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    CHIPLETS WITH CONNECTION POSTS
    31.
    发明申请
    CHIPLETS WITH CONNECTION POSTS 审中-公开
    具有连接位置的CHIPLETS

    公开(公告)号：US20170048976A1

    公开(公告)日：2017-02-16

    申请号：US14822864

    申请日：2015-08-10

    Applicant: X-Celeprint limited

    Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

    IPC: H05K1/11 ,  H01L23/00

    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

    Abstract translation: 组件包括在与组件的背面相对的处理侧上的多个电连接。 每个电连接包括从工艺侧突出的导电多层连接柱。 印刷结构包括目的基板和一个或多个部件。 目的衬底具有两个或更多个电触头，并且每个连接柱与目的衬底的电触点接触，延伸进入或延伸穿过目的衬底的电接触，以将电触点电连接到连接柱。 连接柱或电触点变形。 两个或更多个连接柱可以电连接到公共电触头。

    PRINTABLE INORGANIC SEMICONDUCTOR STRUCTURES
    34.
    发明申请
    PRINTABLE INORGANIC SEMICONDUCTOR STRUCTURES 审中-公开

    公开(公告)号：US20190326470A1

    公开(公告)日：2019-10-24

    申请号：US16502387

    申请日：2019-07-03

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

    IPC: H01L33/00 ,  H01L33/20 ,  H01L33/32 ,  H01L33/62 ,  H01L33/44 ,  H01L33/36 ,  H01L33/38 ,  H01L29/78 ,  H01L33/26 ,  H01L33/40 ,  H01L21/683

    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

    MICRO-TRANSFER-PRINTABLE FLIP-CHIP STRUCTURES AND METHODS
    35.
    发明申请
    MICRO-TRANSFER-PRINTABLE FLIP-CHIP STRUCTURES AND METHODS 审中-公开

    公开(公告)号：US20190326149A1

    公开(公告)日：2019-10-24

    申请号：US16502350

    申请日：2019-07-03

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

    IPC: H01L21/683 ,  B65G47/91 ,  H01L21/67 ,  H01L33/62 ,  H01L33/00

    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

    Micro-transfer-printable flip-chip structures and methods
    36.
    发明授权
    Micro-transfer-printable flip-chip structures and methods 有权

    公开(公告)号：US10395966B2

    公开(公告)日：2019-08-27

    申请号：US15944223

    申请日：2018-04-03

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

    IPC: H01L21/683 ,  H01L21/67 ,  H01L33/00 ,  H01L33/62 ,  B65G47/91 ,  H01L25/075 ,  H01L33/20 ,  H01L33/38

    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

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