公开(公告)号：US20120011395A1

公开(公告)日：2012-01-12

申请号：US12833871

申请日：2010-07-09

Applicant: Cheng-Zing Chou ,  Yu-Chiang Cheng

Inventor： Cheng-Zing Chou ,  Yu-Chiang Cheng

IPC: G06F11/16

CPC classification number: G06F11/1417

Abstract: A boot method under a boot sector failure in a hard disk is provided, which includes the following steps. First, a detection unit is utilized to determine whether a boot sector in the hard disk fails. After determining that the boot sector fails, the detection unit utilizes a second boot file stored in a solid state disk (SSD) for booting. Meanwhile, the detection unit drives a pickup head in the hard disk to skip the failed boot sector and move to a normal sector in the hard disk, so as to boot a computer and enable the hard disk to operate normally.

Abstract translation: 提供硬盘引导扇区故障引导方法，其中包括以下步骤。 首先，使用检测单元来确定硬盘中的引导扇区是否发生故障。 在确定引导扇区失败之后，检测单元利用存储在固态盘（SSD）中的第二引导文件进行引导。 同时，检测单元驱动硬盘中的拾取头，跳过失败的启动扇区并移动到硬盘中的正常扇区，以便引导计算机并使硬盘正常工作。

公开(公告)号：US08035980B2

公开(公告)日：2011-10-11

申请号：US12472205

申请日：2009-05-26

Applicant: Yu-Chiang Cheng ,  Kuo-Ming Chuang

Inventor： Yu-Chiang Cheng ,  Kuo-Ming Chuang

IPC: H05K7/00

CPC classification number: H05K1/024 ,  H01P3/026 ,  H01P3/085 ,  H01P5/185 ,  H05K1/025 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Abstract translation: 提供了通过使用不同的参考平面来修改特性阻抗的电路结构。 该结构包括模拟信号线，数字信号线，用于模拟信号的相应参考平面和用于数字信号的对应参考平面。 其中，模拟信号线的线宽与数字信号线的线宽相同。 此外，模拟信号线与对应的模拟信号参考平面之间的距离长于数字信号线与对应的数字信号参考平面之间的距离。 因此，可以解决信号传输期间的特征阻抗失配，并且可以提高信号传输的质量。

公开(公告)号：US07782270B2

公开(公告)日：2010-08-24

申请号：US12153738

申请日：2008-05-23

Applicant: Shyh-Jong Chung ,  Ching-Wei Ling ,  Yu-Chiang Cheng

Inventor： Shyh-Jong Chung ,  Ching-Wei Ling ,  Yu-Chiang Cheng

IPC: H01Q1/48 ,  H01Q9/38

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q5/371

Abstract: Disclosed is a planar inverted-F antenna with an extended grounding plane. The planar inverted-F antenna has a grounding metal plate having a selected side edge on which the extended grounding plane is formed and has a predetermined height. At least one antenna signal radiating plate is connected to the grounding metal plate by a short-circuit piece and is substantially parallel to and spaced from the grounding metal plate by a distance. A feeding point extends from the antenna signal radiating plate in a direction toward the grounding metal plate and corresponds to the extended grounding plane with a predetermined gap therebetween. With the arrangement of the extended grounding plane, the impedance matching of the antenna is improved and the impedance bandwidth of the antenna is increased.

Abstract translation: 公开了具有扩展接地平面的平面倒F天线。 平面倒F天线具有接地金属板，所述接地金属板具有选定的侧边缘，所述扩展接地平面形成在该边缘上并具有预定高度。 至少一个天线信号辐射板通过短路片连接到接地金属板，并且与接地金属板基本上平行并间隔一定距离。 馈电点从天线信号辐射板沿着接地金属板的方向延伸，并且对应于延伸的接地平面，其间具有预定的间隙。 随着扩展接地平面的布置，天线的阻抗匹配得到改善，天线的阻抗带宽增加。

公开(公告)号：US07671809B2

公开(公告)日：2010-03-02

申请号：US11404814

申请日：2006-04-17

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q1/24

CPC classification number: H01Q1/2266 ,  H01Q1/38 ,  H01Q1/40

Abstract: Disclosed is an antenna device for transceiving a wireless signal with an ion-implanted antenna pattern implanted inside a casing of an electronic device. The ion-implanted antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the ion-implanted antenna pattern, while the connection could be either by an antenna signal feeding line connected to the ion-implanted antenna pattern and the antenna module, or by an antenna coupling element coupled with the ion-implanted antenna pattern and connected to an antenna signal feeding line.

