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31.发明授权公开(公告)号：US09204561B2
公开(公告)日：2015-12-01
申请号：US14307652
申请日：2014-06-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
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32.发明申请公开(公告)号：US20150270593A1
公开(公告)日：2015-09-24
申请号：US14637898
申请日：2015-03-04
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , GWUN-JIN LIN , KUO-FU SU
CPC classification number: H01P1/227 , H03H7/38 , H05K1/0225 , H05K1/0251 , H05K1/116 , H05K1/189 , H05K3/3447 , H05K2201/0715 , H05K2201/093 , H05K2201/09381 , H05K2201/0939 , H05K2201/09718 , H05K2201/10931
Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.
Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。
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33.发明授权公开(公告)号：US09041482B2
公开(公告)日：2015-05-26
申请号：US14108838
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H01P1/22 , H01P1/227 , H01P3/026 , H03H7/38 , H05K1/00 , H05K1/0242 , H05K1/025 , H05K1/0393 , H05K2201/0969 , H05K2201/09827
Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.
Abstract translation: 柔性电路板的高频信号传输线的衰减减小控制结构包括形成在基板的表面上的阻抗控制层。 阻抗控制层包括沿着衬底的高频信号传输线的延伸方向布置的衰减减小图案，并且对应于高频信号传输线的底角结构，以便改善高频信号传输线的衰减， 频率信号通过高频信号传输线路传输。 基板的相对表面包括形成在其上的导电屏蔽层。 导电屏蔽层形成有对应于高频信号传输线的顶角结构的衰减减小图案。
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公开(公告)号：US20150114713A1
公开(公告)日：2015-04-30
申请号：US14198819
申请日：2014-03-06
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU
CPC classification number: H01B7/2825 , H01B3/28 , H01B3/30 , H01B3/308 , H01B3/46 , H05K3/28 , H05K2203/1147
Abstract: Disclosed is a lateral edge water-resistance structure for a flexible circuit cable. The flexible circuit cable includes a water resistant section formed thereon. The flexible circuit cable has two lateral edges in the water resistant section and a roughness structure is formed in at least one of the lateral edges or in both lateral edges of the flexible circuit cable. A water-resistance module is molded to cover the water resistant section and the roughness structure of the flexible circuit cable. With the arrangement of the water-resistance module and the roughness structure, the flexible circuit cable is provide with a water resistant effect for the lateral edge.
Abstract translation: 公开了一种用于柔性电路电缆的侧边防水结构。 柔性电路电缆包括形成在其上的防水部分。 柔性电路电缆在防水部分中具有两个侧边缘，并且粗糙结构形成在柔性电路电缆的至少一个横向边缘或两个侧边缘中。 模制防水模块以覆盖柔性电路电缆的防水部分和粗糙结构。 通过防水模块和粗糙结构的布置，柔性电路电缆为侧边缘提供防水效果。
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35.发明申请METHOD AND STRUCTURE OF PENETRATION AND COMBINATION FOR FLEXIBLE CIRCUIT BOARD WITH HINGE ASSEMBLY 有权柔性电路板与铰链组合的渗透和组合方法与结构公开(公告)号：US20150017818A1
公开(公告)日：2015-01-15
申请号：US14090157
申请日：2013-11-26
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU , CHIH-HENG CHUO
IPC: H01R12/77
CPC classification number: H05K1/028 , B29C53/04 , H05K2201/051 , H05K2201/056 , H05K2201/057 , H05K2201/09063 , H05K2203/0195 , Y10T29/49826
Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.
Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组合的方法和结构。 通过将预折线作为中心线来处理预成形的柔性电路板，以将柔性电路板的连接部分朝向端子分配部分折叠。 然后，将连接部朝向端子分配部的方向卷绕，以使连接部形成卷边体。 然后将卷绕的物体穿过铰链组件的孔，以使轧制体完全延伸穿过铰链组件的孔，使得柔性电路板的延伸部分定位在铰链组件的孔中，并且第一端 并且第二端分别位于铰链组件的孔的相对侧。
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Patent Agency Ranking
公开(公告)号：US20140057482A1
公开(公告)日：2014-02-27
申请号：US13649184
申请日：2012-10-11
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN , CHIH-HENG CHUO
IPC: H01R12/62
CPC classification number: H01R4/024 , H01R12/594 , H01R12/65 , H01R12/79
Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.
Abstract translation: 用于柔性电路电缆的连接结构包括柔性电路电缆，该柔性电路电缆具有柔性电路基板，该电路基板的第一端与连接器外壳的焊台相连接，该第一端分别对应于电缆的柔性电路电缆的导线的第一指垫导电触点 连接器的金属导电端子的焊接部分。 在每个导电线的第一指垫导电接触件的金属涂层和相应的金属导电端子的电缆焊接部分之间形成焊接层，以将柔性电路电缆的导线设置成与金属电连接 连接器的导电端子。
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公开(公告)号：US20130020122A1
公开(公告)日：2013-01-24
申请号：US13629859
申请日：2012-09-28
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN , CHIH-HENG CHUO
CPC classification number: H02G3/0481 , H05K9/0098
Abstract: A cable bundling structure is provided for being set in slidable engagement with a target cable. The cable bundling structure includes a helical wrap member, which wraps around a wrapped section of the target cable. The helical wrap member is selectively composed of one or more sections of wrapping turns and each section is made in a one-piece form having a predetermined wrap width, a predetermined helix angle, and a predetermined wrap diameter and extending a predetermined length in a wrapping direction. The helical wrap member helically wraps around the target cable in such a way that the helical wrap member is in slidable engagement with the target cable and serves as an external protection for the cable. The helical wrap member can be made of an insulation material or an electromagnetic shielding material, whereby besides structural protection of the cable for improving resistance against bending, the external protection formed by the helical wrap member also provides protection against electromagnetic interference (EMI).
Abstract translation: 电缆捆绑结构被设置成与目标电缆滑动接合。 电缆捆扎结构包括螺旋状卷绕部件，该螺旋卷绕部件卷绕目标缆线的包裹部分。 螺旋卷绕构件选择性地由一个或多个包裹圈的部分组成，并且每个部分制成具有预定卷绕宽度，预定螺旋角和预定卷绕直径并且在包装中延伸预定长度的单件形式 方向。 螺旋卷绕构件以目标电缆可滑动地接合并且用作电缆的外部保护的方式螺旋地卷绕目标电缆。 螺旋卷绕构件可以由绝缘材料或电磁屏蔽材料制成，除了用于提高抗弯曲性能的电缆的结构保护之外，由螺旋卷绕构件形成的外部保护也提供了抵抗电磁干扰（EMI）的保护。
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公开(公告)号：US10080277B1
公开(公告)日：2018-09-18
申请号：US15920915
申请日：2018-03-14
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
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公开(公告)号：US09942984B1
公开(公告)日：2018-04-10
申请号：US15664031
申请日：2017-07-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/09 , H05K1/0219 , H05K1/0245 , H05K1/028 , H05K1/0393 , H05K9/0084 , H05K2201/0715 , H05K2201/0723
Abstract: A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
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40.发明授权公开(公告)号：US09398692B2
公开(公告)日：2016-07-19
申请号：US14446605
申请日：2014-07-30
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/118 , H05K1/0215 , H05K1/113 , H05K1/144 , H05K2201/058
Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.
Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。
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