公开(公告)号：US20110061925A1

公开(公告)日：2011-03-17

申请号：US12654307

申请日：2009-12-16

Applicant: Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K9/00

CPC classification number: H05K1/0233 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0236 ,  H05K1/112 ,  H05K2201/086 ,  H05K2201/1003 ,  H01L2924/00014

Abstract: Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

Abstract translation: 公开了一种包括电磁带隙结构的印刷电路板。 用于阻挡噪声的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板; 布置在与第一导电板不同的平面上的第二导电板; 布置在与第二导电板的平面不同的平面上的第三导电板; 以及缝合通孔单元，其被配置为通过旁路布置所述第二导电板的平面并且包括第一电感器元件来连接所述第一导电板和所述第三导电板。

公开(公告)号：US20110026234A1

公开(公告)日：2011-02-03

申请号：US12654541

申请日：2009-12-22

Applicant: Han Kim ,  Chang-Sup Ryu

Inventor： Han Kim ,  Chang-Sup Ryu

IPC: H05K9/00 ,  H05K7/14

CPC classification number: H05K1/0237 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01Q1/526 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/183 ,  H05K9/0009 ,  H05K9/0052 ,  H05K2201/09681 ,  H05K2201/10371

Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

Abstract translation: 公开了印刷电路板和电子产品。 根据本发明的实施例，印刷电路板包括：第一板，其上安装有电子部件;第二板，其位于第一板的上侧，并且覆盖至少一部分 第一板的上表面，并且其中EBG结构插入到第二板中，使得从第一板向上辐射的噪声被屏蔽。 因此，印刷电路板可以容易地吸收各种频率，容易应用而没有任何天线效应，并且在制造中是成本有效的。

公开(公告)号：US20090184782A1

公开(公告)日：2009-07-23

申请号：US12232463

申请日：2008-09-17

Applicant: Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

Inventor： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC: H01P1/203

CPC classification number: H01P3/088 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

Abstract translation: 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。

公开(公告)号：USD593993S1

公开(公告)日：2009-06-09

申请号：US29326882

申请日：2008-10-27

Applicant: Han Kim ,  Eui-Hoon Kim

Designer： Han Kim ,  Eui-Hoon Kim

公开(公告)号：US07543264B2

公开(公告)日：2009-06-02

申请号：US11222398

申请日：2005-09-07

Applicant: Young Woo Kim ,  Chang Myung Ryu ,  Han Kim ,  Woo Lim Chae

Inventor： Young Woo Kim ,  Chang Myung Ryu ,  Han Kim ,  Woo Lim Chae

IPC: G06F17/50 ,  H02H7/00

CPC classification number: H05K1/0219 ,  H05K2201/09618

Abstract: A high frequency signal transmission line having reduced noise. Particularly, a signal transmission line of the current invention has reduced radiation noise and reflection noise, because a conventional ground guard fence line disposed between signal lines is separated into a plurality of ground line blocks that are spaced apart from each other to shield against noise.

Abstract translation: 具有降低噪声的高频信号传输线。 特别地，本发明的信号传输线由于将设置在信号线之间的传统的接地保护栅栏线分离成彼此间隔开的多个接地线块以防止噪声，所以本发明的信号传输线具有降低的辐射噪声和反射噪声。

公开(公告)号：USD593132S1

公开(公告)日：2009-05-26

申请号：US29327009

申请日：2008-10-29

Applicant: Han Kim

Designer： Han Kim

公开(公告)号：US20080314863A1

公开(公告)日：2008-12-25

申请号：US12203081

申请日：2008-09-02

Applicant: Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

Inventor： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

IPC: C23F1/00

CPC classification number: H05K1/162 ,  H05K3/0047 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09645 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.

Abstract translation: 公开了一种包括嵌入式电容器的PCB及其制造方法。 长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。

公开(公告)号：US20080196927A1

公开(公告)日：2008-08-21

申请号：US12004421

申请日：2007-12-21

Applicant: Jae Joon Lee ,  Han Kim ,  Il Soung Yoon ,  Seung Hyun Cho

Inventor： Jae Joon Lee ,  Han Kim ,  Il Soung Yoon ,  Seung Hyun Cho

IPC: H05K1/00

CPC classification number: H05K3/0097 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2203/1572

Abstract: Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in the opposite order with respect to each other, are appropriately disposed, by which the working panel can resist warpage due to thermal stress applied during the substrate fabrication process, thus imparting industrially useful effects that promise improvements in the standardization, productivity and yield of products.

Abstract translation: 公开了一种用于多层印刷电路板的工作面板。 用于多层印刷电路板的工作面板被构造成使得具有电路层和绝缘层的第一和第二条带以相对于彼此相反的顺序层叠在芯的上侧和下侧上 适当设置，通过该工作面板可以抵抗由于在基板制造工艺期间施加的热应力而产生的翘曲，从而赋予产品的标准化，生产率和产量提高的工业上有用的效果。

公开(公告)号：US20080185179A1

公开(公告)日：2008-08-07

申请号：US12010872

申请日：2008-01-30

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K1/11

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

Abstract translation: 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US07408120B2

公开(公告)日：2008-08-05

申请号：US11042360

申请日：2005-01-24

Applicant: Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Han Kim

Inventor： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Han Kim

IPC: H01R12/04

CPC classification number: H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09809

Abstract: Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.

Abstract translation: 公开了一种PCB，其具有轴向平行的通孔，其中用作接地的外部接地通孔围绕用于PCB中的电路连接的通孔形成，从而最小化由通孔引起的噪声的影响。