公开(公告)号：US07659150B1

公开(公告)日：2010-02-09

申请号：US11716156

申请日：2007-03-09

Applicant: Pezhman Monadgemi ,  Roger T. Howe ,  Emmanuel P. Quevy

Inventor： Pezhman Monadgemi ,  Roger T. Howe ,  Emmanuel P. Quevy

IPC: H01L21/00

CPC classification number: H01L23/10 ,  B81B2207/012 ,  B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Microshells for encapsulation of devices such as MEMS and microelectronics. In an embodiment, the microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation as a function of the dimension of the perforation to form cavities having different vacuum levels on the same substrate.

Abstract translation: 用于封装MEMS和微电子等器件的微型外壳。 在一个实施例中，微壳包括平面穿孔的预密封层，在其下面存取非平面牺牲层，以及密封层，用于在去除牺牲材料之后封闭预密封层中的穿孔。 密封层可以包括非密封层，以物理地闭塞穿孔，并且在非密封闭塞层上方形成密封层，以密封穿孔，作为穿孔尺寸的函数，以在同一基底上形成具有不同真空度的空腔。

公开(公告)号：US07595209B1

公开(公告)日：2009-09-29

申请号：US11716233

申请日：2007-03-09

Applicant: Pezhman Monadgemi ,  Emmanuel P. Quevy ,  Roger T. Howe

Inventor： Pezhman Monadgemi ,  Emmanuel P. Quevy ,  Roger T. Howe

IPC: H01L21/56 ,  H01L21/50

CPC classification number: B81C1/0023 ,  B81B7/0054 ,  B81C2201/0167 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L21/568 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Multi-layered, planar microshells having low stress for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. The sealing layer may further include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation. The various layers may be formed employing processes having opposing stresses to tune the residual stress of the multi-layered microshell. In an embodiment, the hermetic layer is a metal which is deposited with a process tuned to impart a tensile stress to lower the residual stress in the microshell below the magnitude of cumulative stress present in sealing layer and pre-sealing layer.

Abstract translation: 具有低应力的多层平面微壳体，用于诸如MEMS和微电子器件的封装。 微壳可以包括穿孔的预密封层，在其下方存取牺牲层，以及密封层，用于在去除牺牲材料之后封闭预密封层中的穿孔。 密封层还可以包括非密封层，以物理地封闭穿孔，并且在非密封闭塞层上方形成密封层以密封穿孔。 可以使用具有相反应力的工艺来形成各个层，以调节多层微壳的残余应力。 在一个实施例中，密封层是金属，其沉积有被调整以赋予拉伸应力的工艺，以将微壳中的残余应力降低到低于存在于密封层和预密封层中的累积应力的大小。

公开(公告)号：US07256107B2

公开(公告)日：2007-08-14

申请号：US11121690

申请日：2005-05-03

Applicant: Hideki Takeuchi ,  Emmanuel P. Quevy ,  Tsu-Jae King ,  Roger T. Howe

Inventor： Hideki Takeuchi ,  Emmanuel P. Quevy ,  Tsu-Jae King ,  Roger T. Howe

IPC: H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC classification number: B81C1/00142 ,  B81B2201/0271 ,  B81C2201/0109 ,  Y10S438/933

Abstract: In fabricating a microelectromechanical structure (MEMS), a method of forming a narrow gap in the MEMS includes a) depositing a layer of sacrificial material on the surface of a supporting substrate, b) photoresist masking and at least partially etching the sacrificial material to form at least one blade of sacrificial material, c) depositing a structural layer over the sacrificial layer, and d) removing the sacrificial layer including the blade of the sacrificial material with a narrow gap remaining in the structural layer where the blade of sacrificial material was removed.

Abstract translation: 在制造微机电结构（MEMS）中，在MEMS中形成窄间隙的方法包括：a）在支撑衬底的表面上沉积牺牲材料层，b）光致抗蚀剂掩模并且至少部分蚀刻牺牲材料以形成 至少一个牺牲材料刀片，c）在所述牺牲层上沉积结构层，以及d）去除包括所述牺牲材料刀片的所述牺牲层，其中所述牺牲材料刀片被去除的所述结构层中残留有窄间隙 。

公开(公告)号：US07211926B2

公开(公告)日：2007-05-01

申请号：US11361814

申请日：2006-02-23

Applicant: Emmanuel P. Quevy ,  Roger T. Howe

Inventor： Emmanuel P. Quevy ,  Roger T. Howe

IPC: H03B28/00 ,  H03B5/04

CPC classification number: G01K7/32 ,  G04G3/04 ,  H03H9/02448 ,  H03H9/2473 ,  H03H2009/02496

Abstract: Disclosed is an oscillator that relies on redundancy of similar resonators integrated on chip in order to fulfill the requirement of one single quartz resonator. The immediate benefit of that approach compared to quartz technology is the monolithic integration of the reference signal function, implying smaller devices as well as cost and power savings.

