公开(公告)号：US20080052251A1

公开(公告)日：2008-02-28

申请号：US11843400

申请日：2007-08-22

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: G06Q99/00 ,  G06F17/00

CPC classification number: G06Q10/06 ,  G06Q30/0283

Abstract: A charging method for a semiconductor device manufacturing apparatus, which can appropriately and promptly distribute profits between a customer and a manufacturer according to the yield of semiconductor devices. An indicator related to the yield of the semiconductor devices is measured, and a fee is charged for the usage of the semiconductor device manufacturing apparatus according to the measured indicator.

Abstract translation: 一种用于半导体器件制造装置的充电方法，其可以根据半导体器件的产量适当且及时地在客户和制造商之间分配利润。 测量与半导体器件的产量相关的指示符，并且根据测量的指示器对半导体器件制造装置的使用收取费用。

公开(公告)号：US20120247502A1

公开(公告)日：2012-10-04

申请号：US13495404

申请日：2012-06-13

Applicant: Tsuyoshi MORIYA ,  Hiroshi Nagaike ,  Hiroyuki Nakayama

Inventor： Tsuyoshi MORIYA ,  Hiroshi Nagaike ,  Hiroyuki Nakayama

IPC: B08B7/04

CPC classification number: H01L21/67028 ,  B08B3/12 ,  H01J37/32862 ,  H01L21/6831

Abstract: To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.

Abstract translation: 为了通过使颗粒粘附到元件上来清洁真空室中的元件散射，本发明使用了一种用于向元件施加电压并且通过利用麦克斯韦应力使颗粒散射的装置，用于对颗粒进行充电的装置和 通过利用库仑力使颗粒散射，用于将气体引入真空室中并通过使气体冲击波撞击元件而使颗粒粘附到元件上的装置，用于加热元件并引起 通过利用热应力和热压力来散射的颗粒，或通过对元件施加机械振动来使颗粒散射的装置。 通过在相对高压气氛中的气流中携带它们来除去如此散落的颗粒。

公开(公告)号：US20120174773A1

公开(公告)日：2012-07-12

申请号：US13422668

申请日：2012-03-16

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: B03C3/34

CPC classification number: B03C3/014 ,  B01D46/0023 ,  B01D46/0032 ,  B01D46/0063 ,  B01D46/42 ,  B01D46/4218 ,  B01D46/46 ,  B01D2275/305 ,  B03C3/08 ,  B03C3/09 ,  B03C3/368 ,  B03C3/455 ,  H01L21/67069 ,  H01L21/67167 ,  Y10S55/10

Abstract: A gas purification apparatus capable of removing fine particles of substantially any size without lowering the efficiency of gas supply. A loader module of a substrate processing apparatus includes a fan filter unit for producing a downward flow of atmospheric air in the internal space of a transfer chamber. The fan filter unit includes a fan for generating an atmospheric air flow, a filter of mesh structure for trapping and removing particles mixed in the atmospheric air flow, an irradiation heater disposed between the fan and the filter, and a high temperature part disposed in the atmospheric air flow and higher in temperature than the filter.

Abstract translation: 一种气体净化装置，其能够在不降低气体供给效率的情况下除去基本上任何尺寸的微粒。 基板处理装置的装载机模块包括用于在传送室的内部空间中产生向下的大气空气流的风扇过滤器单元。 风扇过滤器单元包括用于产生大气气流的风扇，用于捕集和去除在大气中混合的颗粒的网状结构的过滤器，设置在风扇和过滤器之间的照射加热器，以及设置在风扇过滤器中的高温部分 大气气流和温度高于过滤器。

公开(公告)号：US20110242510A1

公开(公告)日：2011-10-06

申请号：US13158675

申请日：2011-06-13

Applicant: Hiroshi NAGAIKE ,  Tsuyoshi MORIYA

Inventor： Hiroshi NAGAIKE ,  Tsuyoshi MORIYA

IPC: G03B27/32 ,  C23F1/08 ,  H01L21/00 ,  H01L21/66

CPC classification number: H01L21/67161 ,  G01N21/91 ,  G01N21/94 ,  G01N21/9501 ,  H01J37/023 ,  H01J37/256 ,  H01J2237/20228 ,  H01L21/6719 ,  H01L21/67213

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract translation: 能够检测附着于基板表面的微小的异物的基板处理系统，适用于大量生产基板。 基板处理系统具有对基板进行预定处理的基板处理装置。 基板处理系统包括具有流体供给单元的基板表面处理装置，该流体供给单元向基板的表面供给包含改变在基板的表面露出的物质的变质物质的流体，以及检查基板表面检查装置 已经供应流体的基底的表面。

