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    OPTICAL LENS, BACKLIGHT MODULE AND DISPLAY DEVICE USING SAME
    1.
    发明申请
    OPTICAL LENS, BACKLIGHT MODULE AND DISPLAY DEVICE USING SAME 审中-公开

    公开(公告)号：US20200326594A1

    公开(公告)日：2020-10-15

    申请号：US16680784

    申请日：2019-11-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： CHAO-HSIUNG CHANG ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN ,  HSIN-CHIANG LIN ,  HOU-TE LIN

    IPC: G02F1/1335

    Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

    LENS FOR LIGHT EMITTING DEVICE
    2.
    发明申请
    LENS FOR LIGHT EMITTING DEVICE 审中-公开
    用于发光装置的镜头

    公开(公告)号：US20160356451A1

    公开(公告)日：2016-12-08

    申请号：US15096277

    申请日：2016-04-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HSIN-CHIANG LIN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    IPC: F21V5/04 ,  F21V17/10

    CPC classification number: F21V5/04 ,  F21Y2115/10 ,  G02B19/0014 ,  G02B19/0061

    Abstract: A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. The light emitting surface includes a central recess and two convex regions connecting the central recess at opposite sides. The light emitting surface is symmetrical about the central recess. The lens further defines a receiving space in the bottom surface and four positioning pins on the bottom surface. The receiving space includes a light incident surface. The two convex regions of the light emitting surface and the light incident surface are non-spherical surfaces. A maximum distance, dn, between the light source and the light incident surface is larger than a maximum distance, Dm, between the light incident surface and the light emitting surface. The light emitting device provides a wide-angle light distribution.

    Abstract translation: 发光器件包括光源和透镜。 透镜包括发光表面，顶表面，四个边缘表面和底表面。 发光表面包括中心凹部和连接相对侧的中心凹部的两个凸起区域。 发光表面关于中心凹槽对称。 透镜进一步限定底面中的接收空间和底面上的四个定位销。 接收空间包括光入射表面。 发光面和光入射面的两个凸区域是非球面。 光源与光入射面之间的最大距离dn大于光入射面与发光面之间的最大距离Dm。 发光装置提供广角光分布。

    LIQUID CRYSTAL DISPLAY MODULE
    4.
    发明申请
    LIQUID CRYSTAL DISPLAY MODULE 审中-公开

    公开(公告)号：US20190033658A1

    公开(公告)日：2019-01-31

    申请号：US15662087

    申请日：2017-07-27

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HSIN-CHIANG LIN ,  CHIEN-CHENG KUO ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    IPC: G02F1/1335 ,  G02F1/1368

    Abstract: A liquid crystal display module comprises a thin film transistor array substrate, a liquid crystal layer, a color filter substrate and a plurality of light emitting diode chips. The thin film transistor array substrate has a first surface and a second surface. A circuit structure is formed on the first surface. A plurality of thin film transistors is formed on the second surface and electrically connecting to the circuit structure. The liquid crystal layer faces the second surface. The liquid crystal layer is formed between the thin film transistor array substrate and the color filter substrate. The light emitting diode chips are adhered on the first surface and electrically connecting to the circuit structure. Each light emitting diode chip has a light emitting surface. Light emitted from the light emitting surfaces is incident on the first surface of the thin film transistor array substrate.

    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20130341652A1

    公开(公告)日：2013-12-26

    申请号：US13912185

    申请日：2013-06-06

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HSIN-CHIANG LIN

    IPC: H01L33/08

    CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An exemplary light-emitting diode (LED) package includes a first electrode, a second electrode spaced from the first electrode, an electrically insulating substrate sandwiched by and connecting with the first electrode and the second electrode, a first LED chip and a second LED chip mounted on top surfaces of the first and second electrodes respectively, and a reflector covering the top surfaces of the first and second electrodes. The first LED chip mounted on the top surface of the first electrode is above the second LED chip mounted on the top surface of the second surface. L-shaped retaining walls are formed on the top surfaces of the first and second electrodes. By the retaining walls, the LED package can also be used as a side-view LED package.

    Abstract translation: 示例性发光二极管（LED）封装包括第一电极，与第一电极间隔开的第二电极，被第一电极和第二电极夹持并与之连接的电绝缘基板，第一LED芯片和第二LED芯片 分别安装在第一和第二电极的顶表面上，以及覆盖第一和第二电极的顶表面的反射器。 安装在第一电极的顶表面上的第一LED芯片在安装在第二表面的顶表面上的第二LED芯片之上。 L形保持壁形成在第一和第二电极的顶表面上。 通过挡土墙，LED封装也可以用作侧视LED封装。

    METHOD FOR MANUFACTURING LED PACKAGE
    6.
    发明申请
    METHOD FOR MANUFACTURING LED PACKAGE 失效
    制造LED封装的方法

    公开(公告)号：US20130302919A1

    公开(公告)日：2013-11-14

    申请号：US13942716

    申请日：2013-07-16

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

    IPC: H01L33/52 ,  H01L33/60

    CPC classification number: H01L33/52 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for making an LED package includes the following steps: providing a substrate with an electrode formed thereon; forming at least one barrier portion on the electrode; forming a reflective cup on the substrate wherein the reflective cup covers the at least one barrier portion; providing an LED die in the reflective cup and electrically connecting the LED die to the electrode; and forming an encapsulation in the reflective cup, the encapsulation covering the LED die.

    Abstract translation: 一种制造LED封装的方法包括以下步骤：提供其上形成有电极的基板; 在所述电极上形成至少一个阻挡部分; 在所述基底上形成反射杯，其中所述反射杯覆盖所述至少一个阻挡部分; 在反射杯中提供LED管芯并将LED管芯电连接到电极上; 并在反射杯中形成封装，封装覆盖LED裸片。

    METHOD FOR MANUFACTURING LED PACKAGE STRUTURE AND METHOD FOR MANUFACTURING LEDS USING THE LED PACKANGE STRUTURE
    8.
    发明申请
    METHOD FOR MANUFACTURING LED PACKAGE STRUTURE AND METHOD FOR MANUFACTURING LEDS USING THE LED PACKANGE STRUTURE 有权
    用于制造LED封装结构的方法和使用LED封装形状制造LED的方法

    公开(公告)号：US20130236996A1

    公开(公告)日：2013-09-12

    申请号：US13714418

    申请日：2012-12-14

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN ,  LUNG-HSIN CHEN

    IPC: H01L33/60

    CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.

    Abstract translation: 公开了一种制造LED封装结构的方法，其中提供了具有第一电极，第二电极和连接层的衬底。 提供光致抗蚀剂涂层以覆盖基板，第一电极，第二电极和连接层。 去除光刻胶涂层的一部分以限定对应于连接层的凹槽。 在槽中形成金属层以连接连接层。 去除光致抗蚀剂涂层的剩余部分，并形成凹陷并被金属层包围。 在凹面的内表面上形成反射层以连接金属层以形成反射杯。 LED管芯安装在反射杯中并与第一和第二电极电连接。

    METHOD FOR MANUFACTURING LED
    10.
    发明申请
    METHOD FOR MANUFACTURING LED 有权
    制造LED的方法

    公开(公告)号：US20140030828A1

    公开(公告)日：2014-01-30

    申请号：US14038767

    申请日：2013-09-27

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

    IPC: H01L33/56

    CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed.

    Abstract translation: LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。 还公开了一种制造LED的方法。

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