公开(公告)号：US20100129526A1

公开(公告)日：2010-05-27

申请号：US12698876

申请日：2010-02-02

Applicant: Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

Inventor： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

IPC: B05D5/12

CPC classification number: H01L21/67034 ,  G03F7/38 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67207

Abstract: A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of forming a film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying drying processing to the substrate by said second processing unit after the exposure processing by said exposure device and applying development processing to the substrate by said third processing unit after the drying processing by said second processing unit

Abstract translation: 一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：在所述基板上由所述第一处理单元形成由感光材料制成的膜， 曝光装置的曝光处理。 该方法还包括在所述曝光装置的曝光处理之后通过所述第二处理单元对所述基板进行干燥处理，并且在所述第二处理单元进行干燥处理之后，通过所述第三处理单元对所述基板施加显影处理

公开(公告)号：US20090165711A1

公开(公告)日：2009-07-02

申请号：US12343302

申请日：2008-12-23

Applicant: Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

Inventor： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC: B05C11/00

CPC classification number: H01L21/67745 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67754 ,  H01L21/6776

Abstract: A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially horizontally. An IF section transports the substrates fed from each substrate treatment line to an exposing machine provided separately from this apparatus. The substrates are transported to the exposing machine in the order in which the substrates are loaded into the treating section. The throughput of this apparatus can be improved greatly, without increasing the footprint, since the substrate treatment lines are arranged one over the other. Each substrate can be controlled easily since the order of the substrates transported to the exposing machine is in agreement with the order of the substrates loaded into the treating section.

Abstract translation: 一个处理部分具有一个相互排列的衬底处理线，用于处理衬底，同时基本上水平地传送衬底。 IF部分将从每个基板处理线馈送的基板输送到与该装置分开设置的曝光机。 将基板按照将基板装入处理部的顺序输送到曝光机。 由于基板处理线彼此排列，因此能够大大提高该装置的生产量，而不增加占用面积。 可以容易地控制每个基板，因为输送到曝光机的基板的顺序与装载到处理部中的基板的顺序一致。

公开(公告)号：US20090107519A1

公开(公告)日：2009-04-30

申请号：US11929186

申请日：2007-10-30

Applicant: Tetsuya Ishikawa ,  Tsuyoshi Mitsuhashi ,  Ming Xi

Inventor： Tetsuya Ishikawa ,  Tsuyoshi Mitsuhashi ,  Ming Xi

IPC: B08B7/04

CPC classification number: B08B7/0042 ,  H01L21/02087 ,  H01L21/67051 ,  H01L21/6708

Abstract: An apparatus for processing a peripheral portion of a substrate includes a housing and a spin chuck mounted within the housing and configured to support the substrate in a substantially horizontal orientation. The apparatus also includes a fluid dispense nozzle coupled to the housing and proximate to the peripheral portion of the substrate. The fluid dispense nozzle is in fluid communication with a source of a chemical and configured to direct a flow of the chemical to the peripheral portion of the substrate located at a first radial distance from a center of the substrate. The apparatus further includes a light guide optically coupled to a laser source. The light guide is configured to direct radiation to the peripheral portion of the substrate located at a second radial distance from the center of the substrate greater than the first radial distance.

Abstract translation: 用于处理衬底的周边部分的设备包括壳体和安装在壳体内并被配置为以基本上水平的方向支撑衬底的旋转卡盘。 该设备还包括流体分配喷嘴，其连接到壳体并且靠近基板的周边部分。 流体分配喷嘴与化学物质的源流体连通，并被配置为将化学物质的流引导到位于距衬底中心的第一径向距离的衬底的周边部分。 该装置还包括光学耦合到激光源的光导。 光导被配置为将辐射引导到位于距离基板中心的第二径向距离的基板的周边部分大于第一径向距离。

公开(公告)号：US20070183775A1

公开(公告)日：2007-08-09

申请号：US11671581

申请日：2007-02-06

Applicant: Tsuyoshi Mitsuhashi ,  Kenji Sugimoto

Inventor： Tsuyoshi Mitsuhashi ,  Kenji Sugimoto

IPC: G03D5/00

CPC classification number: G03F7/3021 ,  H01L21/67051 ,  H01L21/67253

Abstract: A joint nozzle that delivers a developer, a rinsing liquid and nitrogen gas is disposed adjacent the spin center of a substrate in plan view. A controller operates electromagnetic switch valves to continue supply of the developer, while spinning the substrate, in a developing process, and to start supply of the rinsing liquid in a rinsing process, immediately after the supply of the developer ends, thereby achieving a shortened period of the developing process. A switching is made to a drying process by starting supply of the nitrogen gas immediately after completion of the rinsing process. Thus, even if the substrate has a large angle of contact, formation of droplets of the rinsing liquid is inhibited to prevent post-develop defects.

