公开(公告)号：US07723150B2

公开(公告)日：2010-05-25

申请号：US12147940

申请日：2008-06-27

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L21/00

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14632

Abstract: A method for fabricating an image sensor, which includes the following steps, is provided. A semiconductor substrate including a sensor array, a pad and a passivation layer is provided, and the passivation layer covers the sensor array and the pad. An opening, which comprises tapered sidewalls not perpendicular to a bared surface of the pad, is formed in the semiconductor substrate to expose the pad. An under layer is formed on the semiconductor substrate, and covers the pad and the passivation layer. A color filter array is formed on the under layer and over the corresponding sensor array. A planar layer is formed on the color filter array. A portion of the under layer is removed to expose the pad. A plurality of U-lenses is formed on the planar layer.

Abstract translation: 提供了一种制造图像传感器的方法，其包括以下步骤。 提供了包括传感器阵列，焊盘和钝化层的半导体衬底，并且钝化层覆盖传感器阵列和衬垫。 在半导体衬底中形成包括不垂直于衬垫的裸露表面的锥形侧壁的开口以露出衬垫。 在半导体衬底上形成底层，覆盖衬垫和钝化层。 在下层和相应的传感器阵列上形成滤色器阵列。 平面层形成在滤色器阵列上。 下层的一部分被去除以暴露垫。 在平面层上形成多个U型透镜。

公开(公告)号：US20100089627A1

公开(公告)日：2010-04-15

申请号：US12333014

申请日：2008-12-11

Applicant: Han-Pei Huang ,  Cheng-Hung Yu

Inventor： Han-Pei Huang ,  Cheng-Hung Yu

IPC: H05K1/00 ,  C08J7/18 ,  B05D5/12 ,  C25D5/02 ,  B32B37/14 ,  H05K3/12 ,  H05K1/11

CPC classification number: H05K3/4644 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/06 ,  H05K3/185 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.

Abstract translation: 本发明提供了一种多层三维电路结构及其制造方法。 制造方法包括以下步骤。 首先，提供三维绝缘结构。 然后在三维绝缘结构的表面上形成第一三维电路结构。 接下来，形成覆盖第一三维电路结构的绝缘层。 此后，在绝缘层上形成第二三维电路结构。 随后，至少形成了穿过绝缘层的导电通孔，用于电连接第二三维电路结构和第一三维电路结构。

公开(公告)号：US20060118698A1

公开(公告)日：2006-06-08

申请号：US11003515

申请日：2004-12-03

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L27/00

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L31/02162 ,  H01L31/0232

Abstract: An image sensor device including a substrate, a plurality of photo sensors, a dielectric layer, a planar layer, a plurality of color filters, a plurality of microlenses, and a shield layer is provided. The photo sensors are disposed in the substrate, and the dielectric layer is disposed over the photo sensors and the substrate. The planar layer is disposed over the dielectric layer. The color filters are disposed in the planar layer, wherein each of the color filters is disposed over each of the photo sensors. The microlenses are disposed over the planar layer, wherein each of the microlenses is disposed over each of the color filter. The shield layer including a plurality of openings is disposed in the planar layer and is disposed under or over the color filters, wherein each of the openings is disposed over each of the color filters.

Abstract translation: 提供了包括基板，多个光电传感器，电介质层，平面层，多个滤色器，多个微透镜以及屏蔽层的图像传感器装置。 光传感器设置在基板中，并且电介质层设置在光传感器和基板之上。 平面层设置在电介质层上。 滤色器设置在平面层中，其中每个滤色器设置在每个光传感器上。 微透镜设置在平面层上，其中每个微透镜设置在每个滤色器上。 包括多个开口的屏蔽层设置在平面层中并且设置在滤色器的下方或上方，其中每个开口设置在每个滤色器上。

公开(公告)号：US20050084778A1

公开(公告)日：2005-04-21

申请号：US10605677

申请日：2003-10-17

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G01B11/00 ,  G03C5/00 ,  G03F7/00 ,  G03F9/00 ,  H01L21/00 ,  H01L21/027

CPC classification number: G03F9/7011 ,  G03F9/7019 ,  G03F9/7088

Abstract: A semiconductor wafer has at least one pre-layer on-wafer alignment mark (pre-layer on-wafer AM) on a top surface of the semiconductor wafer. A baseline check (BCHK) is performed to align a current-layer reticle AM on a current-layer reticle with the pre-layer on-wafer AM. By capturing and comparing signals of the current-layer reticle AM and the pre-layer on-wafer AM, a corresponding coordinate of the current-layer reticle to the semiconductor wafer is calibrated. Finally, a lithography process is performed to transfer the layout of the current-layer reticle AM to the top surface of the semiconductor wafer to form a corresponding current-layer on-wafer AM.