Abstract translation: 公开了一种天线装置，用于利用植入电子设备的壳体内的离子注入天线图来收发无线信号。 离子注入的天线图案连接到电子设备的母板的天线模块，以便馈送由离子注入天线图案收发的无线信号，而连接可以是通过连接到 离子注入天线图案和天线模块，或通过与离子注入天线图案耦合并连接到天线信号馈送线的天线耦合元件。

公开(公告)号：US20090231065A1

公开(公告)日：2009-09-17

申请号：US12472205

申请日：2009-05-26

Applicant: Yu-Chiang Cheng ,  Kuo-Ming Chuang

Inventor： Yu-Chiang Cheng ,  Kuo-Ming Chuang

IPC: H01P3/08 ,  H05K1/03

CPC classification number: H05K1/024 ,  H01P3/026 ,  H01P3/085 ,  H01P5/185 ,  H05K1/025 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Abstract translation: 提供了通过使用不同的参考平面来修改特性阻抗的电路结构。 该结构包括模拟信号线，数字信号线，用于模拟信号的相应参考平面和用于数字信号的对应参考平面。 其中，模拟信号线的线宽与数字信号线的线宽相同。 此外，模拟信号线与对应的模拟信号参考平面之间的距离长于数字信号线与对应的数字信号参考平面之间的距离。 因此，可以解决信号传输期间的特征阻抗失配，并且可以提高信号传输的质量。

公开(公告)号：US07427807B2

公开(公告)日：2008-09-23

申请号：US11356070

申请日：2006-02-17

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H01L23/34

CPC classification number: H01L23/3736 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2224/0401

Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Abstract translation: 本发明公开了一种用于芯片散热的制造方法和结构。 该散热结构包括电路结构的底板，中央处理单元的模具和盖。 该盖通常用于进行从芯片产生的废热。 盖可以由特殊的导热材料制成，包括具有高导热性的碳元素的金属和支架结构，以提高热传导的效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法进行。 碳元素的支架结构可以涂覆在金属表面上，也可以混入金属中。

公开(公告)号：US20080169986A1

公开(公告)日：2008-07-17

申请号：US11878674

申请日：2007-07-26

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q1/22

CPC classification number: G06F1/1616 ,  G06F1/1637 ,  H01Q1/2258 ,  H01Q1/48

Abstract: Disclosed is an antenna device arranged inside a display module of an electronic device with a conductive portion. The antenna device includes an antenna element with a ground plane and a signal feeding end for transceiving a wireless signal, an antenna signal feeding line coupled to the signal feeding end of the antenna element for feeding the wireless signal transceived by the antenna element. At least one mounting element for fixing the antenna element onto the casing and forcing the ground plane of the antenna electrically contacting with the conductive portion of the casing, so that the conductive porting serves as an extended ground for the ground plane of the antenna element;

Abstract translation: 公开了一种布置在具有导电部分的电子设备的显示模块内的天线装置。 天线装置包括具有接地平面的天线元件和用于收发无线信号的信号馈送端，耦合到天线元件的信号馈送端的天线信号馈送线，用于馈送由天线元件收发的无线信号。 至少一个安装元件，用于将天线元件固定到壳体上并迫使天线的接地平面与壳体的导电部分电接触，使得导电端口用作天线元件的接地平面的延伸接地;

