公开(公告)号：US20130229822A1

公开(公告)日：2013-09-05

申请号：US13714311

申请日：2012-12-13

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG

IPC: G02B26/02

CPC classification number: G02B26/02 ,  G02F2001/133601

Abstract: A backlight module includes a back cover, a light source located on the back cover, an optical fiber located on the back cover and over the light source and having a light-incident hole facing the light source and a plurality of light-emergent windows opposite to the light-incident hole. A plurality of light shutters correspondingly covers the light-emergent windows. A controlling device is provided for controlling the open and close of the light shutters. Light emitted from the light source and entering the optical fiber is permitted to leave the optical fiber from the light-emergent windows whose light shutters are opened. The light is not permitted to leave the optical fiber from the light-emergent windows whose light shutters are closed.

Abstract translation: 背光源模块包括后盖，位于后盖上的光源，位于后盖上并在光源上并且具有面向光源的光入射孔的光纤和与光源相对的多个发光窗口 到光入射孔。 多个光闸相应地覆盖出光窗。 提供一种用于控制光闸的打开和关闭的控制装置。 允许从光源发射并进入光纤的光从光闸打开的出光窗口离开光纤。 光线不允许从光闸关闭的出光窗口离开光纤。

公开(公告)号：US20200373466A1

公开(公告)日：2020-11-26

申请号：US16568906

申请日：2019-09-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HSIN-CHIANG LIN ,  HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  LUNG-HSIN CHEN ,  PIN-CHUAN CHEN ,  WEN-LIANG TSENG

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/38 ,  F21V8/00

Abstract: A light source device for a display includes light emitting diode packages. Each light emitting diode package includes a substrate, a first light emitting diode chip emitting a first beam of light, a second light emitting diode chip emitting a second beam of light, and a package layer including a wavelength converting material. Frequency bands of the first and second light beams both have a full width at half maximum of 30 nm to 40 nm. The wavelength converting material is excited by the first and second beams to generate a third beam of light, the frequency band of the third beam of light having a full width at half maximum of 10 nm to 50 nm. A display using the light source device is also disclosed.

公开(公告)号：US20160118557A1

公开(公告)日：2016-04-28

申请号：US14826446

申请日：2015-08-14

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/48 ,  H01L33/38

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257

Abstract: The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes.

Abstract translation: 本公开提供一种LED封装，其包括电极，与所述电极电连接的LED管芯，覆盖所述LED管芯的封装; 以及围绕封装和LED管芯的外壳。 壳体包括基座，反射杯和支撑部分。 反射杯从底座向上延伸，反射杯围绕LED模具，支撑部分位于反射杯内部并穿过电极。

公开(公告)号：US20150171139A1

公开(公告)日：2015-06-18

申请号：US14524415

申请日：2014-10-27

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/00 ,  H01L33/60

CPC classification number: H01L25/167 ,  H01L23/60 ,  H01L25/165 ,  H01L29/866 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract translation: 光电器件包括电极结构，LED（发光二极管）元件，齐纳二极管和反射杯。 LED元件，齐纳二极管和反射杯布置在电极结构上。 LED元件和齐纳二极管彼此反并联地电连接。 反射杯包括限定在其中的内表面和限定在反射杯外侧的切口。 LED元件被反射杯的内表面包围，并且齐纳二极管被布置在刻痕中。

公开(公告)号：US20150069441A1

公开(公告)日：2015-03-12

申请号：US14476147

申请日：2014-09-03

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  FU-HSIANG YEH ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/38 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.

Abstract translation: 发光二极管（LED）封装包括：衬底，第一电极和安装在衬底的相对侧上的第二电极，安装在一个电极的顶表面上的LED芯片，并电连接第一电极和第二电极 以及包围第一电极和第二电极的外周的反射杯，以暴露第一电极和第二电极的顶表面以及第一电极和第二电极的第二电极和底表面。

公开(公告)号：US20140209948A1

公开(公告)日：2014-07-31

申请号：US14077218

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/56 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, and an LED die mounted on a top surface of the substrate. The substrate also includes a bottom surface. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. An oxidation-resistant metal coating layer is formed on a top face of each of the first and second electrodes. The LED die is electrically connected to the first and second electrodes via the two oxidation-resistant metal coating layers.

