公开(公告)号：US08253028B2

公开(公告)日：2012-08-28

申请号：US12298468

申请日：2007-04-27

Applicant: Per Ligander

Inventor： Per Ligander

IPC: H05K1/16

CPC classification number: H01L23/24 ,  H01L23/057 ,  H01L23/5385 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0243 ,  H05K1/183 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.

Abstract translation: 微波芯片支撑结构技术领域本发明涉及一种微波芯片支撑结构，其包括具有第一侧面和第二侧面以及外部极限的第一微波层叠层。 在朝向所述外界限延伸的所述第一侧上形成至少一个导体。 微波芯片支撑结构还包括具有第一侧和第二侧的第二微波层压层，第二层叠层的第二侧被固定在第一层压层的第一侧的至少一部分上。 第一层压层和/或第二层压层包括至少一个用于接收旨在连接到所述导体的微波芯片的凹槽。 第二层压层延伸到第一层压层的外部极限之外，所述导体在第二层压层的第二侧上延续，而不与第一层压层接触。

公开(公告)号：US08183960B2

公开(公告)日：2012-05-22

申请号：US12373541

申请日：2006-07-13

Applicant: Per Ligander ,  Marcus Karl Hasselblad

Inventor： Per Ligander ,  Marcus Karl Hasselblad

IPC: H01P7/06

CPC classification number: H01P1/208 ,  H01P11/007 ,  Y10T29/49016

Abstract: A waveguide filter comprising a matching means for matching the filter. The waveguide filter comprises a housing comprising a cavity having a predetermined first volume. The matching means is in the form of a volume element having a predetermined second volume being matched to the first volume forming a predetermined volume to volume ratio. The matching means is fitted into the cavity in a fixed non-adjustable manner in relationship to the housing. The invention refers also to a method for manufacturing of such a waveguide filter.

Abstract translation: 一种波导滤波器，包括用于匹配滤波器的匹配装置。 波导滤波器包括壳体，该壳体包括具有预定第一体积的空腔。 匹配装置是体积元件的形式，其具有与形成预定体积/体积比的第一容积相匹配的预定第二容积。 匹配装置以与壳体相关的固定不可调方式装配到空腔中。 本发明还涉及这种波导滤波器的制造方法。

公开(公告)号：US20120068316A1

公开(公告)日：2012-03-22

申请号：US13319171

申请日：2009-05-08

Applicant: Per Ligander

Inventor： Per Ligander

IPC: H01L23/48

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/19039 ,  H01L2924/30107 ,  H01P5/107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a transition from a chip to a waveguide port (47, 47′, 11), the chip (1, 1′, 62) having a first main side (3, 3′, 66) and a second main side (4, 4′, 67), where the first main side (3, 3′, 66) comprises at least one input port (35, 36, 37, 38, 39), arranged to receive an input signal, at least one output port (44, 45; 72), arranged to output an output signal, and at least one electrical functionality. One port (44, 72) of said ports (44, 45; 72; 35, 36, 37, 38, 39) is electrically connected to an electrically conducting probe (48, 48′, 73) that is arranged to extend from said one port (44, 72) and at least partly over the waveguide port (47, 47′, 77) such that a signal may be transferred between said one port (44, 72) and the waveguide port (47, 47′, 77). The present invention also relates to a corresponding package.

Abstract translation: 本发明涉及从芯片到波导端口（47,47'，11）的转变，芯片（1,1'，62）具有第一主侧面（3,3'，66）和第二主体 （3,4'，67），其中第一主侧（3,3'，66）包括至少一个输入端口（35,36,37,38,39），其布置成至少接收输入信号 布置成输出输出信号的一个输出端口（44,45; 72）和至少一个电功能。 所述端口（44,45; 72; 35,36,37,38,39）的一个端口（44,72）电连接到导电探针（48,48'，73），所述导电探针被布置成从所述 一个端口（44,72）并且至少部分地在波导端口（47,47'，77）之上，使得信号可以在所述一个端口（44,72）和波导端口（47,47'，77）之间传送 ）。 本发明还涉及相应的包装。

