13/2414 ,  F28F2215/10 ,  F28F2245/06 ,  H01L23/3733 ,  H01L23/49811 ,  H01L2224/29499 ,  H01L2924/0002 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/10977 ,  H05K2201/209 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10S117/903 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A technique for making acicular, branched, conductive dendrites, and a technique for using the dendrites to form a conductive compressible pad-on-pad connector are provided. To form the dendrites, a substrate is provided on which dendrites are grown, preferably on a metal film. The dendrites are then removed from the substrate, preferably by etching metal from the substrate. The so formed dendrites are incorporated into a compressible dielectric material, which then forms a compressible pad-on-pad connector between two conducting elements, such as connector pads on electrical devices, e.g. an I/C chip mounted on a substrate, such as a chip carrier.

Abstract translation: 提供了一种用于制造针状，分枝，导电树突的技术，以及使用树突形成导电可压缩垫片连接器的技术。 为了形成枝晶，提供在其上生长树突的基底，优选在金属膜上。 然后，优选通过从衬底中蚀刻金属，从树脂上除去树突。 如此形成的树突被并入到可压缩电介质材料中，其然后在两个导电元件之间形成可压缩垫片连接器，例如电气设备上的连接器焊盘，例如电连接器。 安装在诸如芯片载体的基板上的I / C芯片。

公开(公告)号：US20020080590A1

公开(公告)日：2002-06-27

申请号：US10025716

申请日：2001-12-18

Applicant: Murr-Elektronik Gesellschaft mit beschrankter

Inventor： Ralf Bauermeister

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H05K3/403 ,  H05K1/142 ,  H05K2201/09172 ,  H05K2201/209

Abstract: A printed circuit board arrangement for printed circuits with electronic components has a first board having a first electric partial circuit and having a first edge formed as a first contact comb with successively arranged first projections and first cutouts. A second board having a second electric partial circuit and having a second edge formed as a second contact comb with successively arranged second projections and second cutouts is provided, wherein the second contact comb is configured to be complementary to the first contact comb. The first and second boards are combined to form a complete circuit with the first and second boards substantially positioned in a common plane. The first projections engage captively the second cutouts, and the second projections engage captively the first cutouts.

Abstract translation: 具有电子部件的印刷电路用印刷电路板装置具有第一板，其具有第一电气部分电路，并且具有形成为具有连续布置的第一突起和第一切口的第一接触梳的第一边缘。 提供了具有第二电气部分电路并且具有形成为具有连续布置的第二突起和第二切口的第二接触梳的第二边缘的第二板，其中所述第二接触梳被配置为与所述第一接触梳互补。 第一和第二板被组合以形成完整的电路，其中第一和第二板基本上位于公共平面中。 第一个突出部分固定在第二个切口处，第二个突出部分固定地插入第一个切口。

公开(公告)号：US20020076948A1

公开(公告)日：2002-06-20

申请号：US09981480

申请日：2001-10-16

Inventor： Brian Farrell ,  Patricia Wilson Nguyen ,  Justyna Teverovsky ,  Jeremiah Slade ,  Mara Powell

IPC: H01L021/00 ,  A41B001/00 ,  A41D001/00

CPC classification number: H05K3/0058 ,  A41D1/002 ,  B32B3/08 ,  B32B5/02 ,  B32B7/04 ,  G06F19/00 ,  H05K1/038 ,  H05K1/189 ,  H05K3/386 ,  H05K2201/029 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0285 ,  H05K2203/065 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T428/24917

Abstract: A method of manufacturing a fabric article to include electronic circuitry in which a flex circuit is assembled to include conductive traces and pads on a flexible substrate, a fabric article is placed on a rigid surface, and the substrate of the flex circuit is secured to the fabric article. Also disclosed is a fabric article which includes electronic circuitry and an electrically active textile article.

Abstract translation: 一种制造织物制品的方法，包括电子电路，其中柔性电路被组装以在柔性基底上包括导电迹线和焊盘，将织物制品放置在刚性表面上，并且柔性电路的基底固定到 面料文章。 还公开了一种织物制品，其包括电子电路和电活性织物制品。

公开(公告)号：US5136470A

公开(公告)日：1992-08-04

申请号：US546329

申请日：1990-06-29

Applicant: Timothy M. Sheridon ,  Stanley R. Ulfeldt

Inventor： Timothy M. Sheridon ,  Stanley R. Ulfeldt

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K7/14

CPC classification number: H05K3/0061 ,  H05K1/0271 ,  H05K7/1461 ,  H05K1/18 ,  H05K2201/0133 ,  H05K2201/10598 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2201/209 ,  H05K3/3447

Abstract: A stiffener in the form of a metal-cored stiffener plate is temporarily secured to the underside of a printed circuit (PC) board having a series of integrated circuit (IC) chips and other electronic components and metallization interconnect traces on the upper or top surface of the board. Securing of the stiffening plate and PC board is provided by segments of a hook/mushrooms-containing flexible tape adhered to the PC board underside by suitable adhesive. A complementary sheet of a hooks-containing flexible material is adhered to the stiffening plate such that upon pressing of the complementary material and segments together the respective hooks and loops interlock binding the PC board assembly and stiffening plate assembly together. The securement can be easily undone by grasping and levering the edge of the stiffening plate from the PC board and breaking the interlock of the hooks and loops. The hooks and loops may be reversed on the stiffener plate and on the solder-side of the PC board. They may be the well-known complementary Velcro.RTM. materials.

