公开(公告)号：US20140248080A1

公开(公告)日：2014-09-04

申请号：US14278211

申请日：2014-05-15

Applicant: Asia Vital Components Co., Ltd.

Inventor： Sheng-Huang Lin

IPC: F16B2/06

CPC classification number: F16B2/065 ,  F16B5/0241 ,  F16B21/078 ,  F16B21/088 ,  F16B43/025 ,  F28D15/0275 ,  F28F2275/20 ,  H01L23/427 ,  H01L2023/4087 ,  H01L2924/0002 ,  Y10T403/54 ,  Y10T403/7033 ,  H01L2924/00

Abstract: A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary.

公开(公告)号：US20140068941A1

公开(公告)日：2014-03-13

申请号：US14085312

申请日：2013-11-20

Applicant: Asia Vital Components Co., Ltd.

Inventor： Sheng-Huang Lin

IPC: B23P15/26

CPC classification number: B23P15/26 ,  F28D15/02 ,  F28D15/0275 ,  F28F1/32 ,  Y10T29/4935 ,  Y10T29/49378

Abstract: A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe.

Abstract translation: 公开了一种散热片及其制造方法。 散热片包括具有第一侧和相对的第二侧的主体，并且设置有至少一个通孔，以在第一和第二侧之间延伸用于热管延伸穿过其中; 并且至少一个延伸部形成在主体的第一和第二侧中的至少一个上，以围绕至少一个通孔定位并且从主体轴向突出。 延伸部被压接以形成多个周向交替的脊部和谷部，用于紧紧地压靠在热管的外表面上，以便将辐射翅片牢固地结合到热管。 可以通过将多个散热片顺序地结合到热管来形成热模块。

公开(公告)号：US12215934B2

公开(公告)日：2025-02-04

申请号：US18064291

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28F21/08 ,  F28F1/32 ,  H05K7/20

Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

公开(公告)号：US20230243607A1

公开(公告)日：2023-08-03

申请号：US18064290

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Li

IPC: F28F21/08 ,  H05K7/20

CPC classification number: F28F21/084 ,  H05K7/20336 ,  H05K7/20418

Abstract: A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.

公开(公告)号：US20230243597A1

公开(公告)日：2023-08-03

申请号：US18064292

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28D15/02 ,  F28F1/32 ,  F28F21/08

CPC classification number: F28D15/0275 ,  F28F1/325 ,  F28F21/084 ,  F28F21/085 ,  F28F2215/12

Abstract: A heat sink assembly with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one area to be connected to other members of the heat sink assembly, such as a groove. A copper embedding layer is provided on a groove inner surface of the groove for connecting the aluminum fin assembly to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

公开(公告)号：US11564329B2

公开(公告)日：2023-01-24

申请号：US17087627

申请日：2020-11-03

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yen-Lin Chu

IPC: H05K7/20

Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.

公开(公告)号：US20210325120A1

公开(公告)日：2021-10-21

申请号：US16849973

申请日：2020-04-15

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: F28D15/02 ,  F28D15/04

Abstract: A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.

公开(公告)号：US10900719B2

公开(公告)日：2021-01-26

申请号：US16199211

申请日：2018-11-25

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: F28D15/02 ,  H01L23/427 ,  H01L21/48

Abstract: A heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

公开(公告)号：US20200235036A1

公开(公告)日：2020-07-23

申请号：US16384946

申请日：2019-04-16

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: H01L23/40 ,  H01L23/427 ,  H05K1/02

Abstract: A fixing structure for heat dissipation assembly includes a base and multiple female fastener holders. The base has at least one through bore axially extending through an upper and a lower surface thereof, as well as coupling holes located outside the through bore and respectively having an engaging element disposed therein. The female fastener holder has a lower side formed with coupling protrusions corresponding to the coupling holes. The coupling protrusion has a guiding groove radially provided thereon and having a lower and an upper end recess for engaging with the engaging element in the corresponding coupling hole. The engaging elements in the coupling holes are guided by the guiding grooves to move from the lower to the upper recesses when the female fastener holder is turned relative to the through bore and the coupling holes on the base, bringing the coupling protrusions to axially insert into the coupling holes.

公开(公告)号：US20200068745A1

公开(公告)日：2020-02-27

申请号：US16108099

申请日：2018-08-22

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yen-Lin Chu

IPC: H05K7/20 ,  F28D15/04

Abstract: A heat dissipation structure of electronic device includes a main body having a first heat pipe set and a second heat pipe set. The first heat pipe set includes at least one first heat pipe normal to the main body. A first thermal module and a first fan are disposed on the first heat pipe. The second heat pipe set includes at least one second heat pipe having a first section normal to the main body and a second section extending from the first section in parallel to the main body. A second thermal module and a second fan are disposed on the second section. The first fan creates a first airflow flowing through the first and second thermal modules in a first direction. The second fan creates a second airflow flowing through the second thermal module in a second direction.