Abstract translation: 在平面图中，与基板的旋转中心相邻地设置输送显影剂，冲洗液和氮气的接合喷嘴。 控制器在显影过程中操作电磁切换阀以继续供应显影剂，同时旋转基底，并且在显影剂供应结束后立即在漂洗过程中开始供应冲洗液，从而实现缩短的周期 的发展过程。 通过在完成漂洗处理之后立即开始供应氮气，进行干燥过程的切换。 因此，即使基板具有大的接触角，也可以抑制漂洗液的液滴的形成，防止显影后的缺陷。

公开(公告)号：US20060147202A1

公开(公告)日：2006-07-06

申请号：US11295240

申请日：2005-12-06

Applicant: Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

Inventor： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

IPC: G03D5/00

CPC classification number: G03F7/70991 ,  G03F7/70341

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a washing/development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate by the resist film processing block. The substrate is washed and dried by the washing processing unit in the washing/development processing block before the substrate is subjected to the exposure processing by the exposure device.

Abstract translation: 基板处理装置包括分度器块，防反射膜处理块，抗蚀剂膜处理块，洗涤/显影处理块和界面块。 曝光装置设置在接口块附近。 通过抗蚀剂膜处理块在基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前，通过洗涤处理单元在洗涤/显影处理块中洗涤和干燥基板。

公开(公告)号：US06893171B2

公开(公告)日：2005-05-17

申请号：US10417460

申请日：2003-04-16

Applicant: Yoshiteru Fukutomi ,  Kenji Sugimoto ,  Takashi Ito ,  Takeo Okamoto ,  Yukihiko Inagaki ,  Katsushi Yoshioka ,  Tsuyoshi Mitsuhashi

Inventor： Yoshiteru Fukutomi ,  Kenji Sugimoto ,  Takashi Ito ,  Takeo Okamoto ,  Yukihiko Inagaki ,  Katsushi Yoshioka ,  Tsuyoshi Mitsuhashi

IPC: G03F7/30 ,  B05C9/14 ,  B05C13/00 ,  B65G1/00 ,  H01L21/00 ,  H01L21/027 ,  H01L21/67 ,  H01L21/677 ,  G03D5/00 ,  B65G49/07 ,  B65H1/00 ,  G03B27/32

CPC classification number: H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67276 ,  H01L21/67778 ,  Y10S414/135

Abstract: A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.

Abstract translation: 本文公开的基板处理装置实现了改善的生产量。 根据本发明的基板处理装置包括并列布置的防反射膜形成块，抗蚀剂膜形成块和显影块。 每个块包括化学处理模块，热处理模块和单个主要输送机构。 主要运输机构在每个区块内运输基材。 通过基板支架进行相邻块之间的基板的转移。 每个块的主要运输机构不受邻接块主运输机构的运动的影响。 因此，可以有效地输送基板，以提高基板处理装置的通过量。

公开(公告)号：US5962070A

公开(公告)日：1999-10-05

申请号：US149438

申请日：1998-09-08

Applicant: Tsuyoshi Mitsuhashi ,  Takuya Wada ,  Koji Hashimoto ,  Naoyuki Osada

Inventor： Tsuyoshi Mitsuhashi ,  Takuya Wada ,  Koji Hashimoto ,  Naoyuki Osada

IPC: G03F7/30 ,  H01L21/00 ,  B05D3/12 ,  B05C11/02 ,  B08B7/00

CPC classification number: H01L21/6715 ,  G03F7/3021

Abstract: A substrate treating method and apparatus for treating a substrate by supplying a developing solution thereto while spinning the substrate. A nozzle having a plurality of discharge openings for discharging the developer is disposed such that the discharge openings are at different distances from the spin center of the substrate. The developer is discharged from the nozzle while the latter is moved radially of the substrate. The discharge openings then describe loci not overlapping one another over the substrate. The developer is evenly supplied over the substrate to promote the uniformity of development on the substrate surface.

