公开(公告)号：US09417425B2

公开(公告)日：2016-08-16

申请号：US14341344

申请日：2014-07-25

Applicant: GlobalMEMS TAIWAN CORPORATION LIMITED

Inventor： Su-Jhen Lin ,  Ming-Ching Wu

IPC: G02B7/02 ,  H02K41/02 ,  G02B7/08 ,  G02B7/182 ,  G02B26/08 ,  H02K33/18 ,  G02B7/18 ,  G02B26/10 ,  B81B3/00 ,  H02K35/00

CPC classification number: G02B7/08 ,  B81B3/00 ,  B81B3/0018 ,  B81B2201/02 ,  B81B2201/04 ,  B81B2201/042 ,  G02B7/18 ,  G02B7/182 ,  G02B26/0833 ,  G02B26/085 ,  G02B26/101 ,  H02K33/18 ,  H02K35/00 ,  H02K41/02

Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorentz force to drive the movable carrier element to move against the return force of the two return springs.

Abstract translation: 通过在硅衬底上的典型的表面微加工和体微加工工艺形成的微机电系统（MEMS）载体，其具有框架，可移动载体元件，导电线圈，两个复位弹簧和一对永磁体 。 可移动的载体元件形成在框架内并沿着路径移动，导电线圈形成在可动载体元件上或嵌入可移动的载体元件中。 两个复位弹簧形成在可移动的载体元件和框架之间，从而将可移动的载体元件连接到框架上，并向载体元件提供返回力，并且该对永久磁铁形成一个磁场，用于与 导电线圈，用于产生电磁洛伦兹力，以驱动可移动的载体元件克服两个复位弹簧的返回力移动。

公开(公告)号：US20150232323A1

公开(公告)日：2015-08-20

申请号：US14624071

申请日：2015-02-17

Applicant: Robert Bosch GmbH

Inventor： Dietmar HABERER

IPC: B81B1/00 ,  B81B7/02 ,  B81C1/00

CPC classification number: B81B1/004 ,  B81B7/02 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00103 ,  B81C2201/0194 ,  B81C2203/0172

Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.

Abstract translation: 微机械部件的制造方法和微机械部件包括提供具有第一和第二外表面的基板，所述第二表面背离所述第一表面; 从所述第一外表面到所述第二外表面形成穿过所述基板的通孔; 在所述第二外表面上附着光学功能层以覆盖所述通孔; 去除所述基板的所述第一表面上的所述基板的第一部分，使得出现相对于所述第二表面倾斜的第三外表面，所述第三表面背离所述第二表面，所述倾斜表面包围所述通孔; 以及通过从所述基板的剩余部分分离具有所述通孔的所述基板的第一部分和附接到所述第一部分的所述光学功能层的第二部分和所述光学部件的剩余部分来分离所述微机械部件 功能层。

公开(公告)号：US08917963B2

公开(公告)日：2014-12-23

申请号：US13113994

申请日：2011-05-23

Applicant: Bardia Pezeshki ,  Michael Sherback ,  Dinh Ton

Inventor： Bardia Pezeshki ,  Michael Sherback ,  Dinh Ton

IPC: G02B6/26 ,  G02B6/32 ,  G02B26/08 ,  G02B6/42

CPC classification number: G02B6/4219 ,  B81B3/0045 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0118 ,  G02B6/3656 ,  G02B6/366 ,  G02B6/4204 ,  G02B6/4244 ,  G02B6/4266 ,  G02B7/003 ,  G02B7/004 ,  G02B26/0808 ,  G02B26/0875

Abstract: A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.

Abstract translation: 基于MEMS的对准技术，其基于将光学部件安装在使用多个挠曲而不是单个弹簧的释放的微机械杆配置上。 光学部件可以是透镜。 使用多个弯曲可能会减少透镜旋转和透镜平移之间的耦合，并减少杠杆手柄翘曲对透镜位置的影响。 该设备可以针对各种几何形状进行优化。

公开(公告)号：US20120281286A1

公开(公告)日：2012-11-08

申请号：US13202528

申请日：2010-02-19

Applicant: Sasikanth Manipatruni ,  Michal Lipson ,  Jacob T. Robinson

Inventor： Sasikanth Manipatruni ,  Michal Lipson ,  Jacob T. Robinson

IPC: G02B26/00

CPC classification number: G02B26/001 ,  A61F9/022 ,  A61F9/023 ,  B81B3/0083 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C1/0015 ,  B81C2201/013 ,  G02B1/005 ,  G02B6/4209 ,  G02C7/104 ,  G02C7/107 ,  H01S3/005 ,  H01S3/0064

Abstract: There is set forth herein an optomechanical device which can comprise a first mirror and a second mirror forming with the first mirror a cavity. In one aspect the first mirror can be a movable mirror. The optomechanical device can be adapted so that the first mirror is moveable responsively to radiation force.

Abstract translation: 这里提出了一种光学机械装置，其可以包括第一反射镜和形成有第一反射镜的第二反射镜的腔。 在一个方面，第一镜可以是可移动镜。 光学机械装置可以适于使得第一反射镜能够响应于辐射力而移动。

公开(公告)号：US20240337732A1

公开(公告)日：2024-10-10

申请号：US18674122

申请日：2024-05-24

Applicant: Innoviz Technologies Ltd.