Abstract translation: 半导体晶片在半导体晶片的顶表面上具有至少一个晶片上对准标记（晶片上的预层）。 执行基线检查（BCHK）以将当前层掩模版上的当前层标线AM与晶片上的AM前层对准。 通过捕获和比较当前层标线AM和晶片AM上的晶片AM的信号，校准当前层掩模版对半导体晶片的对应坐标。 最后，进行光刻处理以将当前层标线AM的布局转移到半导体晶片的顶表面以形成相应的晶片上的电流层AM。

公开(公告)号：US6132113A

公开(公告)日：2000-10-17

申请号：US306260

申请日：1999-05-06

Applicant: Cheng-Hung Yu ,  Hsin-Min Lee ,  Yung-Chi Wu ,  Hsin-Ting Tsai

Inventor： Cheng-Hung Yu ,  Hsin-Min Lee ,  Yung-Chi Wu ,  Hsin-Ting Tsai

IPC: G03F7/30 ,  H01L21/00 ,  H01L21/687 ,  G03D5/00

CPC classification number: H01L21/68785 ,  G03F7/3021 ,  H01L21/6715 ,  H01L21/68792

Abstract: A developer cup. The developer cup includes a bed. A central spindle is vertically and rotatably coupled to a center of the bed through an end of the central spindle. A chuck is vertically coupled to an end of the central spindle opposite to the bed end. An upper coupling is coupled to the central spindle between the chuck and the bed, wherein the chuck. A lower coupling is moveably coupled to the central spindle between the upper coupling and the bed. The annular cup has an upper wheel and a lower wheel, wherein the upper wheel is aligned with the lower wheel, the upper wheel is coupled to the lower wheel through a plurality of the brackets, and the lower wheel is smaller than the upper wheel.

Abstract translation: 开瓶杯 显影杯包括一张床。 中心主轴通过中心主轴的一端垂直并可旋转地联接到床的中心。 卡盘垂直联接到与床端相对的中心轴的端部。 上连接件联接到卡盘和床之间的中心轴，其中卡盘。 下联接件可移动地联接到上联接器和床之间的中心主轴。 环形杯具有上轮和下轮，其中上轮与下轮对准，上轮通过多个托架联接到下轮，并且下轮小于上轮。

公开(公告)号：US6071094A

公开(公告)日：2000-06-06

申请号：US191801

申请日：1998-11-13

Applicant: Cheng-Hung Yu ,  Ming-Der Chou ,  Ching-Tsai Luo ,  Tung-Hsing Tien

Inventor： Cheng-Hung Yu ,  Ming-Der Chou ,  Ching-Tsai Luo ,  Tung-Hsing Tien

IPC: B05C11/10 ,  F04B43/08 ,  G03F7/16 ,  H01L21/00 ,  F04B45/027 ,  F04B53/10

CPC classification number: H01L21/6715 ,  B05C11/1002 ,  B05C11/1047 ,  F04B43/088 ,  G03F7/16

Abstract: A photoresist dispense pump receives photoresist from two pipelines, a first pipeline and a second pipeline, and pumps out the photoresist through a third pipeline. The photoresist dispense pump contains a first bellows and a second bellows receiving photoresist from the second pipeline, wherein the first bellows and the second bellows are separated by a partition. Photoresist is fed into the third pipeline from the second bellows. On the center region of the partition, there is a central diaphragm that allows photoresist to flow in a direction from the first bellows toward the second bellows, but not in the reverse direction.

