Abstract:
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
Abstract:
Provided is a heat-peelable double-sided pressure-sensitive adhesive sheet that is advantageously usable in the step of cutting a multilayer ceramic sheet performed in a high-temperature atmosphere. Also provided is a process for the cutting of a multilayer ceramic sheet using the above-mentioned sheet.The heat-peelable double-sided pressure-sensitive adhesive sheet includes a substrate; arranged on one side thereof, a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres; and arranged on the other side, a temporary-fixing pressure-sensitive adhesive layer containing a lipophilic layered clay mineral. The lipophilic layered clay mineral is preferably a layered silicate. The lipophilic layered clay mineral may be present in an amount of 0.1 to 45 parts by weight per 100 parts by weight of a base polymer of a pressure-sensitive adhesive constituting the temporary-fixing pressure-sensitive adhesive layer.
Abstract:
An adhesive tape for flying splice, having a left and right boundary edge, at least one main carrier and a first layer of self-adhesive on the obverse of the main carrier, the reverse of the main carrier bearing a parting system which is suitable for effecting an adhesive bond to a substrate that can be parted again in such a way that sticky residues are left neither on the reverse of the main carrier nor on the substrate in the region of the parted bond, the parting system being constructed in a particular form as described herein.
Abstract:
A method of making a bulletin board is provided. The method includes the steps of: (a) providing an image-bearing substrate having an image on at least one major surface; (b) providing a transparent substrate having on one major surface thereof a first pressure sensitive adhesive (PSA) that is a repositionable PSA, and having on the opposite major surface thereof a second PSA; (c) applying the transparent substrate on the image of adhering the transparent sheet thereto by the second PSA.
Abstract:
Use of a double-sided adhesive tape for fastening silicone rubbers, the adhesive tape having a backing and two layers of adhesive, the first layer of adhesive being composed of an acrylate-based pressure-sensitive adhesive and the second pressure-sensitive adhesive being composed of a crosslinked pressure-sensitive silicone adhesive.
Abstract:
The use of a film for adhesively bonding two substrates, wherein the film comprises a layer which is composed of more than 30% by weight of a heat-activatable polyurethane (PU layer for short).
Abstract:
Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20 mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23±° C., and a relative humidity of 65±5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165° C. and a pressure of one atmosphere for one hour.
Abstract:
The invention relates to the use of an adhesive film for bonding a chip module in a card body. Said adhesive film comprises at least two adhesive layers (i) and (ii), which differ chemically from one another.
Abstract:
The invention relates to an adhesive film comprising at least two adhesive layers (i) and (ii), which differ chemically from one another. The inventive film is characterized in that one layer (i) is suited to bond with epoxy materials and/or polyimides-and the other layer (ii) is suited to bond with polycarbonate, polyethylene, polypropylene, acrylonitrile-butadiene-styrene copolymer plastics, polyethylene terephthalate and/or polyvinylchloride.
Abstract:
A fabricating method of a flexible display device includes the steps of providing an adhesive layer including a first adhesive material on a first surface of a support film, a second adhesive material on a second surface of the support film such that an adhesive strength of the second adhesive material is lower than an adhesive strength of the first adhesive material, and a third adhesive material encompassing an edge of the second adhesive material such that an adhesive strength of the third adhesive material is higher than the adhesive strength of the second adhesive material; a first passivation film adhered to the first surface of the support film with the first adhesive material therebetween; and a second passivation film adhered to the second surface of the support film with the second adhesive material and the third adhesive material therebetween; peeling the first passivation film from the adhesive layer; adhering a rigid substrate to the first adhesive material; peeling the second passivation film from the adhesive layer; and adhering a flexible substrate onto the second and third adhesive materials.