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31.
公开(公告)号:US11616126B2
公开(公告)日:2023-03-28
申请号:US16143641
申请日:2018-09-27
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , Lester Lampert , James S. Clarke , Nicole K. Thomas , Roman Caudillo , David J. Michalak , Jeanette M. Roberts
IPC: H01L29/12 , H01L29/66 , B82Y10/00 , G06N10/00 , H01L29/76 , H01L29/06 , H01L29/778 , H01L29/423 , H01L29/78 , H01L29/165 , H01L29/82 , H01L21/8234 , H01L29/16
Abstract: A quantum dot device is disclosed that includes a quantum well stack, a first and a second plunger gates above the quantum well stack, and a passive barrier element provided in a portion of the quantum well stack between the first and the second plunger gates. The passive barrier element may serve as means for localizing charge in the quantum dot device and may be used to replace charge localization control by means of a barrier gate. In general, a quantum dot device with a plurality of plunger gates provided over a given quantum well stack may include a respective passive barrier element between any, or all, of adjacent plunger gates in the manner as described for the first and second plunger gates.
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公开(公告)号:US11424324B2
公开(公告)日:2022-08-23
申请号:US16144148
申请日:2018-09-27
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , Lester Lampert , James S. Clarke , Nicole K. Thomas , Roman Caudillo , David J. Michalak , Jeanette M. Roberts
IPC: H01L29/15 , H01L29/66 , H01L29/51 , H01L23/522 , G06N10/00 , H01L29/40 , B82Y10/00 , H01L29/06 , H01L29/76 , H01L29/12 , H01L29/423 , H01L29/16 , B82Y30/00 , H01L29/778 , H01L29/82
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; a first gate and an adjacent second gate above the quantum well stack; and a multi-spacer between the first gate and the second gate, wherein the multi-spacer includes a first spacer and a second spacer different from the first spacer, and the first spacer is at least partially between the quantum well stack and the second spacer.
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公开(公告)号:US11417755B2
公开(公告)日:2022-08-16
申请号:US16649772
申请日:2018-01-08
Applicant: Intel Corporation
Inventor: Kanwaljit Singh , Ravi Pillarisetty , Nicole K. Thomas , Payam Amin , Roman Caudillo , Hubert C. George , Jeanette M. Roberts , Zachary R. Yoscovits , James S. Clarke , Lester Lampert , David J. Michalak
IPC: H01L29/66 , G06N10/00 , H01L29/43 , H01L29/49 , H01L29/778 , H01L29/78 , H01L29/82 , H01L29/12 , B82Y10/00 , H01L29/76
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer; a first gate above the quantum well stack, wherein the first gate includes a first gate metal; and a second gate above the quantum well stack, wherein the second gate includes a second gate metal, and a material structure of the second gate metal is different from a material structure of the first gate metal; wherein the quantum well layer has a first strain under the first gate, a second strain under the second gate, and the first strain is different from the second strain.
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公开(公告)号:US11264449B2
公开(公告)日:2022-03-01
申请号:US16828497
申请日:2020-03-24
Applicant: Intel Corporation
Inventor: Sudipto Naskar , Manish Chandhok , Abhishek A. Sharma , Roman Caudillo , Scott B. Clendenning , Cheyun Lin
IPC: H01L21/00 , H01L49/02 , H01L27/108
Abstract: Embodiments herein describe techniques for a semiconductor device including a three dimensional capacitor. The three dimensional capacitor includes a pole, and one or more capacitor units stacked around the pole. A capacitor unit of the one or more capacitor units includes a first electrode surrounding and coupled to the pole, a dielectric layer surrounding the first electrode, and a second electrode surrounding the dielectric layer. Other embodiments may be described and/or claimed.
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公开(公告)号:US20210328019A1
公开(公告)日:2021-10-21
申请号:US17364985
申请日:2021-07-01
Applicant: Intel Corporation
Inventor: Nicole K. Thomas , James S. Clarke , Jessica M. Torres , Ravi Pillarisetty , Kanwaljit Singh , Payam Amin , Hubert C. George , Jeanette M. Roberts , Roman Caudillo , David J. Michalak , Zachary R. Yoscovits , Lester Lampert
IPC: H01L29/12 , H01L21/8234 , H01L27/088 , H01L29/66 , H01L29/82
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer, wherein the quantum well layer includes an isotopically purified material; a gate dielectric above the quantum well stack; and a gate metal above the gate dielectric, wherein the gate dielectric is between the quantum well layer and the gate metal.
