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    Optoelectronic module comprising an optical waveguide and method for producing same
    32.
    发明授权
    Optoelectronic module comprising an optical waveguide and method for producing same 有权
    包括光波导的光电模块及其制造方法

    公开(公告)号：US09356210B2

    公开(公告)日：2016-05-31

    申请号：US14370211

    申请日：2013-01-11

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann ,  Stefan Illek

    IPC: H01L29/18 ,  H01L33/00 ,  H01L33/60 ,  G02B27/09 ,  H01L27/15 ,  H01L33/50 ,  H01L25/075

    CPC classification number: H01L33/60 ,  G02B27/0905 ,  G02B27/0994 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    Abstract: An optoelectronic module (202, 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226, 228, 230, 232, 234) comprises a carrier (102), at which and/or in which are arranged at least two semiconductor chips (104, 104a1, 104a2, 104b; 106, 106a1, 106a2, 106b, 106c) for emitting electromagnetic radiation (108a, 108b). An emission unit (110) for emitting electromagnetic radiation (109) from the optoelectronic module (202, 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226, 228, 230, 232, 234) is arranged on or in the carrier (102). At least one of the semiconductor chips (106, 106a1, 106a2, 106b, 106c) is spaced apart from the emission unit (110). A waveguide (112) guides the electromagnetic radiation (108a) of the at least one spaced-apart semiconductor chip (106, 106a1, 106a2, 106b, 106c) to the emission unit (110). The emission unit (110) has a coupling-out structure (114, 114a, 114b, 114c) for coupling out the electromagnetic radiation (108a) from the waveguide (112).

    Abstract translation: 光电子模块（202,204,206,208,210,212,214,216,218,220,222,224,226,228,230,232,234,226,228,220,232,224,226,228,230,232,234,234,226,228,220,232,224,226,228,230,232,234,224,226,228,230,232,234,224,226,228,230,232 其中布置有用于发射电磁辐射（108a，108b）的至少两个半导体芯片（104,104a1,104a2,104b; 106,106a1,106a2,106b，106c）。 一种用于从光电子模块（202,204,206,208,210,212,214,216,218,220,222,224,226,228,230,232,232,218,218,220,222,224,226,228,230,232,232）发射电磁辐射（109）的发射单元（110） 234）布置在载体（102）上或载体（102）中。 半导体芯片（106,106a1,106a2,106b，106c）中的至少一个与发射单元（110）间隔开。 波导（112）将至少一个间隔开的半导体芯片（106,106a1,106a2,106b，106c）的电磁辐射（108a）引导到发射单元（110）。 发射单元（110）具有用于从波导（112）耦合出电磁辐射（108a）的耦合输出结构（114,114a，114b，114c）。

    Arrangement Comprising a Plurality of Lighting Modules and Method for Producing an Arrangement Comprising a Plurality of Lighting Modules
    37.
    发明申请
    Arrangement Comprising a Plurality of Lighting Modules and Method for Producing an Arrangement Comprising a Plurality of Lighting Modules 审中-公开

    公开(公告)号：US20200251450A1

    公开(公告)日：2020-08-06

    申请号：US16622669

    申请日：2018-06-13

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Dominik Scholz ,  Siegfried Herrmann

    IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

    Abstract: An arrangement having a plurality of lighting modules and a method for producing an arrangement having a plurality of lighting modules are disclosed. In an embodiment an arrangement includes a plurality of lighting modules held by a carrier, each lighting module having a plurality of optoelectronic components arranged in a first number of rows and a second number of columns, wherein the lighting modules include a respective first number of first electrodes and a respective second number of second electrodes, wherein the optoelectronic components of a respective row of the rows are electrically connected to one of the first electrodes of the respective lighting module, wherein the optoelectronic components of a respective column of the columns are electrically connected to one of the second electrodes of the respective lighting module, and wherein the carrier includes one third electrode per row and one fourth electrode per column, the electrodes being electrically contactable in each case from outside the carrier.

    Method for Manufacturing a Plurality of Surface Mounted Optoelectronic Devices and Surface Mounted Optoelectronic Device
    38.
    发明申请
    Method for Manufacturing a Plurality of Surface Mounted Optoelectronic Devices and Surface Mounted Optoelectronic Device 审中-公开

    公开(公告)号：US20200052165A1

    公开(公告)日：2020-02-13

    申请号：US16498291

    申请日：2018-03-20

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann

    IPC: H01L33/48 ,  H01L33/00 ,  H01L33/62 ,  H01L33/58

    Abstract: A method for manufacturing a plurality of surface mounted optoelectronic devices and a surface mounted optoelectronic device are disclosed. In an embodiment, a surface mounted optoelectronic device includes a transparent base body having a mounting rear side, a radiation exit side opposite the mounting rear side, and mounting side surfaces which are each disposed transversely to the radiation exit side, a semiconductor layer sequence disposed laterally to at least one mounting side surface and a terminal contact extending from the at least one mounting side surface to the mounting rear side, wherein the semiconductor layer sequence includes an active region configured to emit radiation so that the radiation decouples from the surface mounted optoelectronic device via the radiation exit side of the base body.

    OPTOELECTRONIC COMPONENT HAVING SIDE CONTACTS
    39.
    发明申请
    OPTOELECTRONIC COMPONENT HAVING SIDE CONTACTS 审中-公开

    公开(公告)号：US20190027666A1

    公开(公告)日：2019-01-24

    申请号：US16073605

    申请日：2017-01-26

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Dominik Scholz ,  Siegfried Herrmann

    IPC: H01L33/62 ,  H01L21/56 ,  H01L33/48 ,  H01L23/00

    CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L24/04 ,  H01L33/486 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2924/18162 ,  H01L2933/0066

    Abstract: An optoelectronic component includes a light emitting semiconductor chip, including an emission side and comprising an underside, wherein the optoelectronic component is configured to emit light via the emission side, the optoelectronic component including an insulating layer, the light emitting semiconductor chip is embedded into the insulating layer, the light emitting semiconductor chip including two electrical contact locations, the contact locations face away from the emission side, a first and a second electrically conductive contact layer are provided, respectively, an electrically conductive contact layer electrically conductively connects to a contact location of the semiconductor chip, the electrically conductive contact layers are arranged in the insulating layer, the first electrically conductive contact layer adjoins a first side face of the optoelectronic component, and the second electrically conductive contact layer adjoins a second side face of the optoelectronic component.

    SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT
    40.
    发明申请
    SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT 审中-公开

    公开(公告)号：US20180249578A1

    公开(公告)日：2018-08-30

    申请号：US15902282

    申请日：2018-02-22

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Frank Singer ,  Siegfried Herrmann

    IPC: H05K1/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/64

    CPC classification number: H05K1/181 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64 ,  H01L2933/0066 ,  H05K2201/10454

    Abstract: A semiconductor component includes first and second connection contacts provided to electrically contact a semiconductor body, a carrier on which a semiconductor chip is arranged, the carrier including a base body including a chip mounting surface and a connection surface opposite the chip mounting surface and at least one side surface, that connects the chip mounting surface to the connection surface, a first electrically conductive contact layer electrically conductively connected to the first connection contact, and a second electrically conductive contact layer electrically conductively connected to the second connection contact, wherein the first and the second contact layer are applied to the base body and each include a first partial region arranged on the chip mounting surface, a second partial region arranged on a side surface and a third partial region arranged on the connection surface, and wherein the base body contains a radiation-transmissive base material.

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