Abstract translation: 一种基板处理方法和装置，用于在旋转基板的同时通过向其提供显影溶液来处理基板。 具有用于排出显影剂的多个排出口的喷嘴被设置成使得排出开口处于与基板的旋转中心不同的距离处。 显影剂从喷嘴排出，而后者则从衬底的径向移动。 然后，排出口描述在衬底上彼此不重叠的位点。 显影剂被均匀地供应到基底上以促进基底表面上的显影的均匀性。

公开(公告)号：US5534353A

公开(公告)日：1996-07-09

申请号：US189845

申请日：1994-02-01

Applicant: Takahiro Kaba ,  Takashi Nishi ,  Tsuyoshi Mitsuhashi

Inventor： Takahiro Kaba ,  Takashi Nishi ,  Tsuyoshi Mitsuhashi

IPC: B22F3/02 ,  B22D17/20 ,  B22F9/08 ,  C22C1/05 ,  C22C14/00 ,  C22C29/06 ,  C22C32/00 ,  B22F7/00

CPC classification number: C22C32/0052 ,  Y10T428/12014 ,  Y10T428/12049 ,  Y10T428/12056 ,  Y10T428/12146 ,  Y10T428/1216

Abstract: A composite sintered material of a mixed-phase structure comprising fine particles of hard compound compactly and uniformly dispersed in grains of matrix of titanium or titanium alloy. The material is outstanding in abrasion resistance, strength, toughness, etc., and also has high resistance to corrosion by molten nonferrous metals and is therefore reduced in the likelihood of dissolving out into the melt.The sintered material is produced by uniformly mixing together a metal powder for forming the matrix of the desired sintered material and a powder for forming particles of hard compound to be dispersed, molding the powder mixture into a block under pressure, atomizing the block while melting the block and sintering the resulting powder.

Abstract translation: 一种混合相结构的复合烧结材料，其包含紧密且均匀地分散在钛或钛合金基质颗粒中的硬化合物的细颗粒。 该材料在耐磨性，强度，韧性等方面是突出的，并且熔融有色金属具有高抗腐蚀性，因此降低了溶解到熔体中的可能性。 烧结材料通过将用于形成所需烧结材料的基体的金属粉末和用于形成待分散的硬化合物颗粒的粉末均匀混合在一起而制成，在压力下将粉末混合物成型为块状，同时熔化块 阻挡并烧结所得粉末。

公开(公告)号：US5206132A

公开(公告)日：1993-04-27

申请号：US695697

申请日：1991-05-03

Applicant: Tsuyoshi Mitsuhashi

Inventor： Tsuyoshi Mitsuhashi

IPC: G03C1/485

CPC classification number: G03C1/48515 ,  Y10S430/164

Abstract: A direct positive silver halide photographic light-sensitive material which is improved in gradation and suitable for rapid processing comprises a support having thereon a silver halide emulsion layer containing surface-fogged type direct positive silver halide grains, wherein said direct positive silver halide emulsion layer comprises two or more silver halide emulsions substantially different in sensitivity and/or gradation; the ratio of the total area of (111) face to and total surface area of grains in said emulsions is not less than 50%; and the average silver iodide content of grains in said emulsions is not more than 5 mol%.

公开(公告)号：US09165807B2

公开(公告)日：2015-10-20

申请号：US13401644

申请日：2012-02-21

Applicant: Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

Inventor： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC: C23C16/00 ,  H01L21/67 ,  B05C13/00 ,  B05D3/04 ,  B05B15/12 ,  H01L23/34

CPC classification number: H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

Abstract: A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism for transporting the substrates to the treating units. Each cell also has a blowout unit for supplying a clean gas into a transporting space of the main transport mechanism and an exhaust unit for exhausting gas from the transporting space. The blowout unit and the exhaust unit are arranged one over the other in the transporting space to separate the transporting space of each cell from that of another cell.

Abstract translation: 一种基板处理装置，包括处理块，该处理块包括多个彼此排列的单元。 每个电池具有用于处理基板的处理单元和用于将基板输送到处理单元的单个主输送机构。 每个电池还具有用于向主输送机构的输送空间供给清洁气体的吹出单元和用于从输送空间排出气体的排气单元。 喷出单元和排气单元在传送空间中彼此重叠配置，以将每个单元的传送空间与另一个单元的传送空间分开。