Abstract:
A transition (100, 300) from microstrip to waveguide, the waveguide comprising first (120) and second (105, 105′, 105″) interior surfaces connected by side walls (115, 116) whose height (h1, h2, h3) is the shortest distance between said interior surfaces, and a microstrip structure (130, 135, 110) extending into the closed waveguide (105). The microstrip structure comprises a microstrip conductor (130, 135) on a dielectric layer arranged on said first interior surface. The microstrip conductor (130,135) comprises and is terminated inside the closed waveguide by a patch (135). The height (h1) of the side walls (115, 116) along the distance that the microstrip conductor (130, 135) extends into the closed waveguide (105) being less than half of the greatest height (h3) beyond the microstrip structure's protrusion into the closed waveguide (105).
Abstract:
The present invention relates to an arrangement comprising at least one high potential electrode with a high potential in terms of absolute value, e.g. comprising substantially sharp edges and which may be exposed to a high electrostatic field or a high potential. It comprises at least one low potential electrode means or balancing electrode Q mean said low or balancing potential electrode means being provided at a distance from said at least one high potential electrode and at least one resistive arrangement connecting each of said high potential electrode(s) with each respective Q adjacent low or balancing potential electrode means. Said resistive arrangement(s) has a low conductivity but Q is non-isolating, such that a substantially linear voltage drop is provided between said high potential electrode(s) and said low or balancing potential electrode(s) to suppress peak-fields generated in the vicinity of any of the electrode(s).
Abstract:
An electronic circuit (200, 300, 400, 500) which comprises a flat circuit board with a layer of a non-conducting material with opposing first and second main surfaces, with a central ground pad arranged on a part of the first main surface and a ground plane arranged on the second main surface which protrudes beyond the central ground pad. There is a flat no leads package (100) arranged on the central ground pad. The flat no leads package (100) comprises a central plate (105) with protrusions (110, 120, 130, 140) which protrude beyond the central ground pad and overlap the ground plane (210). The electronic circuit (200, 300, 400, 500) comprises a grounding network (235, 240, 245, 230; 405, 435; 535, 545) connected to the ground plane (213) and to at least one protrusion (110, 120, 130, 140), thereby connecting the at least one protrusion (110, 120, 130, 140) electrically to the ground plane (210).
Abstract:
An electronic circuit (200, 300, 400, 500) which comprises a flat circuit board with a layer of a non-conducting material with opposing first and second main surfaces, with a central ground pad arranged on a part of the first main surface and a ground plane arranged on the second main surface which protrudes beyond the central ground pad. There is a flat no leads package (100) arranged on the central ground pad. The flat no leads package (100) comprises a central plate (105) with protrusions (110, 120, 130, 140) which protrude beyond the central ground pad and overlap the ground plane (210). The electronic circuit (200, 300, 400, 500) comprises a grounding network (235, 240, 245, 230; 405, 435; 535, 545) connected to the ground plane (213) and to at least one protrusion (110, 120, 130, 140), thereby connecting the at least one protrusion (110, 120, 130, 140) electrically to the ground plane (210).
Abstract:
A transition (100, 300) from microstrip to waveguide, the waveguide comprising first (120) and second (105, 105′, 105″) interior surfaces connected by side walls (115, 116) whose height (h1, h2, h3) is the shortest distance between said interior surfaces, and a microstrip structure (130, 135, 110) extending into the closed waveguide (105). The microstrip structure comprises a microstrip conductor (130, 135) on a dielectric layer arranged on said first interior surface. The microstrip conductor (130, 135) comprises and is terminated inside the closed waveguide by a patch (135). The height (h1) of the side walls (115, 116) along the distance that the microstrip conductor (130, 135) extends into the closed waveguide (105) being less than half of the greatest height (h3) beyond the microstrip structure's protrusion into the closed waveguide (105).
Abstract:
A lens (300, 500) is disclosed for steering the exit direction (Ω) of an incident electromagnetic wave. The lens comprises a main body (210, 510) of a ferroelectric material with a first main surface (207, 507) and a first transformer (220, 222). The electromagnetic wave enters and exits the lens through the transformer, and the lens comprises means (370, 380) for creating a DC-field in a first direction in the main body. The main body (210, 510) of ferroelectric material comprises a plurality (21011-210NN, 51011-510NN) of slabs of the ferroelectric material, each slab also comprising a first (403, 603) and a second electrode of a conducting material. The means for creating a DC-field can create a gradient DC-field in the first direction using the first and second electrodes, so that the dielectric constant in the main body will also be a gradient in the first direction, thus enabling steering of the existing electromagnetic wave.
Abstract:
A lens (300, 500) is disclosed for steering the exit direction (Ω) of an incident electromagnetic wave. The lens comprises a main body (210, 510) of a ferroelectric material with a first main surface (207, 507) and a first transformer (220, 222). The electromagnetic wave enters and exits the lens through the transformer, and the lens comprises means (370, 380) for creating a DC-field in a first direction in the main body. The main body (210, 510) of ferroelectric material comprises a plurality (21011-210NN, 51011-510NN) of slabs of the ferroelectric material, each slab also comprising a first (403, 603) and a second electrode of a conducting material. The means for creating a DC-field can create a gradient DC-field in the first direction using the first and second electrodes, so that the dielectric constant in the main body will also be a gradient in the first direction, thus enabling steering of the existing electromagnetic wave.
Abstract:
The present invention relates to an arrangement comprising at least one high potential electrode with a high potential in terms of absolute value, e.g. comprising substantially sharp edges and which may be exposed to a high electrostatic field or a high potential. It comprises at least one low potential electrode means or balancing electrode Q mean said low or balancing potential electrode means being provided at a distance from said at least one high potential electrode and at least one resistive arrangement connecting each of said high potential electrode(s) with each respective Q adjacent low or balancing potential electrode means. Said resistive arrangement(s) has a low conductivity but Q is non-isolating, such that a substantially linear voltage drop is provided between said high potential electrode(s) and said low or balancing potential electrode(s) to suppress peak-fields generated in the vicinity of any of the electrode(s).
Abstract:
The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.