公开(公告)号：US20180237673A1

公开(公告)日：2018-08-23

申请号：US15754557

申请日：2015-08-25

Applicant: TERAOKA SEISAKUSHO CO., LTD.

Inventor： Yasushi TSUCHIYA ,  Masashi NIWA

IPC: C09J201/02 ,  C09J7/24

CPC classification number: C09J201/02 ,  C09J7/20 ,  C09J7/243 ,  C09J7/26 ,  C09J2201/128 ,  C09J2203/30 ,  C09J2203/318 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2431/006

Abstract: Disclosed is an adhesive tape wherein the adhesive tape has an adhesive layer on one side or both sides of a base, the base contains 30% by mass or more of an ethylene-vinyl acetate copolymer, and the tensile modulus of the base measured according to JIS K7161 2014 is 30 N/mm2 or more, and the adhesive tape has excellent properties such as impact resistance, an antistatic property, shear deformation rate during heating and pressing force.

公开(公告)号：US09780068B2

公开(公告)日：2017-10-03

申请号：US15066181

申请日：2016-03-10

Applicant: HENKEL AG & Co. KGaA ,  HENKEL IP & HOLDING GMBH

Inventor： Sugiura Yoko ,  Horiguchi Yusuke ,  Mieko Sano ,  Gina Hoang

IPC: H01L21/00 ,  H01L23/00 ,  C09J133/06 ,  C09J133/08 ,  C09J201/02 ,  C09J4/06 ,  H01L21/78 ,  H05K1/03 ,  C09J151/00

CPC classification number: H01L24/83 ,  C09J4/06 ,  C09J133/06 ,  C09J133/08 ,  C09J151/003 ,  C09J201/02 ,  H01L21/78 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2924/12042 ,  H05K1/0373 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2924/00

Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

公开(公告)号：US20170066945A1

公开(公告)日：2017-03-09

申请号：US15122583

申请日：2015-09-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Yongshan ZHOU ,  Yifeng QIN

IPC: C09J9/02 ,  C08K3/08 ,  C08K3/04 ,  C09J175/04 ,  C09J133/04 ,  C09J163/00 ,  C09J129/14 ,  C09J171/00 ,  C09J11/04 ,  C08K7/16

CPC classification number: C09J9/02 ,  C08G2190/00 ,  C08K9/12 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C08L2203/20 ,  C09J11/04 ,  C09J133/04 ,  C09J163/00 ,  C09J171/00 ,  C09J175/04 ,  C09J201/00 ,  C09J201/02

Abstract: The embodiments of the present disclosure relate to the field of display technologies and provide a conductive adhesive composition, a method for producing the same, a sealant and a display panel, so as to improve the dispersion evenness of conductive particles in the adhesive and ensure excellent conductivity of the conductive adhesive composition, as well as avoid influencing the normal throughput of the adhesive during coating when the doping percentage of conductive particles is high. The conductive adhesive composition comprises: a primary adhesive material; and carrier granules dispersed in the primary adhesive material and having conductive particles adsorbed thereon. The present disclosure is applicable to manufacture a conductive adhesive composition as well as a sealant and a display panel comprising the conductive adhesive composition.

Abstract translation: 本公开的实施例涉及显示技术领域并提供导电粘合剂组合物，其制造方法，密封剂和显示面板，以提高粘合剂中导电颗粒的分散均匀性并确保优异的 导电粘合剂组合物的导电性，并且当导电颗粒的掺杂百分比高时，避免影响涂布期间粘合剂的正常通量。 导电粘合剂组合物包括：主要粘合剂材料; 和分散在主粘合剂材料中并具有吸附在其上的导电颗粒的载体颗粒。 本公开可应用于制造导电粘合剂组合物以及密封剂和包含导电粘合剂组合物的显示面板。

公开(公告)号：US09574266B2

公开(公告)日：2017-02-21

申请号：US14164867

申请日：2014-01-27

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Mitsuru Kano ,  Jin Sato ,  Toshiaki Yoshihara ,  Masato Kon

IPC: C23C16/02 ,  C23C16/04 ,  C23C16/44 ,  C23C16/455 ,  C08K3/00 ,  C09J201/02 ,  C09J201/06 ,  C09J201/08 ,  B05D3/14 ,  B05D3/10 ,  B32B7/04 ,  C23C16/40 ,  C23C28/04 ,  C23C28/00 ,  B05D3/00