公开(公告)号：US20110037531A1

公开(公告)日：2011-02-17

申请号：US12988309

申请日：2008-04-16

Applicant: Marcus Karl Hasselblad ,  Per Ligander ,  Simone Bastioli ,  Uwe Rosenberg

Inventor： Marcus Karl Hasselblad ,  Per Ligander ,  Simone Bastioli ,  Uwe Rosenberg

IPC: H01P5/107

CPC classification number: H05K1/0243 ,  H01P1/025 ,  H01P5/02 ,  H01P5/024 ,  H01P5/087 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09845

Abstract: The present invention relates to a transition arrangement comprising two surface-mountable waveguide parts and a dielectric carrier material with a metallization and a ground plane provided on a respective first main side and second main side Surface-mountable waveguide parts comprise a first wall, a second wall, and a third wall, which second and third walls are arranged to contact a part of the metallization, all the walls together essentially forming a U-shape, the surface-mountable waveguide parts also comprising respective bend parts. The metallization on the first main side is removed such that a first aperture and a second aperture are formed, the apertures being enclosed by a frame of via holes electrically connecting the ground plane with the metallization, the bend parts being fitted such that the apertures permit passage of a microwave signal propagating via the bend parts. Then the dielectric carrier material itself acts as a waveguide transition between the first aperture and the second aperture.

Abstract translation: 本发明涉及包括两个表面可安装的波导部件和具有金属化的介电载体材料和设置在相应的第一主侧和第二主侧面上的接地平面的过渡装置，表面安装的波导部件包括第一壁，第二壁 壁和第三壁，其中第二和第三壁布置成接触金属化的一部分，所有壁基本上形成U形，表面安装的波导部件还包括相应的弯曲部分。 去除第一主侧上的金属化，使得形成第一孔和第二孔，孔由被连接接地平面与金属化的通孔的框架围绕，弯曲部分被装配成使得孔允许 通过弯曲部分传播的微波信号。 然后介电载体材料本身用作第一孔和第二孔之间的波导过渡。

公开(公告)号：US20080190653A1

公开(公告)日：2008-08-14

申请号：US11912607

申请日：2005-04-25

Applicant: Ola Tageman ,  Per Ligander

Inventor： Ola Tageman ,  Per Ligander

IPC: H05K1/00

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K3/3426 ,  H05K7/205 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/10848 ,  Y02P70/611 ,  Y10T29/49826

Abstract: The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.

Abstract translation: 本发明涉及电子设备的表面安装组件。 更具体地说，它涉及高频电子部件的安装，以及用于低成本电路板的高效冷却。 特别涉及高效运输热量并消除微波设备中的气隙。

公开(公告)号：US06690583B1

公开(公告)日：2004-02-10

申请号：US09574243

申请日：2000-05-19

Applicant: Leif Bergstedt ,  Per Ligander

Inventor： Leif Bergstedt ,  Per Ligander

IPC: H05K702

CPC classification number: H01L24/82 ,  H01L21/4807 ,  H01L23/3731 ,  H01L23/3737 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043

Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

Abstract translation: 提供了用于一个或几个电子部件并且在至少一个表面上为部件提供空间的载体。 载体具有至少部分导电的低温烧结陶瓷（LTCC）材料，具有良好的导热能力，使得载体为组件提供机械支撑并传导部件产生的热量。

公开(公告)号：US06552265B1

公开(公告)日：2003-04-22

申请号：US09412697

申请日：1999-10-05

Applicant: Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

Inventor： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

IPC: H07L2328

CPC classification number: H05K1/186 ,  H05K1/185 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49169

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract translation: 紧凑的印刷电路板组件具有安装在其上的电子部件（5,12）的图案化铜涂覆的基板（1）。 根据组件的高度，SBU漆（11）或非流动预浸料（3）和层压板（4）围绕电子部件。 然后将该子组件夹在两个RC（树脂涂覆的）铜箔（8）之间，树脂（7）面向部件（5,12）并将它们进行掩埋，从而提供可通过微孔连接的新的可蚀刻铜表面 （10）连接到嵌入式部件（5,12）。