Abstract translation: 光致抗蚀剂分配泵从两个管道接收光致抗蚀剂，第一管道和第二管道，并通过第三管道泵出光致抗蚀剂。 光刻胶分配泵包含第一波纹管和从第二管线接收光致抗蚀剂的第二波纹管，其中第一波纹管和第二波纹管被分隔开。 光阻胶从第二个波纹管进入第三个管道。 在隔板的中心区域，有一个中心隔膜，允许光致抗蚀剂在从第一波纹管朝向第二波纹管的方向上流动，但不反向流动。

公开(公告)号：US08137901B2

公开(公告)日：2012-03-20

申请号：US12128600

申请日：2008-05-28

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu

IPC: G03F7/20

CPC classification number: H01L27/14685 ,  G03F7/2022 ,  H01L27/14627 ,  H01L27/14643

Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.

Abstract translation: 公开了一种用于制造图像传感器的方法。 首先，提供半导体衬底，其中光敏区被限定在半导体衬底上。 然后在半导体衬底上形成至少一种感光材料，并进行第一曝光处理以在感光材料中形成锥形图案。 执行第二曝光处理以在感光材料中形成直脚图案，并且进行显影处理以去除锥形图案和直脚图案以将感光材料形成为多个感光块。 此后进行回流处理以将感光块形成多个微透镜。

公开(公告)号：US20110139188A1

公开(公告)日：2011-06-16

申请号：US12635710

申请日：2009-12-11

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Ming-Hsin Lee ,  Wei-Hong Chuang ,  Kuei-Chang Tung ,  Yan-Yi Lu ,  Chin-Chin Wang

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Ming-Hsin Lee ,  Wei-Hong Chuang ,  Kuei-Chang Tung ,  Yan-Yi Lu ,  Chin-Chin Wang

IPC: B08B3/00

CPC classification number: B08B3/04 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6708

Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.

Abstract translation: 一种晶片清洗装置，包括用于保持具有待清洗表面的晶片的晶片台，位于晶片上方的第一喷嘴，位于晶片上方的第二喷嘴。 第一高度在第一喷嘴和表面之间，第二高度在第二喷嘴和表面之间，其中第一高度比第二高度短。

公开(公告)号：US07473522B2

公开(公告)日：2009-01-06

申请号：US11754364

申请日：2007-05-28

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G02B3/00

CPC classification number: G03F7/0005 ,  B29D11/00365 ,  G02B3/0012 ,  G02B3/0043 ,  G02B3/0056 ,  G02B3/0068 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685

Abstract: A method for manufacturing micro-lenses of image sensors includes providing a semiconductor substrate having at least a planarization layer, performing a first photolithography process to form a first set of micro-lens blocks on the planarization layer, performing a first baking process to form a first set of micro-lenses, performing a first surface treatment to harden surfaces of the first set of micro-lenses, performing a second photolithography to form a second set of micro-lens blocks on the planarization layer, and performing a second baking process to form a second set of micro-lenses.

Abstract translation: 一种用于制造图像传感器的微透镜的方法包括提供至少具有平坦化层的半导体衬底，执行第一光刻处理以在平坦化层上形成第一组微透镜块，执行第一烘焙处理以形成 第一组微透镜，执行第一表面处理以硬化第一组微透镜的表面，执行第二光刻以在平坦化层上形成第二组微透镜块，并且执行第二烘焙处理 形成第二组微透镜。

公开(公告)号：US20080299498A1

公开(公告)日：2008-12-04

申请号：US11754364

申请日：2007-05-28

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G03C5/00

CPC classification number: G03F7/0005 ,  B29D11/00365 ,  G02B3/0012 ,  G02B3/0043 ,  G02B3/0056 ,  G02B3/0068 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685

Abstract: A method for manufacturing micro-lenses of image sensors includes providing a semiconductor substrate having at least a planarization layer, performing a first photolithography process to form a first set of micro-lens blocks on the planarization layer, performing a first baking process to form a first set of micro-lenses, performing a first surface treatment to harden surfaces of the first set of micro-lenses, performing a second photolithography to form a second set of micro-lens blocks on the planarization layer, and performing a second baking process to form a second set of micro-lenses.

Abstract translation: 一种用于制造图像传感器的微透镜的方法包括提供至少具有平坦化层的半导体衬底，执行第一光刻处理以在平坦化层上形成第一组微透镜块，执行第一烘焙处理以形成 第一组微透镜，执行第一表面处理以硬化第一组微透镜的表面，执行第二光刻以在平坦化层上形成第二组微透镜块，并且执行第二烘焙处理 形成第二组微透镜。