公开(公告)号：US07393784B2

公开(公告)日：2008-07-01

申请号：US11550780

申请日：2006-10-18

Applicant: Yu-Fu Kang

Inventor： Yu-Fu Kang

IPC: H01L21/44

CPC classification number: B81C1/0015

Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.

Abstract translation: 一种制造悬架结构的方法，包括提供衬底，形成孔和填充衬底上的孔的牺牲层，在衬底和牺牲层上形成图案化的光致抗蚀剂层，曝光一部分衬底的图案化光刻胶层和 牺牲层，在衬底上形成结构层，图案化光致抗蚀剂层和牺牲层，执行剥离工艺以去除图案化的光致抗蚀剂层和光致抗蚀剂图案之上的结构层，以及执行干蚀刻工艺以去除 牺牲层为了使结构层和孔变成悬架结构和腔室。

公开(公告)号：US07392687B2

公开(公告)日：2008-07-01

申请号：US11162527

申请日：2005-09-13

Applicant: Ter-Chang Huang ,  Hung-Yi Lin ,  Wen-Syang Hsu

Inventor： Ter-Chang Huang ,  Hung-Yi Lin ,  Wen-Syang Hsu

IPC: G01L27/00

CPC classification number: G01L25/00 ,  Y10T29/49004

Abstract: A piezoresistive pressure sensor test sample is first provided, and a zero offset of the piezoresistive pressure sensor test sample is measured. Subsequently, a stress deviation corresponding to the zero offset is calculated. Thereafter, at least a piezoresistive pressure sensor under the same process condition as the piezoresistive pressure sensor test sample is formed. When forming the piezoresistive pressure sensor, at least a stress-adjusting thin film is formed on at least a surface of the piezoresistive pressure sensor to calibrate the zero offset of the piezoresistive pressure sensor.

Abstract translation: 首先提供压阻式压力传感器测试样品，并测量压阻式压力传感器测试样品的零点偏移。 随后，计算对应于零偏移的应力偏差。 此后，至少形成与压阻式压力传感器测试样品相同工艺条件下的压阻式压力传感器。 当形成压阻压力传感器时，至少在压阻式压力传感器的表面上形成应力调节薄膜，以校准压阻式压力传感器的零点偏移。

公开(公告)号：US07235185B2

公开(公告)日：2007-06-26

申请号：US11163989

申请日：2005-11-07

Applicant: I-Ju Chen

Inventor： I-Ju Chen

IPC: B44C1/22 ,  H01L21/301

CPC classification number: B81C1/00896 ,  B81C2201/053 ,  Y10S438/928

Abstract: A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.

Abstract translation: 提供了包括前表面和后表面的晶片。 晶片还包括前表面上的前图案，前图案具有多个孔。 在前表面上形成低粘度流体并填充到孔中。 之后，形成高粘度流体并通过扩散填充到孔中。

公开(公告)号：US07821094B2

公开(公告)日：2010-10-26

申请号：US12247236

申请日：2008-10-08

Applicant: Hung-Yi Lin ,  Hong-Da Chang

Inventor： Hung-Yi Lin ,  Hong-Da Chang

IPC: H01L21/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.

Abstract translation: 发光二极管结构具有硅衬底，导电层和发光二极管。 硅衬底的顶表面具有杯结构像抛物面，并且杯结构的底部具有贯穿硅衬底的多个通孔。 导电层填充通孔并从通孔突出。 发光二极管设置在从通孔突出的导电层的顶部，并且位于杯结构的焦点处。

公开(公告)号：US07531457B2

公开(公告)日：2009-05-12

申请号：US11561902

申请日：2006-11-21

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/20

CPC classification number: B81C1/0015 ,  B81C2201/0108 ,  B81C2201/0132

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract translation: 一种制造悬挂结构的方法。 首先，提供包含通过热硬化的光致抗蚀剂层的基板。 随后，蚀刻硬化的光致抗蚀剂层，以使光致抗蚀剂层变成预定的边缘轮廓。 此后，在基板的一部分和光致抗蚀剂层的一部分上形成结构层。 接下来，进行干蚀刻处理以去除光致抗蚀剂层，并将结构层转变成悬浮结构。

公开(公告)号：US07465601B2

公开(公告)日：2008-12-16

申请号：US11736593

申请日：2007-04-18

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/62

CPC classification number: B81C1/0015

Abstract: A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front surface of the substrate. The second sacrificial layer has an opening exposing a part of the substrate and a part of the first sacrificial layer. A structural layer is formed covering the abovementioned sacrificial layers. Thereafter, a lift-off process is performed to remove the second sacrificial layer and define the pattern of the structural layer. A first etching process is performed on a back surface of the substrate utilizing the first sacrificial layer as an etching barrier and a through hole is formed under the first sacrificial layer. A second etching layer is performed to remove the first sacrificial layer and a suspended structure is thereby formed.

Abstract translation: 公开了一种形成悬挂结构的方法。 首先，提供基板。 图案化的第一牺牲层和图案化的第二牺牲层形成在衬底的前表面上。 第二牺牲层具有暴露基板的一部分和第一牺牲层的一部分的开口。 形成覆盖上述牺牲层的结构层。 此后，执行剥离处理以去除第二牺牲层并限定结构层的图案。 利用第一牺牲层作为蚀刻阻挡层，在基板的背面上进行第一蚀刻工艺，并且在第一牺牲层下形成通孔。 执行第二蚀刻层以去除第一牺牲层，由此形成悬挂结构。