公开(公告)号：US20110204027A1

公开(公告)日：2011-08-25

申请号：US13031653

申请日：2011-02-22

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: C03C15/02 ,  C09K13/00 ,  B05D7/00 ,  H01L21/306

CPC classification number: C09K3/1463 ,  B24B37/015 ,  B24B37/044 ,  B24B57/02 ,  B82Y10/00 ,  B82Y40/00 ,  C03C19/00 ,  C08K3/22 ,  C08K9/08 ,  C09D7/67 ,  C09G1/02 ,  C09K3/1409 ,  G03F1/24

Abstract: Abrasive particles having a particle diameter of not more than 100 nm are manufactured from raw material. The manufactured abrasive particles are separately dispersed, and are coated with a polymer. Coated abrasive particles having a particle diameter of not more than 100 nm are selected and are mixed with a liquid component of a slurry to manufacture the slurry. A pH adjuster and a viscosity agent are added to the slurry. A glass substrate is polished using the manufactured slurry. Since the abrasive particles having a particle diameter of more than 100 nm or an agglomerate of the cohering abrasive particles does not contact the glass and does not cause big scratches on the glass, the generation of the scratches of 70 nm or more on the glass during polishing are suppressed.

Abstract translation: 由原料制造粒径为100nm以下的研磨粒子。 制造的磨料颗粒分开分散，并用聚合物涂覆。 选择粒径不大于100nm的涂覆磨料颗粒，并与浆料的液体组分混合以制备浆料。 向浆料中加入pH调节剂和粘度剂。 使用制造的浆料对玻璃基板进行抛光。 由于具有大于100nm的粒径的研磨颗粒或聚结研磨颗粒的聚集体不接触玻璃并且不会在玻璃上引起大的划痕，所以在玻璃上产生70nm以上的划痕 抛光被抑制。

公开(公告)号：US20110204024A1

公开(公告)日：2011-08-25

申请号：US13031674

申请日：2011-02-22

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: C03C15/00

CPC classification number: C03C19/00 ,  B24B37/005 ,  B24B37/042 ,  C03C17/28 ,  C03C23/0005

Abstract: A defect distribution in the vicinity of a surface of a glass substrate is inspected by a positron annihilation gamma ray measurement. A buffer layer including a brittle layer and/or a coating layer is created on the surface of the glass substrate. The brittle layer is formed by irradiating a gas cluster ion on the surface to deteriorate the glass. The coating layer is formed by coating the surface with a soft substance. Next, a thickness of the created buffer layer is measured by a positron annihilation gamma ray measurement. The surface of the glass substrate is then cleaned. To create a slurry, abrasive particles for the slurry are uniformly scattered on a polishing implement for polishing the glass substrate and a liquid component for the slurry is added thereto. The glass substrate is then chemically mechanically polished from the buffer layer with the slurry.

Abstract translation: 通过正电子湮灭伽马射线测量来检查玻璃基板表面附近的缺陷分布。 在玻璃基板的表面上形成包含脆性层和/或涂层的缓冲层。 通过在表面上照射气体团簇离子形成脆性层，使玻璃劣化。 涂层通过用软物质涂覆表面而形成。 接下来，通过正电子湮灭伽马射线测量来测量所产生的缓冲层的厚度。 然后清洁玻璃基板的表面。 为了产生浆料，用于浆料的磨料颗粒均匀地分散在用于抛光玻璃基材的抛光工具上，并且向其中添加用于浆料的液体组分。 然后将玻璃基板用浆料从缓冲层进行化学机械抛光。

公开(公告)号：US20090258148A1

公开(公告)日：2009-10-15

申请号：US12490931

申请日：2009-06-24

Applicant: Tsuyoshi MORIYA ,  Hiroyuki NAKAYAMA ,  Hiroshi NAGAIKE

Inventor： Tsuyoshi MORIYA ,  Hiroyuki NAKAYAMA ,  Hiroshi NAGAIKE

IPC: B05D3/10

CPC classification number: C23C16/4404

Abstract: A ceramic spray-coated member capable of surely controlling adhesion and detachment of water is produced by spraying a given ceramic onto a surface of a base material, in which an organic matter adsorbed on a surface of the ceramic spray-coated member is removed and the surface of the ceramic spray-coated member is stabilized by chemically bonding to water.

Abstract translation: 通过将给定的陶瓷喷涂到基材的表面上，除去吸附在陶瓷喷涂构件的表面上的有机物质，从而产生能够可靠地控制水的附着和分离的陶瓷喷涂构件， 通过化学键合到水来稳定陶瓷喷涂构件的表面。