公开(公告)号：US20210305308A1

公开(公告)日：2021-09-30

申请号：US17345929

申请日：2021-06-11

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Nan Guo ,  Jingfei He ,  Zhenyu Chen ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Ye Wu ,  Zhen Huang ,  Zhongyu Luan

IPC: H01L27/146 ,  H05K1/18 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H04N5/225

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

公开(公告)号：US10979610B2

公开(公告)日：2021-04-13

申请号：US16484292

申请日：2018-02-08

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Zhongyu Luan ,  Liefeng Chen ,  Duanliang Cheng ,  Bojie Zhao ,  Takehiko Tanaka ,  Zhen Huang

IPC: H04N5/225

Abstract: The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.

公开(公告)号：US10908324B2

公开(公告)日：2021-02-02

申请号：US15317117

申请日：2016-10-28

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  G02B3/00 ,  G02B7/00

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US10582097B2

公开(公告)日：2020-03-03

申请号：US16392595

申请日：2019-04-23

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Zhenyu Chen ,  Takehiko Tanaka ,  Zhongyu Luan ,  Bojie Zhao ,  Zhen Huang ,  Nan Guo ,  Fengsheng Xi ,  Heng Jiang ,  Zilong Deng

IPC: H04N5/225

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

公开(公告)号：US10578837B2

公开(公告)日：2020-03-03

申请号：US15784167

申请日：2017-10-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  G02B13/00 ,  H01L27/146 ,  G02B3/00 ,  G02B7/00 ,  H04M1/02 ,  H01L25/065

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US10274694B2

公开(公告)日：2019-04-30

申请号：US15679146

申请日：2017-08-16

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H05K3/34 ,  G02B7/02 ,  G02B3/00 ,  G02B5/20 ,  G02B7/00 ,  H04M1/02 ,  H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  B29C45/14 ,  H01L27/146 ,  H01L21/56 ,  H01L25/065 ,  G02B13/00 ,  B29L31/34

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US10033913B2

公开(公告)日：2018-07-24

申请号：US15473605

申请日：2017-03-30

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  G02B7/02 ,  H05K1/02 ,  G02B3/00 ,  G02B7/00 ,  H05K1/18

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US20180009141A1

公开(公告)日：2018-01-11

申请号：US15679146

申请日：2017-08-16

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: B29C45/14 ,  H04M1/02 ,  G02B7/02 ,  G02B7/00 ,  G02B5/20 ,  H04N5/225 ,  H01L27/146 ,  B29L31/34

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.