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

Abstract translation: 层压体包括形成在基材的外表面的至少一部分中的基材，膜状或膜状底涂层，以及形成在与基材的相反侧的表面上的原子层沉积膜 在底涂层的厚度方向的两面中与基材接触的表面。 原子层沉积膜的前体的至少一部分与底涂层结合，原子层沉积膜形成为覆盖底涂层的膜状。

公开(公告)号：US20160312084A1

公开(公告)日：2016-10-27

申请号：US15105131

申请日：2014-12-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Stephen M. June ,  Nicole M. Beveridge ,  Ying-Yuh Lu

IPC: C09J133/06 ,  C09J9/00

CPC classification number: C09J133/06 ,  C08F220/10 ,  C08L33/06 ,  C09J9/005 ,  C09J201/02

Abstract: A solid thermoplastic semi-crystalline friction-activated adhesive composition comprising the mixture of: (a) from about 50 to about 100 parts by weight of a semi-crystalline adhesive polymer that comprises: (1) crystalline monomer having an alkyl carbon length of at least 16 carbon atoms; (2) non-crystalline monomer having a homopolymer Tg below about 80° C.; (3) waxy, soft monomer having an average pendant alkyl carbon length of at least 14 carbon atoms; (4) monomer having acid or base functionality; (5) functional or non-functional macromere having a Tm from about 40 to about 120° C.; (b) 0 to about 50 parts by weight of tackifier; (c) 0 to about 50 parts by weight of crystalline additive; (d) 0 to about 50 parts by weight of filler; (e) 0 to about 30 parts by weight of oil; and (f) 0 to about 50 parts by weight of one surfactant. Also glue crayons and other application devices comprising such adhesive compositions.

Abstract translation: 一种固体热塑性半结晶摩擦激活粘合剂组合物，其包含以下混合物：（a）约50至约100重量份的半结晶粘合剂聚合物，其包含：（1）具有烷基碳长度为 至少16个碳原子; （2）均聚物Tg低于约80℃的非晶体单体; （3）具有至少14个碳原子的平均侧链烷基碳长度的蜡状软质单体; （4）具有酸或碱官能团的单体; （5）具有约40至约120℃的Tm的功能或非功能大分子单体; （b）0至约50重量份的增粘剂; （c）0至约50重量份的结晶添加剂; （d）0至约50重量份的填料; （e）0至约30重量份的油; 和（f）0至约50重量份的一种表面活性剂。 还粘合蜡笔和包括这种粘合剂组合物的其它施用装置。

公开(公告)号：US20150315420A1

公开(公告)日：2015-11-05

申请号：US14796336

申请日：2015-07-10

Applicant: Chem Link, Inc.

Inventor： Phillip C. Georgeau ,  Jon H. Ballema ,  Dennis J. Kelley ,  William L. Machemer ,  James M. Larke

IPC: C09J7/02 ,  B32B37/12 ,  B32B37/10 ,  C08J7/12

CPC classification number: B32B37/10 ,  B32B5/022 ,  B32B5/024 ,  B32B5/028 ,  B32B7/06 ,  B32B7/12 ,  B32B27/12 ,  B32B27/302 ,  B32B27/32 ,  B32B27/36 ,  B32B37/12 ,  B32B2260/021 ,  B32B2262/02 ,  B32B2262/06 ,  B32B2305/38 ,  B32B2307/7265 ,  B32B2419/00 ,  B32B2419/06 ,  C08J7/12 ,  C08J2323/26 ,  C08J2325/06 ,  C08J2367/02 ,  C09J7/22 ,  C09J201/02 ,  C09J2423/006 ,  C09J2425/006 ,  C09J2467/006 ,  E04D5/06 ,  E04D5/10 ,  E04D13/1643 ,  Y10T428/1476 ,  Y10T428/31663 ,  Y10T442/10

Abstract: Improved adhesive between a sheet material having a low free energy surface, such as a polyolefin, polystyrene, or polyethylene terephthalate film, is achieved by treating the film surface with a silane coupling agent that provides hydrolyzable groups on the surface of the film, and employing an adhesive composition comprising a polymer having reactive silyl groups (e.g., silyl-functionalized polyethers, polyurethanes and/or polyesters). Such improved sheet products can be advantageously employed as weather barriers for building construction applications, eliminating the need for, and disadvantages of, mechanical fasteners.