Abstract translation: 示例性的发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极以及安装在衬底顶表面上的LED管芯。 衬底还包括底面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在第一和第二电极中的每一个的顶面上形成抗氧化金属涂层。 LED管芯通过两个耐氧化金属涂层电连接到第一和第二电极。

公开(公告)号：US20140117390A1

公开(公告)日：2014-05-01

申请号：US13900559

申请日：2013-05-23

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An LED package includes a first electrode and a second electrode electrically insulating from the first electrode, an LED chip, two electrically insulating connecting layers, and a reflector. Top surfaces of the first electrode and the second electrode are recessed to define a first receiving space and a second receiving space therein. The LED chip is mounted on the top surface of the first electrode and electrically connects the first electrode and the second electrode. The electrically insulating connecting layers are respectively received in the first receiving space and the second receiving space. The reflector is mounted on top surfaces of the connecting layers and enclosing the LED chip therein.

Abstract translation: LED封装包括第一电极和与第一电极电绝缘的第二电极，LED芯片，两个电绝缘连接层和反射器。 第一电极和第二电极的顶表面被凹入以在其中限定第一容纳空间和第二容纳空间。 LED芯片安装在第一电极的顶表面上并电连接第一电极和第二电极。 电绝缘连接层分别容纳在第一容纳空间和第二容纳空间中。 反射器安装在连接层的顶表面上并将LED芯片封装在其中。

公开(公告)号：US20140061712A1

公开(公告)日：2014-03-06

申请号：US13971858

申请日：2013-08-21

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: H01L33/38

CPC classification number: H01L33/387 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A side view light emitting diode (LED) package includes an electrode structure, an LED die disposed on the electrode structure and an encapsulation layer covering the LED die. The encapsulation layer includes a light outputting surface. The electrode structure includes a first electrode and a second electrode spaced from each other to define a tortuous gap therebetween. Resin material for forming a substrate of the LED package fills in the gap to interconnect the first and second electrode together. The LED die is electrically connected to the first electrode and the second electrode. The present disclosure also provides a method for manufacturing the side view LED package.

Abstract translation: 侧视发光二极管（LED）封装包括电极结构，设置在电极结构上的LED管芯和覆盖LED管芯的封装层。 封装层包括光输出表面。 电极结构包括彼此间隔开的第一电极和第二电极，以在它们之间形成曲折的间隙。 用于形成LED封装的基板的树脂材料填充间隙以将第一和第二电极互连在一起。 LED管芯与第一电极和第二电极电连接。 本公开还提供了制造侧视LED封装的方法。

公开(公告)号：US20140004633A1

公开(公告)日：2014-01-02

申请号：US14014403

申请日：2013-08-30

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  MING-TA TSAI

IPC: H01L33/38

CPC classification number: H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16

Abstract: A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package.

Abstract translation: 一种制造LED封装的方法，包括以下步骤：提供电极，所述电极包括第一电极，第二电极，限定在所述第一电极和所述第二电极之间的通道，所述第一电极和所述第二电极相互间隔开， 空腔布置在第一电极上，腔体与通道连通; 布置与第一电极和第二电极电连接并布置在腔内的LED芯片; 提供覆盖所述第一电极和所述第二电极的屏蔽; 通过所述通道向所述空腔注入透明绝缘材料，并且所述第一电极，所述第二电极和所述屏蔽件通过所述透明绝缘材料互连; 固化透明绝缘材料以获得LED封装。

公开(公告)号：US20140004632A1

公开(公告)日：2014-01-02

申请号：US13895373

申请日：2013-05-16

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L24/97 ,  H01L33/486 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method for manufacturing an LED package includes following steps. A plate is provided. The plate defines a plurality of the through holes extending from an upper surface to a bottom surface of the plate. A blue film is attached to the bottom surface of the plate and covers openings of the through holes. The blue film and an inner wall of the plate defining the through hole cooperatively define a groove. Glue doped with phosphor particle is injected into the groove. The phosphor particles are condensed to a bottom surface of the glue adjacent to the blue film. The LED chips are embedded in the grooves and positioned at upper ends of the grooves. Finally, the blue film is removed and the plate is severed to obtain a plurality of individual LED packages each including a corresponding LED chip.

Abstract translation: 一种制造LED封装的方法包括以下步骤。 提供板材。 板限定从板的上表面延伸到底表面的多个通孔。 蓝色膜附着在板的底表面上并覆盖通孔的开口。 限定通孔的蓝色膜和板的内壁协同地限定凹槽。 掺杂有磷光体颗粒的胶被注入到凹槽中。 荧光体颗粒被冷凝到与蓝色膜相邻的胶水的底部表面。 LED芯片嵌入槽中并定位在槽的上端。 最后，去除蓝色膜并切断板，以获得多个单独的LED封装，每个包装包括相应的LED芯片。