公开(公告)号：US20050098710A1

公开(公告)日：2005-05-12

申请号：US10705378

申请日：2003-11-10

Applicant: Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

Inventor： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC: H01L27/00 ,  H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00

Abstract: The invention provides an image sensor package including a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate includes plural metal sheets, which are spaced apart and arranged in an alternating manner, each of the metal sheets have a first board and a second board positioned at different heights, the thicken of outside ends of the first board are smaller than the inside ends of the first board, a encapsulate layer encapsulated the plural metal sheets to form a upper surface and a lower surface, so that the outside ends of the first board and the second board are exposed from the encapsulate layer. The frame layer is formed around and under the substrate to form a cavity with the substrate. The photosensitive chip is positioned on upper surface of the substrate and within the cavity. The wires are electrically connecting the outside ends of the first boards to the photosensitive chip. The transparent layer placed on the frame layer to cover the photosensitive chip.

Abstract translation: 本发明提供一种图像传感器封装，其包括基板，框架层，感光芯片，多根导线和透明层。 该基板包括间隔开并交替排列的多个金属片，每个金属片具有位于不同高度的第一板和第二板，第一板的外侧端部的加厚度小于内侧 第一板的端部，封装层封装多个金属板以形成上表面和下表面，使得第一板和第二板的外端从封装层露出。 框架层形成在基底周围和下方，以与衬底形成空腔。 光敏芯片位于基板的上表面和腔内。 导线将第一板的外端电连接到感光芯片。 透明层放置在框架层上以覆盖感光芯片。

公开(公告)号：US06878917B2

公开(公告)日：2005-04-12

申请号：US10321926

申请日：2002-12-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Worrell Tsai

Inventor： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Worrell Tsai

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

Abstract translation: 注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。 每个金属片具有第一板，第二板和第三板以形成形结构。 模制结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。 注塑结构具有U形结构并且形成有空腔。 第一板被第一成型体部分封装。 第二和第三板从第一成型体的底表面和侧表面露出。 芯片安装在腔内。 焊盘形成在芯片上。 电线将焊盘电连接到第一板的输入端。 透明层覆盖第一成型体上以封装芯片。

公开(公告)号：US20050012170A1

公开(公告)日：2005-01-20

申请号：US10621992

申请日：2003-07-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

Inventor： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut-corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

公开(公告)号：US06649834B1

公开(公告)日：2003-11-18

申请号：US10321917

申请日：2002-12-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Kevin Chang

Inventor： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Kevin Chang

IPC: H01L2302

CPC classification number: H01L31/0203 ,  H01L23/057 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

Abstract translation: 注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。 每个金属片具有第一板，第二板和第三板以形成形结构。 注塑结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。 注塑结构具有U形结构并且形成有空腔。 第一，第二和第三板从第一成型体的顶部，底部和侧面露出。 感光芯片安装在腔内。 接合焊盘形成在感光芯片上。 导线将接合焊盘电连接到第一板的信号输入端子。 透明层覆盖在第一成型体上以封装感光芯片。

公开(公告)号：US06638097B2

公开(公告)日：2003-10-28

申请号：US10147108

申请日：2002-05-15

Applicant: Jichen Wu ,  Burton Yang

Inventor： Jichen Wu ,  Burton Yang

IPC: H01R1300

CPC classification number: H01R11/18 ,  H01R2201/20

Abstract: A probe structure for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.

公开(公告)号：US06590269B1

公开(公告)日：2003-07-08

申请号：US10114201

申请日：2002-04-01

Applicant: Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

Inventor： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

IPC: H01L310203

CPC classification number: H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

Abstract translation: 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。

公开(公告)号：US06559539B2

公开(公告)日：2003-05-06

申请号：US09770084

申请日：2001-01-24

Applicant: Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

Inventor： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

IPC: H01L2334

CPC classification number: H01L25/0657 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.

Abstract translation: 用于电连接到印刷电路板的图像传感器的堆叠封装结构包括基板，图像感测芯片，集成电路和透明层。 基板具有第一表面和第二表面。 第一表面由信号输入端子形成。 第二表面形成有用于电连接到印刷电路板的信号输入端子和信号输出端子。 图像感测芯片安装在基板的第一表面上并且电连接到基板的信号输入端子。 集成电路布置在基板的第二表面上并且电连接到基板的信号输入端子。 透明层覆盖图像感测芯片，其可以经由透明层接收图像信号，并将图像信号转换成要传输到基板的电信号。 因此，图像感测产品和集成电路的图像感测芯片可以被整体封装。