Abstract translation: 金属芯加强板形式的加强件临时固定在具有一系列集成电路（IC）芯片的印刷电路板（PC）板的下侧，并且在上表面或上表面上具有其它电子部件和金属化互连迹线 的董事会。 加强板和PC板的固定由通过合适的粘合剂粘附到PC板下面的钩/蘑菇的柔性带的部分提供。 互补的含钩的柔性材料片被粘附到加强板上，使得在将互补材料和节段压在一起时，相应的钩和环将PC板组件和加强板组件互锁地结合在一起。 通过从PC板抓住并拉紧加强板的边缘并破坏钩和环的互锁，可以容易地松开固定。 钩子和环可以在加强板和PC板的焊接侧反转。 它们可能是众所周知的互补Velcro TM材料。

公开(公告)号：US4981336A

公开(公告)日：1991-01-01

申请号：US388819

申请日：1989-08-03

Applicant: Paul Mohan

Inventor： Paul Mohan

IPC: G02B6/38 ,  H01R13/28 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/325 ,  G02B6/3833 ,  G02B6/3873 ,  G02B6/3885 ,  G02B6/389 ,  H01R13/28 ,  H01H2001/125 ,  H05K2201/1034 ,  H05K2201/209 ,  H05K3/361

Abstract: The present invention comprises apparatus for connecting and disconnecting substantially planar arrays of optoelectrical contact sites in a mechanically secure and functionally rapid and reversible manner. The invention utilizes technology available in the zipper manufacturing industry, to achieve a high contact site density by suitably disposed contact sites for opotoelectronic connections on zipper teeth, and through the use of a conventional zipper-type runner achieving the interconnection of a multiplicity of optoelectrical contact sites.

Abstract translation: 本发明包括用于以机械安全和功能上快速且可逆的方式连接和断开基本平坦的光电接触位置阵列的装置。 本发明利用拉链制造业中可利用的技术，通过适当设置的拉链齿上的光电连接接触部位，以及通过使用常规的拉链型流道实现多个光电接触的互连来实现高接触部位密度 网站。

公开(公告)号：US09825014B2

公开(公告)日：2017-11-21

申请号：US15226209

申请日：2016-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo Cha ,  Yong Ii Kim ,  Wan tae Lim

IPC: H01L33/60 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H05K1/00 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

公开(公告)号：US09084362B2

公开(公告)日：2015-07-14

申请号：US13736086

申请日：2013-01-08

Applicant: NVIDIA Corporation

Inventor： Shuang Xu

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K1/142 ,  H05K3/36 ,  H05K3/42 ,  H05K2201/09145 ,  H05K2201/09618 ,  H05K2201/209 ,  H05K2203/044 ,  Y10T29/49126

Abstract: Disclosed are a method and system to reduce impedance of printed circuit boards through an interconnecting of printed circuit boards using a square wave pattern of plated-through holes. A method of connecting a first printed circuit board to a second printed circuit board comprises forming a square wave pattern of the first printed circuit board and the second printed circuit board and adjoining the first printed circuit board and the second printed circuit board. The method also involves producing plated-through holes along the square wave pattern, a top section, and/or a bottom section of the adjoined first printed circuit board and second printed circuit board. The method further involves securing the top section and the bottom section using a first metal clip and a second metal clip, respectively, and connecting the first printed circuit board to the second printed circuit board by a wave soldering process.

Abstract translation: 公开了通过使用电镀通孔的方波图案的印刷电路板的互连来减少印刷电路板的阻抗的方法和系统。 将第一印刷电路板连接到第二印刷电路板的方法包括形成第一印刷电路板和第二印刷电路板的方波图案，并且邻接第一印刷电路板和第二印刷电路板。 该方法还涉及沿邻接的第一印刷电路板和第二印刷电路板的方波图形，顶部部分和/或底部部分产生电镀通孔。 该方法还包括分别使用第一金属夹和第二金属夹固定顶部部分和底部部分，并通过波峰焊接工艺将第一印刷电路板连接到第二印刷电路板。

公开(公告)号：US09072173B2

公开(公告)日：2015-06-30

申请号：US14140456

申请日：2013-12-24

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Ning Hou

IPC: H05K1/00 ,  H05K3/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/0097 ,  H05K3/368 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09145 ,  H05K2201/209 ,  H05K2203/1461 ,  Y10T29/49155

Abstract: An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.

Abstract translation: RFPCB包括加强层和至少两个拼接在一起以在形状和尺寸上匹配加强层的FPCB。 FPCB粘附到加强层上。 加强层包括与FPCB连接并且去除部分以获得期望的柔性的电路。

公开(公告)号：US20150043188A1

公开(公告)日：2015-02-12

申请号：US14452640

申请日：2014-08-06

Applicant: SMR Patents S.A.R.L.

Inventor： Andreas Herrmann

IPC: H05K1/14 ,  H05K3/10 ,  B60R1/12

CPC classification number: H05K1/142 ,  B60R1/12 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/105 ,  H05K2201/0187 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/209 ,  H05K2203/107 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K2203/168 ,  Y10T29/49126

Abstract: The invention relates to a method for manufacturing a printed circuit board (10) having a substrate (2) and an electric circuit (8), in particular for a rear view device of a motor vehicle, the method comprising the following steps: manufacturing a plurality of substrate parts (2a, 2b); and selecting at least two of the substrate parts (2a, 2b), and connecting the selected substrate parts (2a, 2b) and providing the connected substrate parts (2a, 2b) with the circuit (8).

Abstract translation: 本发明涉及一种用于制造具有基板（2）和电路（8）的印刷电路板（10）的方法，特别是用于机动车辆的后视装置，该方法包括以下步骤： 多个基板部件（2a，2b）; 以及选择所述基板部分（2a，2b）中的至少两个，并且连接所选择的基板部分（2a，2b）并且将所连接的基板部分（2a，2b）提供给所述电路（8）。