Abstract translation: 公开了一种振荡器，其依赖于集成在芯片上的类似谐振器的冗余，以满足一个单个石英谐振器的要求。 与石英技术相比，该方法的直接好处是参考信号功能的单一集成，意味着较小的器件以及成本和功率节省。

公开(公告)号：US06296779B1

公开(公告)日：2001-10-02

申请号：US09255236

申请日：1999-02-22

Applicant: William A. Clark ,  Thor Juneau ,  Roger T. Howe

Inventor： William A. Clark ,  Thor Juneau ,  Roger T. Howe

IPC: C03C1500

CPC classification number: G01C19/5719

Abstract: A microfabricated gyroscope to measure rotation about an axis parallel to the surface of the substrate. A voltage differential may be applied between pairs of electrode fingers to reduce the quadrature error. A microfabricated gyroscope includes a vibratory structure and interdigited electrodes having a high aspect ratio.

Abstract translation: 用于测量围绕平行于衬底表面的轴的旋转的微制造陀螺仪。 可以在电极指对之间施加电压差以减小正交误差。 微制造的陀螺仪包括具有高纵横比的振动结构和交叉指向的电极。

公开(公告)号：US5589082A

公开(公告)日：1996-12-31

申请号：US480467

申请日：1995-06-07

Applicant: Liwei Lin ,  Clark T. Nguyen ,  Roger T. Howe ,  Albert P. Pisano

Inventor： Liwei Lin ,  Clark T. Nguyen ,  Roger T. Howe ,  Albert P. Pisano

IPC: H03H9/46 ,  H01L21/00

CPC classification number: H03H9/02275 ,  H03H9/02377 ,  H03H9/46 ,  H03H9/462

Abstract: A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.

Abstract translation: 具有平面部件的微机械滤波器，并且可使用非常大规模的集成电路微加工技术制造。 输入和输出换能器是叉指梳状电极。 输入和输出换能器之间的机械耦合包括平面弯曲，电极的位移产生弯曲元件的弯曲。 通过在真空中密封微机械滤波器并提供板上电路，可以实现高信噪比和质量因素。 构建使用许多微机械谐振器的实时频谱分析仪，为设备提供高精度和短的采样时间。

公开(公告)号：US5565625A

公开(公告)日：1996-10-15

申请号：US347795

申请日：1994-12-01

Applicant: Roger T. Howe ,  Stephen Bart

Inventor： Roger T. Howe ,  Stephen Bart

IPC: G01L1/14 ,  G01P15/125 ,  G01P15/13 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01L1/148 ,  G01P15/131 ,  H01G5/14 ,  G01P2015/0814

Abstract: A micromachined force sensor containing separate sensing and actuator structures. A member is suspended above the substrate so that it is movable along an axis in response to a force. The member includes a set of parallel sense fingers and a separate set of parallel force fingers. The sense fingers are positioned between fingers of two sense plates, to form a first differential capacitor, whose capacitance changes when the member moves in response to a force along the axis. The change in capacitance induces a sense signal on the member, which permits the measurement of the magnitude and duration of the force. The force fingers are positioned between fingers of two actuator plates, to form a second differential capacitor. The sense signal can be used to provide feedback to the second differential capacitor to generate different electrostatic forces between the force fingers and the two actuator plates, to offset the force applied along the preferred axis. Limit stops limit the movement of the member to less than the distance between the electrodes of the differential capacitors, to prevent contact between the electrodes. Additional fingers be positioned around the differential capacitors to minimize parasitic capacitances.

公开(公告)号：US5314572A

公开(公告)日：1994-05-24

申请号：US872037

申请日：1992-04-22

Applicant: Theresa A. Core ,  Roger T. Howe

Inventor： Theresa A. Core ,  Roger T. Howe

IPC: B81B3/00 ,  B81C99/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  H01L21/306 ,  H01L21/764 ,  H01L29/84 ,  B29C37/00 ,  B44C1/22 ,  C03C15/00

CPC classification number: B81C1/0092 ,  B81C1/00928 ,  B81C99/004 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/131 ,  B81B2201/0235 ,  G01P2015/0814

Abstract: A suspended microstructure fabrication process. Photoresist pedestals are inserted in a sacrificial layer between the suspended microstructure and the substrate and photoresist spacers are inserted in the microstructure layer between non contacting portions of the suspended microstructure so that the photoresist pedestals and spacers support the microstructure bridge during the wet etching and drying process used to remove the sacrificial layer.