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公开(公告)号:US11114530B2
公开(公告)日:2021-09-07
申请号:US16648442
申请日:2017-12-17
Applicant: Intel Corporation
Inventor: Nicole K. Thomas , James S. Clarke , Jessica M. Torres , Ravi Pillarisetty , Kanwaljit Singh , Payam Amin , Hubert C. George , Jeanette M. Roberts , Roman Caudillo , David J. Michalak , Zachary R. Yoscovits , Lester Lampert
IPC: H01L29/12 , H01L21/8234 , H01L27/088 , H01L29/66 , H01L29/82
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer, wherein the quantum well layer includes an isotopically purified material; a gate dielectric above the quantum well stack; and a gate metal above the gate dielectric, wherein the gate dielectric is between the quantum well layer and the gate metal.
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37.
公开(公告)号:US10803396B2
公开(公告)日:2020-10-13
申请号:US16011812
申请日:2018-06-19
Applicant: Intel Corporation
Inventor: Zachary R. Yoscovits , Roman Caudillo , Ravi Pillarisetty , Hubert C. George , Adel A. Elsherbini , Lester Lampert , James S. Clarke , Nicole K. Thomas , Kanwaljit Singh , David J. Michalak , Jeanette M. Roberts
IPC: G06N10/00 , H01L27/18 , H03K19/195 , B82Y10/00 , H03K17/92 , G11C11/44 , H01L45/00 , H01L39/22 , H01L39/24 , H01L29/66
Abstract: Disclosed herein are superconducting qubit devices with Josephson Junctions utilizing resistive switching materials, i.e., resistive Josephson Junctions (RJJs), as well as related methods and quantum circuit assemblies. In some embodiments, an RJJ may include a bottom electrode, a top electrode, and a resistive switching layer (RSL) disposed between the bottom electrode and the top electrode. Using the RSLs in Josephson Junctions of superconducting qubits may allow fine tuning of junction resistance, which is particularly advantageous for optimizing performance of superconducting qubit devices. In addition, RJJs may be fabricated using methods that could be efficiently used in large-scale manufacturing, providing a substantial improvement with respect to approaches for forming conventional Josephson Junctions, such as e.g. double-angle shadow evaporation approach.
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公开(公告)号:US20200295164A1
公开(公告)日:2020-09-17
申请号:US16649772
申请日:2018-01-08
Applicant: Intel Corporation
Inventor: Kanwaljit Singh , Ravi Pillarisetty , Nicole K. Thomas , Payam Amin , Roman Caudillo , Hubert C. George , Jeanette M. Roberts , Zachary R. Yoscovits , James S. Clarke , Lester Lampert , David J. Michalak
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer; a first gate above the quantum well stack, wherein the first gate includes a first gate metal; and a second gate above the quantum well stack, wherein the second gate includes a second gate metal, and a material structure of the second gate metal is different from a material structure of the first gate metal; wherein the quantum well layer has a first strain under the first gate, a second strain under the second gate, and the first strain is different from the second strain.
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39.
公开(公告)号:US10686007B2
公开(公告)日:2020-06-16
申请号:US16012815
申请日:2018-06-20
Applicant: Intel Corporation
Inventor: Hubert C. George , Adel A. Elsherbini , Lester Lampert , James S. Clarke , Ravi Pillarisetty , Zachary R. Yoscovits , Nicole K. Thomas , Roman Caudillo , Kanwaljit Singh , David J. Michalak , Jeanette M. Roberts
Abstract: Embodiments of the present disclosure propose quantum circuit assemblies with transmission lines and/or capacitors that include layer-conductors oriented perpendicular to a substrate (i.e. oriented vertically) or a qubit die, with at least portions of the vertical layer-conductors being at least partially buried in the substrate. Such layer-conductors may form ground and signal planes of transmission lines or capacitor plates of capacitors of various quantum circuit assemblies.
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公开(公告)号:US10665770B2
公开(公告)日:2020-05-26
申请号:US15913799
申请日:2018-03-06
Applicant: Intel Corporation
Inventor: Ravi Pillarisetty , Kanwaljit Singh , Patrick H. Keys , Roman Caudillo , Hubert C. George , Zachary R. Yoscovits , Nicole K. Thomas , James S. Clarke , Roza Kotlyar , Payam Amin , Jeanette M. Roberts
IPC: H01L39/22 , H01L39/02 , H01L39/24 , H01L39/04 , G06N10/00 , H01L29/12 , H01L27/18 , H01L29/66 , B82Y10/00 , H01L39/14 , H01L29/76 , H01L29/423 , H01L29/06 , H01L29/16 , H01L21/8234
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a base; a fin extending away from the base, wherein the fin includes a quantum well layer; a gate above the fin; and a material on side faces of the fin; wherein the fin has a width between its side faces, and the fin is strained in the direction of the width.
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