公开(公告)号：US07607222B2

公开(公告)日：2009-10-27

申请号：US11708567

申请日：2007-02-21

Applicant: Myung-Sam Kang

Inventor： Myung-Sam Kang

IPC: H05K3/34 ,  H01L21/00

CPC classification number: H01L23/3114 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/20 ,  H05K3/284 ,  H05K3/4007 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first carrier board; stacking an insulation layer on the first carrier board and forming a circuit pattern, which includes a bonding pad and a solder ball pad, on the surface of the insulation layer; mounting an electronic component on the surface of the insulation layer and electrically connecting the electronic component and the bonding pad; and removing the first carrier board and the protrusion part, allows the mounting of the electronic component with just a single circuit pattern layer.

Abstract translation: 公开了一种电子部件封装及其制造方法。 一种制造电子部件封装的方法，包括：在第一载体板上形成突出部; 在第一载体板上堆叠绝缘层，并在绝缘层的表面上形成包括焊盘和焊球垫的电路图案; 将电子部件安装在所述绝缘层的表面上并电连接所述电子部件和所述焊盘; 并且移除第一载体板和突起部分允许仅使用单个电路图案层来安装电子部件。

公开(公告)号：US20090242238A1

公开(公告)日：2009-10-01

申请号：US12457166

申请日：2009-06-02

Applicant: Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

Inventor： Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC: H05K1/09

CPC classification number: H05K3/205 ,  H05K3/4038 ,  H05K3/4617 ,  H05K2203/0733 ,  H05K2203/1572

Abstract: A buried pattern substrate includes an insulation layer; a circuit pattern buried in the insulation layer such that a part thereof is exposed at a surface of the insulation layer; and a stud bump buried in the insulation layer such that one end portion is exposed at one surface of the insulation layer, and such that the other end portion is exposed at the other surface of the insulation layer.

Abstract translation: 掩埋图案衬底包括绝缘层; 埋置在绝缘层中的电路图案，使得其一部分在绝缘层的表面露出; 以及埋在所述绝缘层中的螺柱凸起，使得一个端部暴露在所述绝缘层的一个表面处，并且使得所述另一端部暴露在所述绝缘层的另一个表面处。

公开(公告)号：US20090206468A1

公开(公告)日：2009-08-20

申请号：US12385316

申请日：2009-04-03

Applicant: Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer.

Abstract translation: 一种制造片上封装的方法，包括在载体膜上层叠干膜，其一面由薄金属膜层压; 通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; 去除干膜; 层压除了形成焊球垫的部分之外的上光阻焊剂; 蚀刻形成在上层光阻焊层未层叠的部分上的金属薄膜; 通过倒装芯片焊接将半导体芯片安装在焊球垫上; 用钝化材料成型半导体芯片; 去除载体膜和金属薄膜; 并在焊球下方层叠下光阻焊剂。 由于使用种子层形成电路图案，片上封装芯片提供了高密度电路。

公开(公告)号：US20080314619A1

公开(公告)日：2008-12-25

申请号：US12076117

申请日：2008-03-13

Applicant: Ki-Hwan Kim ,  Jee-Soo Mok ,  Myung-Sam Kang

Inventor： Ki-Hwan Kim ,  Jee-Soo Mok ,  Myung-Sam Kang

IPC: B05D5/12 ,  H01B1/00 ,  B05D3/00 ,  H05K1/00 ,  H01B1/02

CPC classification number: H05K1/095 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/1461

Abstract: A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.

Abstract translation: 公开了一种导电浆料，使用导电浆料的印刷电路板以及印刷电路板的制造方法。 包括导电颗粒，聚合物和聚合物泡沫的导电糊可以减少打印重复次数，从而简化制造过程，缩短处理时间并提高可靠性。

公开(公告)号：US20080102410A1

公开(公告)日：2008-05-01

申请号：US11976211

申请日：2007-10-22

Applicant: Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

Inventor： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

IPC: G03C5/00

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/108 ,  H05K3/20 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A method of manufacturing a printed circuit board is disclosed, in which a cavity is formed for embedding a component, which includes: providing a core board, in which an inner circuit is buried; forming a first via in the core board for interlayer conduction; selectively forming a first photoresist in a position on the core board in correspondence with a position of the cavity; stacking a first build-up layer, on which a first outer circuit is formed, on the core board; and selectively removing the first build-up layer in correspondence with the position of the cavity and removing the first photoresist. Utilizing the method, a board can be manufactured with greater precision, as the thickness tolerance of the cavity may be obtained by controlling the thickness of the photoresist, and the overall thickness of the board can be controlled by controlling the height of the cavity.

