公开(公告)号：US20130277708A1

公开(公告)日：2013-10-24

申请号：US13919003

申请日：2013-06-17

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

IPC: H01L33/54

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

公开(公告)号：US20130236996A1

公开(公告)日：2013-09-12

申请号：US13714418

申请日：2012-12-14

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN ,  LUNG-HSIN CHEN

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.

Abstract translation: 公开了一种制造LED封装结构的方法，其中提供了具有第一电极，第二电极和连接层的衬底。 提供光致抗蚀剂涂层以覆盖基板，第一电极，第二电极和连接层。 去除光刻胶涂层的一部分以限定对应于连接层的凹槽。 在槽中形成金属层以连接连接层。 去除光致抗蚀剂涂层的剩余部分，并形成凹陷并被金属层包围。 在凹面的内表面上形成反射层以连接金属层以形成反射杯。 LED管芯安装在反射杯中并与第一和第二电极电连接。

公开(公告)号：US20170301828A1

公开(公告)日：2017-10-19

申请号：US15482975

申请日：2017-04-10

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: H01L33/38 ,  H01L33/44 ,  H01L33/48

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/44 ,  H01L33/486 ,  H01L2933/0016

Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.

公开(公告)号：US20160104817A1

公开(公告)日：2016-04-14

申请号：US14832692

申请日：2015-08-21

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: H01L33/38 ,  H01L33/60 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/44 ,  H01L33/486 ,  H01L2933/0016

Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

Abstract translation: 本公开提供了一种发光二极管管芯，其包括衬底; 依次形成在该基板上的N型半导体层，有源层和P型半导体层; 至少一个凹部和一对电极。 凹部延伸到N型半导体层。 除了P半导体层上的开口以外，绝缘层覆盖N型半导体层，有源层，P型半导体层以及P型半导体层的顶部的所有侧面。 其中一个电极填充在凹槽中并与N型半导体层电连接，而另一个电极连接到开口中的P型半导体层。 本公开进一步提供了具有LED管芯的LED封装及其制造方法。

公开(公告)号：US20150179902A1

公开(公告)日：2015-06-25

申请号：US14523425

申请日：2014-10-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/50

CPC classification number: H01L33/507 ,  H01L33/505

Abstract: The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent power and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion.

Abstract translation: 本发明涉及一种发光二极管（LED）封装。 LED封装包括蓝色LED芯片，第一电极，第二电极和荧光体层。 除了蓝色LED芯片的底面之外，荧光体层覆盖蓝色LED芯片的外周。 荧光粉层由黄色荧光粉和胶水混合。 磷光体层包括对应于蓝色LED芯片的发光角的中心部分的主要部分和对应于发光角度的周边的延伸部分。 主要部分的平均厚度大于延伸部分的厚度。

公开(公告)号：US20150162497A1

公开(公告)日：2015-06-11

申请号：US14524360

申请日：2014-10-27

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： YAU-TZU JANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  YU-LIANG HUANG

IPC: H01L33/38 ,  H01L33/44 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/44 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

Abstract translation: 发光二极管封装（LED）包括彼此间隔开的两个电极，夹在两个电极之间的绝缘层，设置在两个电极上并与之电连接的LED管芯，以及覆盖LED管芯和涂层的封装层 。 每个电极包括导电片和连接到导电片的多个连接销。 每个连接销的厚度小于导电片的厚度。 每个连接销的顶表面低于导电片的顶表面。 LED封装还包括涂覆连接销的涂层，涂层销的一部分夹在连接销的顶表面和封装层之间。

公开(公告)号：US20140306240A1

公开(公告)日：2014-10-16

申请号：US14062829

申请日：2013-10-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  YAU-TZU JANG ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented.

Abstract translation: 示例性的发光二极管封装包括衬底，第一电极和埋在衬底中的第二电极，以及通过第一胶固定到第一电极上的发光芯片。 第一电极在第一胶水的周围具有第一阻挡构件，并且在发光芯片的下面。 第一阻挡构件妨碍第一胶从第一胶和发光芯片向第一阻挡构件的侧面扩散，由此第一胶水被污染到第一屏障旁边的顶表面区域 的第一电极远离第一胶和防止发光芯片。

公开(公告)号：US20140291713A1

公开(公告)日：2014-10-02

申请号：US14096031

申请日：2013-12-04

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/54 ,  H01L33/38 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.

Abstract translation: 示例性发光二极管（LED）封装包括衬底，穿过衬底向下穿过的第一电极，穿过衬底向下穿过并与第一电极间隔开的第二电极，布置在衬底上并安装到第一和 通过倒装芯片技术的第二电极，以及形成在基板上以将LED管芯封装在其中的封装层。 基板包括在其相对侧的顶表面和底表面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在LED封装的底部附着防潮层，以覆盖第一和/或第二电极和基板的接头。

公开(公告)号：US20140220717A1

公开(公告)日：2014-08-07

申请号：US14162754

申请日：2014-01-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/52 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing an LED package includes the steps: providing a lead frame including many pairs of first and second electrodes, the first electrodes and second electrodes each including a main body, an extension electrode, and a supporting branch, the first electrodes in a column and the second electrodes in a column being linearly connected by a first and second tie bars, respectively; forming many molded bodies to correspond to the pairs of the first and second electrodes, the first and second main bodies being embedded into the molded bodies, the first and second extension electrodes being exposed out from a periphery of the molded body, bottoms of the first and second supporting branches being exposed at a bottom of the molded body; disposing LED dies in corresponding receiving cavities; and cutting the first and second tie bars and the molded bodies and the lead frame.

Abstract translation: 一种制造LED封装的方法包括以下步骤：提供包括多对第一和第二电极的引线框架，所述第一电极和第二电极各自包括主体，延伸电极和支撑分支，所述第一电极为 并且柱中的第二电极分别由第一和第二连接杆线性连接; 形成多个成形体以对应于第一和第二电极对，第一和第二主体嵌入模制体中，第一和第二延伸电极从模制体的周边露出，第一和第二主体的底部 并且第二支撑分支在模制体的底部露出; 在相应的接收腔中设置LED管芯; 以及切割第一和第二连杆以及模制体和引线框架。

公开(公告)号：US20140179042A1

公开(公告)日：2014-06-26

申请号：US14035943

申请日：2013-09-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/46

CPC classification number: H01L33/50 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an LED chip on the substrate; combining the flexible material layer and the hard material layer together wherein the LED chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively.

Abstract translation: 一种发光二极管制造方法，包括以下步骤：在柔性反射层中提供具有柔性反射层和磷光胶的柔性材料层; 在基板上提供具有基板和LED芯片的硬质材料层; 将柔性材料层和硬质材料层组合在一起，其中LED芯片插入到磷光体胶中并被柔性反射层包围; 并且使柔性反射层和荧光体胶固化，分别形成反射杯和荧光体层。