公开(公告)号：US20230215721A1

公开(公告)日：2023-07-06

申请号：US17647040

申请日：2022-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  YuJeong Jang ,  JiWon Lee

IPC: H01L21/02 ,  H01L21/67 ,  B08B5/02 ,  B08B15/02 ,  B08B5/04

CPC classification number: H01L21/02057 ,  H01L21/67028 ,  B08B5/02 ,  B08B15/02 ,  B08B5/04

Abstract: A semiconductor manufacturing equipment has a support platform and a substrate disposed over the support platform. A first electrical component is disposed over a first surface of the substrate. A second electrical component is disposed over a second surface of the substrate opposite the first surface of the substrate. A suction hood is disposed over the substrate. A gas is introduced over the substrate to circulate residue while drawing the residue vertically into the suction hood. The gas can be introduced with a gas nozzle or air knife. The gas can be introduced from a gas conduit disposed at least partially around the substrate. The gas conduit can extend completely around the substrate. The gas nozzles are sequentially placed around the gas conduit. The gas can be a stable or inert gas. The residue is displaced away from the second electrical component.

公开(公告)号：US20230170245A1

公开(公告)日：2023-06-01

申请号：US17457074

申请日：2021-12-01

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  DaePark Lee ,  YoungKang Lee ,  YongJin Jeong

IPC: H01L21/683 ,  H01L23/552 ,  H01L21/48

CPC classification number: H01L21/6836 ,  H01L23/552 ,  H01L21/4814

Abstract: A semiconductor device is formed using a jig. The jig includes a metal frame, a polymer film, and an adhesive layer disposed between the metal frame and polymer film. An opening is formed through the adhesive layer and polymer film. A groove is formed around the opening. A semiconductor package is disposed on the jig over the opening with a side surface of the semiconductor package adjacent to the groove. A shielding layer is formed over the semiconductor package and jig. The semiconductor package is removed from the jig.

公开(公告)号：US11664327B2

公开(公告)日：2023-05-30

申请号：US16950295

申请日：2020-11-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20220359420A1

公开(公告)日：2022-11-10

申请号：US17314916

申请日：2021-05-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20220199545A1

公开(公告)日：2022-06-23

申请号：US17126621

申请日：2020-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/033

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US12288781B2

公开(公告)日：2025-04-29

申请号：US18355906

申请日：2023-07-20

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung

IPC: A61B5/02 ,  H01L21/56 ,  H01L21/78 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US20240113038A1

公开(公告)日：2024-04-04

申请号：US18511428

申请日：2023-11-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22

CPC classification number: H01L23/552 ,  H01L21/486 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/2283

Abstract: A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20240063137A1

公开(公告)日：2024-02-22

申请号：US17820957

申请日：2022-08-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee Jung ,  ChangOh Kim

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L24/16 ,  H01L25/165 ,  H01L25/162 ,  H01L23/49816 ,  H01L23/49838 ,  H01L21/4853 ,  H01L21/4817 ,  H01L2924/3025 ,  H01L2224/16225 ,  H01L2924/16151 ,  H01L2924/1616

Abstract: A semiconductor device includes a substrate. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component. A vertical interconnect structure is disposed in the encapsulant. A shielding layer is formed over the encapsulant and vertical interconnect structure. A groove is formed in the shielding layer around the vertical interconnect structure. A portion of the shielding layer remains over the vertical interconnect structure as a contact pad.

公开(公告)号：US20240006335A1

公开(公告)日：2024-01-04

申请号：US17810028

申请日：2022-06-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  OMin Kwon

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulant, and second encapsulant.

公开(公告)号：US20230207485A1

公开(公告)日：2023-06-29

申请号：US18174790

申请日：2023-02-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/033 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L24/13 ,  H01L21/565 ,  H01L21/0334 ,  H01L23/3107 ,  H01L2924/15313

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.