Inventor： Amir DAY ,  Yair ANTMAN ,  Nir OSIROFF ,  Matityahu SHANI ,  David ELOOZ ,  Smadar DAVID RALY

IPC: G01S7/481 ,  B60S1/02 ,  B81B3/00 ,  G01H1/00 ,  G01S7/48 ,  G01S7/484 ,  G01S7/4863 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/497 ,  G01S17/06 ,  G01S17/10 ,  G01S17/32 ,  G01S17/42 ,  G01S17/58 ,  G01S17/89 ,  G01S17/931 ,  G02B26/12

CPC classification number: G01S7/4817 ,  B60S1/02 ,  B81B3/0018 ,  G01H1/00 ,  G01S7/4802 ,  G01S7/4808 ,  G01S7/4814 ,  G01S7/4815 ,  G01S7/4816 ,  G01S7/484 ,  G01S7/4863 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/497 ,  G01S17/06 ,  G01S17/10 ,  G01S17/32 ,  G01S17/42 ,  G01S17/58 ,  G01S17/89 ,  G01S17/931 ,  B81B2201/04 ,  G01S2007/4975 ,  G02B26/122

Abstract: A LIDAR system includes at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.

公开(公告)号：US12000960B2

公开(公告)日：2024-06-04

申请号：US16829778

申请日：2020-03-25

Applicant: INNOVIZ TECHNOLOGIES LTD

Inventor： Oded Yeruhami ,  Amit Steinberg ,  Nir Osiroff ,  Ronen Eshel

IPC: G01S7/481 ,  B60S1/02 ,  B81B3/00 ,  G01H1/00 ,  G01S7/48 ,  G01S7/484 ,  G01S7/4863 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/497 ,  G01S17/06 ,  G01S17/10 ,  G01S17/32 ,  G01S17/42 ,  G01S17/58 ,  G01S17/89 ,  G01S17/931 ,  G02B26/12

CPC classification number: G01S7/4817 ,  B60S1/02 ,  B81B3/0018 ,  G01H1/00 ,  G01S7/4802 ,  G01S7/4808 ,  G01S7/4814 ,  G01S7/4815 ,  G01S7/4816 ,  G01S7/484 ,  G01S7/4863 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/497 ,  G01S17/06 ,  G01S17/10 ,  G01S17/32 ,  G01S17/42 ,  G01S17/58 ,  G01S17/89 ,  G01S17/931 ,  B81B2201/04 ,  G01S2007/4975 ,  G02B26/122

Abstract: In some embodiments, a LIDAR system may include at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.

公开(公告)号：US11772959B2

公开(公告)日：2023-10-03

申请号：US17940770

申请日：2022-09-08

Applicant: Mirrorcle Technologies, Inc.

Inventor： Stefan Richter ,  Johannes Kindt ,  Veljko Milanovic

IPC: B81B3/00 ,  H02N1/00

CPC classification number: B81B3/0078 ,  H02N1/008 ,  B81B2201/04 ,  B81B2203/0154 ,  B81B2203/058

Abstract: MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. An actuator coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.

公开(公告)号：US11726312B2

公开(公告)日：2023-08-15

申请号：US17844617

申请日：2022-06-20

Applicant: AG MICROSYSTEMS, INC.

Inventor： Asif Godil ,  Chase Valiente

IPC: G02B26/08 ,  G02B26/10 ,  B81B7/00 ,  B81B7/02

CPC classification number: G02B26/0841 ,  G02B26/0833 ,  B81B7/0003 ,  B81B7/02 ,  B81B2201/04 ,  B81B2203/0145 ,  B81B2207/091 ,  G02B26/101 ,  G02B26/105

Abstract: A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

公开(公告)号：US20230239626A1

公开(公告)日：2023-07-27

申请号：US18127506

申请日：2023-03-28

Applicant: Meta Platforms Technologies, LLC

Inventor： Limin Zhou ,  Chuming Zhao ,  Rex Pinegar Price ,  Mekell Jiles ,  Kevin Connor

IPC: H04R9/04 ,  B81B7/02 ,  H04R29/00 ,  H04R9/06 ,  H05K1/02

CPC classification number: H04R9/046 ,  B81B7/02 ,  H04R29/001 ,  H04R9/06 ,  H04R9/045 ,  B81B2201/04 ,  H05K1/0271

Abstract: A coil assembly for integration into a transducer is presented. The coil assembly may include a metal bobbin assembly, a wire coil, and one or more nonconductive printed circuit board (PCB) stiffeners. A speaker that renders micro noise in an artificial reality environment for improving simulated presence is further presented. The speaker may generate a plurality of micro noises based in part on the determined state of the virtual object. The speaker may spatialize the plurality of micro noises, such that the plurality of micro noises appears to originate from the virtual object. A speaker for speaker diaphragm motion detection using optical MEMS sensors is further presented. Optical MEMS sensors are used to optically monitor displacement of one or more portions of a speaker diaphragm. The speaker may be configured to determine that a speaker diaphragm is in rocking mode and move the speaker diaphragm out of rocking mode.

公开(公告)号：US11686667B2

公开(公告)日：2023-06-27

申请号：US17407803

申请日：2021-08-20

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01N21/17 ,  G01N29/24 ,  B81B7/02

CPC classification number: G01N21/1702 ,  B81B7/02 ,  G01N29/2425 ,  B81B2201/0264 ,  B81B2201/04 ,  B81B2203/0315 ,  G01N2021/1704

Abstract: A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.