Abstract translation: 悬浮微结构制造工艺。 将光刻胶基座插入到悬浮的微结构和衬底之间的牺牲层中，并且将光致抗蚀剂间隔物插入到悬浮微结构的非接触部分之间的微结构层中，使得光致抗蚀剂基座和间隔件在湿蚀刻和干燥过程期间支撑微结构桥 用于去除牺牲层。

公开(公告)号：US5043043A

公开(公告)日：1991-08-27

申请号：US542435

申请日：1990-06-22

Applicant: Roger T. Howe ,  Jeffrey H. Lang ,  Martin F. Schlecht ,  Martin A. Schmidt ,  Stephen D. Senturia ,  Mehran Mehregany ,  Lee S. Tavrow

Inventor： Roger T. Howe ,  Jeffrey H. Lang ,  Martin F. Schlecht ,  Martin A. Schmidt ,  Stephen D. Senturia ,  Mehran Mehregany ,  Lee S. Tavrow

IPC: H02N1/00

CPC classification number: H02N1/004

Abstract: An electrostatic micromotor employs a side drive design. The stator operates in a plane above a substract and a moveable member lies and moves in the plane of the stator. An electrostatic field of operational strength is generated and sustained without breakdown in the plane between the stator and edges of the moveable member. Three fabrication processes enable formation of a moveable member in the plane of operation of the stator and spaced apart from the stator by a micron amount. One fabrication process deposits and patterns a structural layer to form the stator and moveable member over a sacrificial layer. A second fabrication process etches channels in a first structural layer to outline a stator, moveable member, and if desired, a bearing. A substrate is connected to the side of the structural layer through which the channels are etched and the opposite side is ground down to the ends of the channels to form salient stator, rotor and, if desired, bearing structures. The third fabrication process grows a sacrificial layer by local oxidation in an etched cavity of the substrate. A structural layer is then deposited and patterned over the substrate and sacrificial layer to form the stator and moveable member in a common plane. A harmonic side drive micromotor is also provided by the fabrication processes.

Abstract translation: 静电微电机采用侧驱设计。 定子在一个减法器上方的平面中工作，并且可移动构件位于定子的平面内并移动。 产生并维持操作强度的静电场，而不会在定子和可移动构件的边缘之间的平面内发生故障。 三个制造工艺使得能够在定子的操作平面中形成可移动构件并且与定子隔开微米量。 一个制造工艺沉积和图案化结构层，以在牺牲层上形成定子和可移动构件。 第二制造工艺蚀刻第一结构层中的通道以勾勒定子，可移动构件，并且如果需要，轮廓轴承。 衬底连接到结构层的侧面，通道通过该侧被蚀刻并且相对侧被研磨到通道的端部，以形成凸出的定子，转子以及如果需要的话承载结构。 第三制造工艺通过在衬底的蚀刻腔中的局部氧化来生长牺牲层。 然后在衬底和牺牲层上沉积和图案化结构层，以在公共平面中形成定子和可移动构件。 还通过制造工艺提供了谐波侧驱动微电机。

公开(公告)号：US4997521A

公开(公告)日：1991-03-05

申请号：US342952

申请日：1989-04-25

Applicant: Roger T. Howe ,  Jeffrey H. Lang ,  Martin F. Schlecht ,  Martin A. Schmidt ,  Stephen D. Senturia

Inventor： Roger T. Howe ,  Jeffrey H. Lang ,  Martin F. Schlecht ,  Martin A. Schmidt ,  Stephen D. Senturia

IPC: H02N1/00

CPC classification number: H02N1/004

Abstract: An electrostatically driven microactuator is micromachined in a monolithic process. Sacrificial layers are placed between a moving element and stator structural layers. Removal of the sacrificial layers leaves a free standing moving element and micron wide air gaps within a stator. An electric field of about 100 Mv/m and higher is supported across the micron wide gap without breakdown and enables high energy torque densities to be produced between the stator and the moving element. One electrostatic drive scheme involves a series of stator electrodes attached to the stator and a series of electrodes attached to the moving element charged in sequence to attract each other in a direction of movement and to oppose each other in a direction normal to movement. A bearing is aligned with the moving element within the stator during the layering of a sacrificial layer over an edge of the moving element structural layer. The bearing and stator laterally stabilize the moving element. Vertical stability is through aerodynamic shaping of the moving element, electronic circuits, or bushings. Applications of the microactuator include a linearly sliding shutter, an optical modulator, a gyroscope and an air pump.

Abstract translation: 静电驱动微致动器在单片工艺中被微加工。 牺牲层被放置在移动元件和定子结构层之间。 牺牲层的移除在定子内留​​下自由站立的移动元件和微米宽的气隙。 大约100Mv / m以上的电场被支撑在微米宽的间隙上而不会发生故障，并且能够在定子和移动元件之间产生高能量的转矩密度。 一个静电驱动方案涉及一系列连接到定子的定子电极和一系列连接到移动元件上的电极，该电极按顺序充电以在运动方向上彼此吸引并且在垂直于运动的方向上彼此相对。 在牺牲层在移动元件结构层的边缘上层叠期间，轴承与定子内的移动元件对齐。 轴承和定子横向稳定移动元件。 垂直稳定性是通过移动元件，电子电路或衬套的空气动力学成形。 微致动器的应用包括线性滑动快门，光学调制器，陀螺仪和空气泵。