Abstract:
A bus transceiver in a first signal processing circuit is connected to one end of a first bus connecting line for transferring a data pulse signal. A bus transceiver in a second signal processing circuit is connected to one end of a second bus connecting line for transferring a data pulse signal. Connected to the other end of the first bus connecting line is a first termination resistor. Connected to the other end of the second bus connecting line is a second termination resistor. In a portion of a predetermined length (parallel coupling portion) in the first and second bus connecting lines, the interval between the first and second bus connecting lines is held substantially constant so as to produce capacitive and inductive coupling between both the bus connecting lines. Each of the first and second bus transceivers includes a bus driver and a bus receiver. The bus receiver in the first bus transceiver generates a pulse signal substantially equal to an output pulse signal which was generated from the bus driver in the second bus transceiver, based on a pulse waveform induced in the parallel coupling portion on the first bus connecting line by the output pulse signal from the second bus transceiver.
Abstract:
A simulation apparatus includes a discrete events simulation section to perform a discrete type simulation of components of a configured model as defined based on attribute information that is information on parts of the components of the defined configured model and connection information showing a connectional relationship among the components of the defined configured model; and a soft error rate computation processing section to compute a soft error rate of the defined configured model based on the simulation result of the discrete events simulation section and data on soft error rates in the attribute information.
Abstract:
Means for decreasing parasitic inductance by a realistic mounting method is provided. On a surface layer of a semiconductor package, there is provided a ground pad having a plurality of comb-tooth-shaped ground pads which are connecting points for wire bonding and are protruded on the surface layer of the semiconductor package. A power-supply pad is arranged between the comb-tooth-shaped ground pads. Two long and short ground wires are arranged in one comb-tooth-shaped ground pad. Also, two long and short power-supply wires are arranged in one power-supply pad. By arranging the long ground wire and the long power-supply wire so as to be parallel and close to each other and arranging the short power-supply wire and the short ground wire so as to be parallel and close to each other, the parasitic inductance is decreased.
Abstract:
In each of the information processing apparatuses connected to each other via a network, there is arranged a quality of service (QOS) table to which functions and performance thereof are registered. When an information processing apparatus is additionally linked with the network, a QOS table thereof is automatically registered to a local directory of the network such that an agent converts the contents of the QOS table into service information to be supplied via a user interface to the user. Thanks to the operation, information of functions and performance of each information processing apparatus connected to the network is converted into service information for the user. Consequently, the user can much more directly receive necessary services.
Abstract:
In a prior art, there has been a method in which a power supply line of an output buffer and that of a control circuit are independently provided so that the power supply noise occurring in the control circuit will not affect the output buffer. However, this method has had the problems that it increases both the number of power supply/grounding pins and power feed line inductance.The present invention provides a technique which, without causing the above two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.
Abstract:
A clock is located at a position close to a plurality of memory modules connected to a memory controller and located away from the controller, and wiring is carried out so that read access is preferential for transmission of read data. With respect to write data, a delay amount corresponding to a round-trip propagation delay time to each of the modules is measured and writing of the write data is carried out while maintaining a known time relationship between the clock and data. To measure round-trip reflection, lines are wired between the modules and a location detection circuit in a 1:1 relationship, and the circuit measures a time taken from a signal output time of a driver having the same impedance as that of the wired lines to a reflected-wave reception time of a hysteresis receiver.
Abstract:
The present invention provides a technique which, without causing two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.
Abstract:
A printed circuit board with reduced noise effects and without the need to increase the distance between a noise source and a wireless communication board. The circuit board includes multilayer structural conductive layers having a first conductive plane connected to power supply potential and a second conductive plane connected to ground potential. The first and second conductive planes are formed such that an electric field generated by a potential difference between the first conductive plane and the second conductive plane is concentrated on one side of one of the first conductive plane and the second conductive plane. The conductive plane associated with the concentrated electric field and the wireless communication board are on different sides relative to the conductive plane that is not associated with the concentrated electric field.
Abstract:
A bus system for carrying out data transfer between one bus master and a plurality of bus slaves. The bus system includes plural directional couplers which are formed by arranging respective parts of lines drawn from the bus slaves, without being in contact with, in the neighborhood of, and in parallel with a line drawn from the bus master. The line drawn from the bus master to a terminating resistance is wired to be folded. The directional couplers are further formed by arranging parts of the lines drawn from the bus slaves alternatively with respect to a first line part of the line drawn from the bus master ranging from the bus master to a fold of the line drawn from the bus master and with respect to a second line part of the line drawn from the bus master ranging from the fold to the terminating resistance.
Abstract:
A fast transfer bus system capable of fast data transfer with no reflection at branch points. Four LSIs having constant-impedance interfaces are connected via two variable resistors each having three signal terminals. A variable impedance LSI is connected between these variable resistors. When the LSIs connected to the variable resistor do not work as a bus driver, three variable resistance elements in each variable resistor are set to have a value of ⅓ of the characteristic impedance Zo of connection lines, and are connected in a Y-letter shape. When one of LSIs connected to the variable resistor works as a bus driver, the values of the variable resistance elements are set to low impedance or Zo.