公开(公告)号：US20070236317A1

公开(公告)日：2007-10-11

申请号：US11584616

申请日：2006-10-23

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01F17/00

CPC classification number: E05C1/10 ,  E05B15/04 ,  E05B17/22 ,  E05B65/006 ,  E05B2015/0444 ,  G06F1/1616 ,  G06F1/1679 ,  G06F1/1698 ,  H01F21/04

Abstract: An electronic device includes a helical resilient member serving as an electrical inductance element. The electronic device also includes an antenna, a signal feeding line, and a transmitting/receiving module. The helical resilient member has first and second ends with a predetermined number of turns of coil arranged therebetween the first and second ends, and is made of electrically conductive materials so that the turns of coil defines an electrical inductance. The signal feeding line is connected between the helical resilient member and a signal feed point of the antenna. The transmitting/receiving module is connected to the helical resilient member so as to couple the inductance of the helical resilient member to the transmitting/receiving module.

Abstract translation: 电子装置包括用作电感元件的螺旋弹性构件。 电子设备还包括天线，信号馈送线和发射/接收模块。 螺旋弹性构件具有在第一和第二端之间设置有预定数量的线圈的第一和第二端，并且由导电材料制成，使得线圈的匝限定电感。 信号馈送线连接在螺旋弹性构件和天线的信号馈送点之间。 发射/接收模块连接到螺旋弹性构件，以将螺旋弹性构件的电感耦合到发射/接收模块。

公开(公告)号：USRE39766E1

公开(公告)日：2007-08-14

申请号：US10943256

申请日：2004-09-15

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0191

Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates disposed sequentially one above the other; first, second, third and fourth signal wiring layers; first, second and third ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 7.5 mil. Each of the second and sixth insulating substrates has a thickness ranging from 3 to 13 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 15 mil. The fourth insulating substrate has a thickness ranging from 2 to 6 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first and second ground wiring layers. The third signal wiring layer has a third resistance with respect to the third ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the third ground wiring layer. The first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

Abstract translation: 多层电路板包括依次一个上下设置的第一，第二，第三，第四，第五，第六和第七绝缘衬底; 第一，第二，第三和第四信号布线层; 第一，第二和第三接地布线层; 和电力布线层。 第一和第七绝缘基板中的每一个的厚度范围为2.5至7.5密耳。 第二和第六绝缘基板中的每一个具有3至13密耳的厚度。 第三和第五绝缘基板中的每一个具有3至15密耳的厚度。 第四绝缘基板具有2至6密耳的厚度。 第一信号布线层相对于第一接地布线层具有第一电阻。 第二信号布线层相对于第一和第二接地布线层具有第二电阻。 第三信号布线层相对于第三接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于第三接地布线层具有第四电阻。 第一，第二，第三和第四电阻在49.5至60.5欧姆的范围内。

公开(公告)号：US20060255451A1

公开(公告)日：2006-11-16

申请号：US11307850

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H01L23/34

CPC classification number: C09J9/00 ,  C08L63/00 ,  C08L79/08 ,  C09J11/04 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3737 ,  H01L23/473 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01068

Abstract: This invention discloses a manufacturing process method and a structure for a heat conduction interface material. This heat conduction interface material is often used as a buffer interface between chips and heat dissipation devices and is conducted the waste heat from the chips. The heat conduction interface material can be combined a plastic material and a bracket structure of carbon element. The corresponding manufacturing process method for this heat conduction interface material comprises a mixed process that is composed of a plastic material and a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity, so as to improve the efficiency of heat conduction. The bracket structure of carbon element can be mixed into the metal and resins.

Abstract translation: 本发明公开了一种导热界面材料的制造方法和结构。 这种导热界面材料通常用作芯片和散热装置之间的缓冲接口，并且进行来自芯片的废热。 导热界面材料可以结合塑料材料和碳元素的支架结构。 用于该导热界面材料的相应制造方法包括由塑料材料和碳元素的支架结构组成的混合工艺。 碳元素的支架结构具有高导热性，从而提高导热效率。 碳元素的支架结构可以混入金属和树脂中。