Abstract translation: 公开了一种制造印刷电路板的方法，其中形成用于嵌入部件的空腔，其包括：提供其中埋入内部电路的芯板; 在芯板中形成层间导电的第一通孔; 在所述芯板上与所述腔的位置对应地选择性地形成第一光致抗蚀剂; 在芯板上堆叠形成有第一外部电路的第一堆积层; 并且与空腔的位置相对应地选择性地去除第一堆积层并除去第一光致抗蚀剂。 利用该方法，可以通过控制光致抗蚀剂的厚度来获得更高精度的板，因为通过控制光致抗蚀剂的厚度可以获得空腔的厚度公差，并且可以通过控制空腔的高度来控制板的整体厚度。

公开(公告)号：US20070065988A1

公开(公告)日：2007-03-22

申请号：US11524403

申请日：2006-09-21

Applicant: Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

Inventor： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

IPC: H01L21/00

CPC classification number: H05K3/4652 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4697 ,  H05K2201/09536 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: A method for manufacturing a substrate having a cavity is disclosed. The method comprises: (a) forming a first circuit patter on both sides of a seed layer by use of a first dry film, the seed layer being for forming a circuit pattern on both sides; (b) laminating a second dry film on the first dry film on both sides of the seed layer, the thickness of the second dry film corresponding to the depth of the cavity to be formed; (c) laminating a dielectric layer on an area outside of where the cavity is to be formed on both sides of the seed layer, the thickness of the dielectric layer corresponding to the depth of the cavity to be formed; (d) laminating on the seed layer a copper foil laminated master having a second circuit pattern; and (e) forming the cavity by peeling off the first dry film and the second dry film after removing the seed layer. The method for manufacturing a substrate with a cavity in accordance with the present invention can improve the efficiency of a substrate manufacturing process by using both sides of a seed layer to manufacture the substrate with a cavity.

Abstract translation: 公开了一种用于制造具有空腔的衬底的方法。 该方法包括：（a）通过使用第一干膜在种子层的两侧形成第一电路图案，种子层用于在两侧形成电路图案; （b）在种子层两侧的第一干膜上层叠第二干膜，第二干膜的厚度对应于待形成的空腔的深度; （c）在种子层的两侧上在要形成空腔的区域之外的区域层叠电介质层，电介质层的厚度对应于待形成的空腔的深度; （d）在种子层上层叠具有第二电路图案的铜箔层叠主板; 和（e）通过在去除种子层之后剥离第一干膜和第二干膜来形成空腔。 根据本发明的用于制造具有空腔的基板的方法可以通过使用种子层的两面来制造具有空腔的基板来提高基板制造工艺的效率。

公开(公告)号：US20050060732A1

公开(公告)日：2005-03-17

申请号：US10704811

申请日：2003-11-12

Applicant: Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

Inventor： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

IPC: G11B7/09 ,  G11B7/08 ,  G11B7/085 ,  G11B7/22 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

CPC classification number: H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

Abstract: An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

Abstract translation: 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。

公开(公告)号：US20120225521A1

公开(公告)日：2012-09-06

申请号：US13472317

申请日：2012-05-15

Applicant: Mi-Sun Hwang ,  Myung-Sam Kang

Inventor： Mi-Sun Hwang ,  Myung-Sam Kang

IPC: H01L21/50

CPC classification number: H01L23/498 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed.

Abstract translation: 公开了一种单层片上封装衬底及其制造方法。 根据本发明的实施例的单层片上封装基板包括：具有穿孔的窗口的绝缘体，布线图案，引线接合焊盘和焊球垫，其嵌入在 绝缘体和阻焊层，其形成在绝缘体的一个表面上，使得阻焊层覆盖布线图案，但是引线接合焊盘和焊球垫的至少一部分被暴露。

公开(公告)号：US20110303636A1

公开(公告)日：2011-12-15

申请号：US13137505

申请日：2011-08-22

Applicant: Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

Inventor： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

IPC: H05K3/22

CPC classification number: H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

Abstract: A method of manufacturing a mounting substrate, the method including: providing an insulation layer, the insulation layer having a circuit pattern formed in one side thereof; forming at least one bonding pad in the other side of the insulation layer, the bonding pad electrically connected with the circuit pattern; and etching the bonding pad such that a surface of the bonding pad is recessed from a surface of the insulation layer by a predetermined depth.

Abstract translation: 一种安装基板的制造方法，所述方法包括：提供绝缘层，所述绝缘层具有形成在其一侧的电路图案; 在所述绝缘层的另一侧形成至少一个焊盘，所述焊盘与所述电路图案电连接; 以及蚀刻所述焊盘，使得所述焊盘的表面从所述绝缘层的表面凹陷预定深度。

公开(公告)号：US08003439B2

公开(公告)日：2011-08-23

申请号：US12385316

申请日：2009-04-03

Applicant: Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC: H01L21/00

CPC classification number: H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer.

Abstract translation: 一种制造片上封装的方法，包括在载体膜上层叠干膜，其一面由薄金属膜层压; 通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; 去除干膜; 层压除了形成焊球垫的部分之外的上光阻焊剂; 蚀刻形成在上层光阻焊层未层叠的部分上的金属薄膜; 通过倒装芯片焊接将半导体芯片安装在焊球垫上; 用钝化材料成型半导体芯片; 去除载体膜和金属薄膜; 并在焊球下方层叠下光阻焊剂。 由于使用种子层形成电路图案，片上封装芯片提供了高密度电路。