Abstract translation: 具有低自由能表面的片材之类的粘合剂如聚烯烃，聚苯乙烯或聚对苯二甲酸乙二醇酯薄膜，通过用在硅烷表面上提供可水解基团的硅烷偶联剂处理薄膜表面，并采用 包括具有反应性甲硅烷基的聚合物（例如，甲硅烷基官能化的聚醚，聚氨酯和/或聚酯）的粘合剂组合物。 这种改进的片材产品可以有利地用作建筑施工应用的天气屏障，消除机械紧固件的需要和缺点。

公开(公告)号：US20150252224A1

公开(公告)日：2015-09-10

申请号：US14430846

申请日：2013-01-28

Applicant: MITSUBOSHI BELTING LTD.

Inventor： Taisuke Iseda ,  Motohiro Takiguchi ,  Kazutomo Kawahara ,  Koshi Ochi ,  Masahiro Iwamoto

IPC: C09J9/02 ,  H01B1/22 ,  C09J163/00

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08L101/00 ,  C09J163/00 ,  C09J201/02 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/25 ,  H01L2924/00014 ,  H01L2924/207 ,  H01L2924/00

Abstract: The present invention relates to a conductive composition containing a conductive metal powder and a resin component in which the conductive metal powder contains a metal flake and a metal nanoparticle and the resin component contains an aromatic amine skeleton.

Abstract translation: 本发明涉及含有导电性金属粉末和导电性金属粉末含有金属薄片和金属纳米粒子以及树脂成分含有芳香族胺骨架的树脂成分的导电性组合物。

公开(公告)号：US20140242757A1

公开(公告)日：2014-08-28

申请号：US14267511

申请日：2014-05-01

Applicant: HENKEL IP & HOLDING GMBH ,  HENKEL JAPAN LIMITED

Inventor： Sugiura Yoko ,  Horiguchi Yusuke ,  Mieko Sano ,  Gina Hoang

IPC: H01L23/00 ,  H01L21/78 ,  H05K1/03

CPC classification number: H01L24/83 ,  C09J4/06 ,  C09J133/06 ,  C09J133/08 ,  C09J151/003 ,  C09J201/02 ,  H01L21/78 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2924/12042 ,  H05K1/0373 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2924/00

Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

Abstract translation: 一种预涂底糊密封剂用粘合剂组合物，其包含：（a）具有一个或多个选自乙烯基，马来酰亚胺基，丙烯酰基，甲基丙烯酰基和烯丙基的官能团的自由基聚合性单体，（b） 具有极性基团的聚合物，（c）填料和（d）热自由基引发剂。

公开(公告)号：US20110177329A1

公开(公告)日：2011-07-21

申请号：US13079086

申请日：2011-04-04

Applicant: Jianhui Xia ,  Ying-Yuh Lu ,  Zhiming Zhou

Inventor： Jianhui Xia ,  Ying-Yuh Lu ,  Zhiming Zhou

IPC: B32B7/12 ,  C09J7/02 ,  B32B15/08

CPC classification number: B32B27/08 ,  B32B7/12 ,  B32B27/308 ,  B32B27/365 ,  B32B2307/7246 ,  B32B2551/00 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J133/06 ,  C09J201/02 ,  C09J2433/00 ,  Y10T428/2804 ,  Y10T428/2848 ,  Y10T428/2891 ,  Y10T428/31507 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31938

Abstract: Described are adhesive compositions containing a mixture of a pressure sensitive adhesive, a high Tg polymer, and a crosslinker to form a compatibilized blend that is optically clear. Methods of using the adhesive compositions, and multilayer assemblies such as optical elements prepared using the adhesives, are also provided.

Abstract translation: 描述了含有压敏粘合剂，高Tg聚合物和交联剂的混合物的粘合剂组合物，以形成光学透明的相容的共混物。 还提供了使用粘合剂组合物的方法和使用粘合剂制备的多层组件如光学元件。

公开(公告)号：US20060235137A1

公开(公告)日：2006-10-19

申请号：US11108398

申请日：2005-04-18

Applicant: Eunsook Chae

Inventor： Eunsook Chae

IPC: C08L29/04

CPC classification number: C09J167/00 ,  C08F290/06 ,  C08F290/14 ,  C08G77/04 ,  C08K5/0025 ,  C08K5/1515 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/22 ,  C09J151/003 ,  C09J151/08 ,  C09J151/085 ,  C09J163/10 ,  C09J167/07 ,  C09J201/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  C08L2666/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Adhesive compositions containing a base compound or resin and an epoxy resin with vinyl functionality, without a curing agent for the epoxy resin, show enhanced stress performance. The compositions can be used in microelectronic applications.

Abstract translation: 含有基础化合物或树脂的粘合剂组合物和具有乙烯基官能团的环氧树脂，而不含环氧树脂的固化剂，表现出增强的应力性能。 该组合物可用于微电子应用。