公开(公告)号：US20140061698A1

公开(公告)日：2014-03-06

申请号：US13927777

申请日：2013-06-26

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: H01L33/60 ,  H01L33/54

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided.

Abstract translation: LED封装包括第一电极，与第一电极相邻的第二电极，围绕并封装第一和第二电极的成型体以及安装在第二电极上的LED管芯。 成型体包括位于第一和第二电极之上的反射杯，反射杯限定顶面中的接收腔以接收LED管芯。 第一延伸电极从第一电极向侧面突出，第二延伸电极从第二电极向侧面突出。 第一和第二延伸电极从成形体的外周露出。 还提供了用于制造LED封装的方法。

公开(公告)号：US20140061697A1

公开(公告)日：2014-03-06

申请号：US13912211

申请日：2013-06-07

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00

Abstract: An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided.

Abstract translation: LED封装包括相邻的第一和第二电极，从第一和第二电极向侧面突出的第一和第二延伸电极，围绕第一和第二电极的模制体和LED管芯。 成型体形成位于第一和第二电极上方的反射杯，每个反射杯在其顶面限定一个接收腔，以容纳LED管芯。 第一和第二延伸电极从成形体的外周露出。 第一电极具有第一底面。 第二电极具有第二底面。 第一和第二电极的第一和第二底面从成形体的底面露出。 还提供了用于制造LED封装的方法。

公开(公告)号：US20190033659A1

公开(公告)日：2019-01-31

申请号：US15800165

申请日：2017-11-01

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HSIN-CHIANG LIN ,  CHIEN-CHENG KUO ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: G02F1/1335

CPC classification number: G02F1/133603 ,  G02F1/133512 ,  G02F1/133514 ,  G02F1/133605 ,  G02F1/133606 ,  G02F1/133617 ,  G02F2001/133607 ,  G02F2001/133612 ,  G02F2001/133614 ,  G02F2201/52 ,  G02F2202/36

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

公开(公告)号：US20190033658A1

公开(公告)日：2019-01-31

申请号：US15662087

申请日：2017-07-27

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HSIN-CHIANG LIN ,  CHIEN-CHENG KUO ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: G02F1/1335 ,  G02F1/1368

Abstract: A liquid crystal display module comprises a thin film transistor array substrate, a liquid crystal layer, a color filter substrate and a plurality of light emitting diode chips. The thin film transistor array substrate has a first surface and a second surface. A circuit structure is formed on the first surface. A plurality of thin film transistors is formed on the second surface and electrically connecting to the circuit structure. The liquid crystal layer faces the second surface. The liquid crystal layer is formed between the thin film transistor array substrate and the color filter substrate. The light emitting diode chips are adhered on the first surface and electrically connecting to the circuit structure. Each light emitting diode chip has a light emitting surface. Light emitted from the light emitting surfaces is incident on the first surface of the thin film transistor array substrate.

公开(公告)号：US20150036321A1

公开(公告)日：2015-02-05

申请号：US14445486

申请日：2014-07-29

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: F21K99/00 ,  F21V5/04

CPC classification number: G02B19/0061 ,  F21V5/046 ,  F21V7/0091 ,  F21V9/30 ,  G02B19/0028

Abstract: An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.

Abstract translation: 光学透镜包括位于其底部的第一光学表面，位于其顶部并与第一光学表面相对布置的第三光学表面，以及在第一光学表面和第三光学表面之间延伸的第二光学表面。 第三光学表面向下朝向第一光学表面凹陷。 来自LED光源的光通过第一光学表面进入光学透镜，大部分入射光通过第二光学表面直接从光学透镜折射出来，并且进入第三光学表面的入射光的一部分 首先由第三光学表面通过全内反射朝向第二光学表面反射，然后通过第二光学表面折射出光学透镜。 还提供了包括光学透镜的背光模块。

公开(公告)号：US20150003080A1

公开(公告)日：2015-01-01

申请号：US14310486

申请日：2014-06-20

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  HOU-TE LIN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: F21K99/00

CPC classification number: F21V5/04 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061

Abstract: An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein.

Abstract translation: LED模块包括具有形成在其上的第一电极和第二电极的PCB，安装在PCB上的LED，安装在PCB上并覆盖LED的透镜。 LED包括基座，安装在基座上的LED管芯，以及布置在基座上并在其中覆盖LED管芯的封装层。 基地平坦。 透镜包括底面，从底面延伸的第一光输出表面，从第一光输出表面的中心向上延伸并远离底表面的第二光输出表面，以及从顶部向下凹陷的反射表面 第二光输出表面的端部并且朝向底表面定向。 在底表面中限定一个室，以便在其中接收LED。

公开(公告)号：US20140319564A1

公开(公告)日：2014-10-30

申请号：US14140460

申请日：2013-12-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/60

CPC classification number: H01L33/62 ,  H01L24/14 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided.

Abstract translation: 用于通过表面安装技术安装到印刷电路板的发光二极管封装包括基板，第一和第二电极以及发光二极管。 第一电极和第二电极各自具有第一端和第二端。 第一电极的第二端与第二电极的第一端相邻，并且其间的距离沿着发光二极管封装的顶部到底部的方向增加。 第一电极的第一端延伸出基板并形成锥形结构。 第二电极的第二端延伸出基板并形成锥形结构。 发光二极管芯片与第一和第二电极电连接。 还提供了一种用于制造发光二极管封装的方法。

公开(公告)号：US20140284640A1

公开(公告)日：2014-09-25

申请号：US14077220

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/40 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

Abstract translation: 发光二极管（LED）封装包括基板，第一电极，第二电极，安装在基板上并电连接到第一和第二电极的LED管芯，以及封装LED管芯的封装层。 第一和第二电极都嵌入基板并彼此间隔开。 第一电极和第二电极中的每一个分别包括顶面和底面，其顶面和底面分别在基板的顶表面和底表面处露出。 第一电极的顶面在其中限定第一凹槽。 在第一槽中填充抗氧化金属涂层。 LED管芯的正极接合焊盘直接与第一耐氧化金属被覆层的顶面接触。

公开(公告)号：US20140284639A1

公开(公告)日：2014-09-25

申请号：US14077219

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/40 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.

Abstract translation: 发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极，安装在衬底的顶表面上并电连接到第一和第二电极的LED管芯 。 第一和第二电极都包括顶面和底面，其中第一和第二电极中的每一个的顶面和底面分别暴露在基板的顶表面和底表面处。 第一电极的顶面限定对应于LED管芯的正焊盘（p焊盘）的第一槽。 p焊盘部分地插入第一凹槽中。 在p垫的插入部分和第一槽的内表面之间填充抗氧化金属涂层。

公开(公告)号：US20140175484A1

公开(公告)日：2014-06-26

申请号：US14014424

申请日：2013-08-30

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/60

CPC classification number: H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.

Abstract translation: LED封装包括第一电极，第二电极，连接第一电极和第二电极的反射杯和LED芯片。 第一电极包括第一主要部分和从第一主要部分向外延伸的第一连接部分。 第一连接部分具有远离第一主要部分的第一连接面。 第二电极包括从第二主要部分向外延伸的第二主要部分和第二连接部分。 第二连接部分具有远离第二主要部分的第二连接面。 第一主要部分和第二主要部分嵌入到接收杯中，并且第一连接部分的第一连接面和第二连接部分的第二连接面暴露在接收杯的外部。