公开(公告)号：US20120126401A1

公开(公告)日：2012-05-24

申请号：US13267946

申请日：2011-10-07

Applicant: Charles W.C. LIN ,  Chia-Chung Wang

Inventor： Charles W.C. LIN ,  Chia-Chung Wang

IPC: H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/186 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

Abstract translation: 可堆叠的半导体组件包括半导体器件，散热器，粘合剂，端子，电镀通孔和积聚电路。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路为半导体器件提供信号路由。 电镀通孔在积聚电路和终端之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US20120091493A1

公开(公告)日：2012-04-19

申请号：US13337054

申请日：2011-12-24

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/60 ,  H01L33/64

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and dual adhesives. The heat spreader includes a bump, a base and a ledge. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump in a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The bump extends into an opening in the first adhesive and is aligned with and spaced from an opening in the second adhesive. The base and the ledge extend laterally from the bump. The first adhesive is sandwiched between the base and the ledge, the second adhesive is sandwiched between the conductive trace and the ledge and the ledge is sandwiched between the adhesives. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和双重粘合剂。 散热器包括凸块，底座和凸缘。 导电迹线包括焊盘和端子。 半导体器件安装在凸块中的凸起中的凸起中，电连接到导电迹线并且热连接到散热器。 凸块延伸到第一粘合剂中的开口中并且与第二粘合剂中的开口对准并与之隔开。 底座和凸缘从凸块横向延伸。 第一粘合剂被夹在基部和凸缘之间，第二粘合剂夹在导电迹线和凸缘之间，并且凸缘夹在粘合剂之间。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US20120064672A1

公开(公告)日：2012-03-15

申请号：US13300657

申请日：2011-11-21

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/50

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱穿过粘合剂中的开口，将基底安装在粘合剂上，包括将柱插入基底中的孔中， 然后在孔中的柱和基底之间流动粘合剂，固化粘合剂，然后研磨柱和粘合剂，然后将半导体器件安装在包括柱和基座的散热器上，将半导体器件电连接到 衬底并将半导体器件热连接到散热器上。

公开(公告)号：US20110287563A1

公开(公告)日：2011-11-24

申请号：US13194909

申请日：2011-07-30

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/62 ,  H01L21/58

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer and the dielectric base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal and selected portions of the conductive layers, wherein the pad extends beyond the dielectric base in the first vertical direction and the terminal extends beyond the dielectric base in the second vertical direction, providing a heat spreader that includes the posts and the dielectric base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供第一和第二柱，第一和第二粘合剂，第一和第二导电层和电介质基底，其中第一柱从第一垂直方向的电介质基底延伸到第一和第二导电层中的第一开口 第一粘合剂并且与第一导电层中的第一孔对准，第二柱在第二垂直方向上从电介质基底延伸到第二粘合剂中的第二开口中，并且与第二导电层中的第二孔对准， 电介质基底夹持在支柱之间并从支柱横向延伸，然后在第一垂直方向上流动第一粘合剂并使第二粘合剂沿第二垂直方向流动，固化粘合剂，然后提供包括垫，端子和选定的导电迹线 导电层的部分，其中焊盘在第一垂直方向a延伸超过电介质基底 并且端子在第二垂直方向上延伸超过电介质基底，提供包括柱和电介质基底的散热器，然后将半导体器件安装在第一柱上，将半导体器件电连接到导电迹线并热连接 半导体器件到散热器。

公开(公告)号：US20110163348A1

公开(公告)日：2011-07-07

申请号：US13050934

申请日：2011-03-18

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/64

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump and a base. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump opposite a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive and the base extends laterally from the bump. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括凸块和底座。 导电迹线包括焊盘和端子。 半导体器件安装在与凸块中的空腔相对的凸块上，电连接到导电迹线并且热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，并且基部从凸起横向延伸。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US20110156090A1

公开(公告)日：2011-06-30

申请号：US13030136

申请日：2011-02-18

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20105 ,  H01L2933/0033 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和基部。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的基部延伸到第一粘合剂中的第一开口中，并且位于第二柱的周边内，第二柱在第二垂直方向上从基部延伸到第二开口中的第二开口中 粘合剂并且基部夹在柱之间并从支柱横向延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20110079811A1

公开(公告)日：2011-04-07

申请号：US12950999

申请日：2010-11-20

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/56 ,  H01L33/64

CPC classification number: H01L33/642 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump that includes first, second and third bent corners that shape a cavity. The conductive trace includes a pad and a terminal. The semiconductor device is located within the cavity, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends into an opening in the adhesive and provides a recessed die paddle and a reflector for the semiconductor device. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括凸起，该凸起包括形成空腔的第一，第二和第三弯曲角。 导电迹线包括焊盘和端子。 半导体器件位于腔内，电连接到导电迹线并热连接到凸块。 凸块延伸到粘合剂中的开口中，并提供用于半导体器件的凹陷模板和反射器。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20110065241A1

公开(公告)日：2011-03-17

申请号：US12951066

申请日：2010-11-22

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L23/00

CPC classification number: H01L33/642 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of making a semiconductor chip assembly includes providing a bump and a ledge, wherein the bump includes first, second and third bent corners that shape a cavity, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the ledge, providing a heat spreader that includes the bump, then mounting a semiconductor device on the bump within the cavity, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供凸块和凸缘，其中所述凸块包括形成空腔的第一，第二和第三弯曲角，将粘合剂安装在凸缘上，包括将凸块插入粘合剂中的开口中，安装 所述粘合剂上的导电层包括将所述凸起与所述导电层中的孔对准，然后使所述粘合剂在所述凸块和所述导电层之间流动，固化所述粘合剂，然后提供包括焊盘，端子和选定部分的导电迹线 提供包括凸起的散热器，然后将半导体器件安装在空腔内的凸块上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器上。

公开(公告)号：US20110039374A1

公开(公告)日：2011-02-17

申请号：US12913762

申请日：2010-10-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/60

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01087 ,  H01L2924/15153 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00014

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括凸块，底座和凸缘。 导电迹线包括焊盘和端子。 半导体器件延伸到凸块中的空腔中，电连接到导电迹线并且热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US20100327310A1

公开(公告)日：2010-12-30

申请号：US12876106

申请日：2010-09-04

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the flange, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the flange extends upwardly from the post in the opening and extends laterally above the adhesive, the cavity extends into the opening and the base extends laterally from the post. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括柱，基座和凸缘。 导电迹线包括焊盘和端子。 半导体器件延伸到法兰中的空腔中，电连接到导电迹线并与散热器热连接。 柱从基部向上延伸到粘合剂中的开口中，凸缘从开口中的柱向上延伸并且在粘合剂的上方横向延伸，空腔延伸到开口中，并且基部从柱横向延伸。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。