公开(公告)号：US07235185B2

公开(公告)日：2007-06-26

申请号：US11163989

申请日：2005-11-07

Applicant: I-Ju Chen

Inventor： I-Ju Chen

IPC: B44C1/22 ,  H01L21/301

CPC classification number: B81C1/00896 ,  B81C2201/053 ,  Y10S438/928

Abstract: A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.

Abstract translation: 提供了包括前表面和后表面的晶片。 晶片还包括前表面上的前图案，前图案具有多个孔。 在前表面上形成低粘度流体并填充到孔中。 之后，形成高粘度流体并通过扩散填充到孔中。

公开(公告)号：US20070026674A1

公开(公告)日：2007-02-01

申请号：US11163989

申请日：2005-11-07

Applicant: I-Ju Chen

Inventor： I-Ju Chen

IPC: H01L21/302

CPC classification number: B81C1/00896 ,  B81C2201/053 ,  Y10S438/928

Abstract: A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.

Abstract translation: 提供了包括前表面和后表面的晶片。 晶片还包括前表面上的前图案，前图案具有多个孔。 在前表面上形成低粘度流体并填充到孔中。 之后，形成高粘度流体并通过扩散填充到孔中。

公开(公告)号：US08846623B2

公开(公告)日：2014-09-30

申请号：US13816613

申请日：2011-10-25

Applicant: John Yu ,  Alice L. Yu ,  H. C. Wu ,  Sheng-Hung Wang ,  I-Ju Chen

Inventor： John Yu ,  Alice L. Yu ,  H. C. Wu ,  Sheng-Hung Wang ,  I-Ju Chen

IPC: A61K38/00 ,  A61K31/496 ,  A61K47/48 ,  A61K45/06 ,  A61K38/10 ,  A61K49/00 ,  C07K5/117 ,  A61K31/337 ,  C07K7/08 ,  A61K31/475 ,  A61K51/12 ,  A61K31/704 ,  A61K9/127

CPC classification number: G06F19/16 ,  A61K9/127 ,  A61K9/1271 ,  A61K31/337 ,  A61K31/475 ,  A61K31/496 ,  A61K31/704 ,  A61K38/10 ,  A61K45/06 ,  A61K47/48815 ,  A61K47/6911 ,  A61K49/0043 ,  A61K49/0056 ,  A61K51/1234 ,  C07K5/1024 ,  C07K7/08 ,  G01N2333/47 ,  G01N2500/04 ,  A61K2300/00

Abstract: Cancer-targeting peptides having a PX1LX2 motif, in which X1 is His or an amino acid residue with a hydrophobic side chain and X2 is Pro, Phe, or Trp. Also disclosed herein are conjugates containing the cancer-targeting peptides and uses thereof in cancer treatment and diagnosis.

Abstract translation: 具有PX1LX2基序的癌靶向肽，其中X1是His或具有疏水侧链的氨基酸残基，X2是Pro，Phe或Trp。 本文还公开了含有癌靶向肽的缀合物及其在癌症治疗和诊断中的用途。

公开(公告)号：US20130142867A1

公开(公告)日：2013-06-06

申请号：US13816613

申请日：2011-10-25

Applicant: John Yu ,  Alice L. Yu ,  H.C. Wu ,  I-Ju Chen ,  Sheng-Hung Wang

Inventor： John Yu ,  Alice L. Yu ,  H.C. Wu ,  I-Ju Chen ,  Sheng-Hung Wang

IPC: C07K7/08 ,  A61K31/704 ,  A61K9/127 ,  A61K38/10 ,  A61K45/06

CPC classification number: G06F19/16 ,  A61K9/127 ,  A61K9/1271 ,  A61K31/337 ,  A61K31/475 ,  A61K31/496 ,  A61K31/704 ,  A61K38/10 ,  A61K45/06 ,  A61K47/48815 ,  A61K47/6911 ,  A61K49/0043 ,  A61K49/0056 ,  A61K51/1234 ,  C07K5/1024 ,  C07K7/08 ,  G01N2333/47 ,  G01N2500/04 ,  A61K2300/00

Abstract: Cancer-targeting peptides having a PX1LX2 motif, in which X1 is His or an amino acid residue with a hydrophobic side chain and X2 is Pro, Phe, or Trp. Also disclosed herein are conjugates containing the cancer-targeting peptides and uses thereof in cancer treatment and diagnosis.

Abstract translation: 具有PX1LX2基序的癌靶向肽，其中X1是His或具有疏水侧链的氨基酸残基，X2是Pro，Phe或Trp。 本文还公开了含有癌靶向肽的缀合物及其在癌症治疗和诊断中的用途。

公开(公告)号：US07329942B2

公开(公告)日：2008-02-12

申请号：US11131395

申请日：2005-05-18

Applicant: Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

Inventor： Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

IPC: H01L31/00 ,  H01L27/15 ,  H01L33/00 ,  H01L23/58

CPC classification number: H01L33/641 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00

Abstract: An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

Abstract translation: 阵列式模块化发光二极管结构及封装结构的方法。 阵列型模块化发光二极管结构包括下基板和固定在下基板上的上基板。 选择具有高导热性的材料作为上基板的材料。 上基板在每个凹陷的底部形成多个排列的凹槽和通孔。 选择具有高导热性的材料作为下基板的材料。 下基板的表面形成有预定的电路布局卡。 上基板的底面被放置在下基板的上表面上，凹部的通孔分别对应于下基板的电路布局卡的接触电极。 多个发光二极管晶体分别固定在凹陷的底部。 通过通孔，发光二极管晶体的电极与接触电极电连接。 然后将上基板的凹痕密封，以防止发光二极管晶体被氧化。

公开(公告)号：US20060261357A1

公开(公告)日：2006-11-23

申请号：US11131395

申请日：2005-05-18

Applicant: Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

Inventor： Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

IPC: H01L29/06

CPC classification number: H01L33/641 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00

Abstract: An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

Abstract translation: 阵列式模块化发光二极管结构及封装结构的方法。 阵列型模块化发光二极管结构包括下基板和固定在下基板上的上基板。 选择具有高导热性的材料作为上基板的材料。 上基板在每个凹陷的底部形成多个排列的凹槽和通孔。 选择具有高导热性的材料作为下基板材料。 下基板的表面形成有预定的电路布局卡。 上基板的底面被放置在下基板的上表面上，凹部的通孔分别对应于下基板的电路布局卡的接触电极。 多个发光二极管晶体分别固定在凹陷的底部。 通过通孔，发光二极管晶体的电极与接触电极电连接。 然后将上基板的凹痕密封，以防止发光二极管晶体被氧化。