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    LAMINATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR FORMING CONDUCTIVE PATTERN
    31.
    发明申请
    LAMINATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR FORMING CONDUCTIVE PATTERN 审中-公开
    层压体，其制造方法以及形成导电图案的方法

    公开(公告)号：US20140255709A1

    公开(公告)日：2014-09-11

    申请号：US14199306

    申请日：2014-03-06

    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

    Inventor： Tatsuo HASEGAWA ,  Toshikazu YAMADA ,  Ken MATSUOKA ,  Ayano KATOU

    IPC: H05K1/09 ,  H05K3/10

    CPC classification number: H05K3/386 ,  H05K3/1208 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0317 ,  H05K2203/0139 ,  H05K2203/0522 ,  Y10T428/31678

    Abstract: A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate.

    Abstract translation: 公开了一种层压体，其包含不容易从基板分离的金属层，层压体的制造方法以及形成具有高导电性的微细导电图案的方法。 包含在设置在基板和金属层之间的聚合物层的层压体中的金属层的剥离强度通过实施其中形成金属层的金属化学键合到从聚合物主体延伸的COO的结构而得到改善 链，其在金属层和聚合物层之间的界面处形成聚合物层。 通过对形成在基板上的绝缘膜的图形区域施加UV光，并将通过将金属纳米颗粒分散在溶剂中而制备的油墨，可以形成表现出高导电性的细导电图案。

    HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    32.
    发明申请
    HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开
    热辐射基板及其制造方法

    公开(公告)号：US20140174794A1

    公开(公告)日：2014-06-26

    申请号：US14061266

    申请日：2013-10-23

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Joon Seok KANG ,  Kwang Jik Lee ,  Sang Hyun Shin ,  Hye Suk Shin

    IPC: H05K1/02 ,  C25D11/02

    CPC classification number: C25D11/022 ,  C25D11/246 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/445 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2203/0315 ,  H05K2203/1147

    Abstract: A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material.

    Abstract translation: 具有增强的绝缘电阻和导热性的散热基板及其制造方法。 散热基板的制造方法包括：准备金属基板; 在金属基板上进行阳极氧化处理以形成阳极氧化层; 用绝缘材料填充阳极氧化层的表面孔; 在阳极氧化层上形成金属布线层。 通过用绝缘材料填充在阳极氧化处理中形成的表面孔，可以获得高绝缘电阻和导热性。

    Controlling Printed Ink Line Widths using Fluoropolymer Templates
    33.
    发明申请
    Controlling Printed Ink Line Widths using Fluoropolymer Templates 有权
    使用氟聚合物模板控制印刷墨水线宽度

    公开(公告)号：US20130260536A1

    公开(公告)日：2013-10-03

    申请号：US13432855

    申请日：2012-03-28

    Applicant: Kurt ULMER ,  Kanan PUNTAMBEKAR ,  Lisa H. STECKER

    Inventor： Kurt ULMER ,  Kanan PUNTAMBEKAR ,  Lisa H. STECKER

    IPC: H01L21/36

    CPC classification number: B41N1/00 ,  H01L51/0005 ,  H01L51/0022 ,  H05K3/1208 ,  H05K3/125 ,  H05K2201/015 ,  H05K2203/1173 ,  H05K2203/1476

    Abstract: A method is provided for controlling printed ink horizontal cross-sectional areas using fluoropolymer templates. The method initially forms a fluoropolymer template overlying a substrate. The fluoropolymer template has a horizontal first cross-sectional dimension. Then, a primary ink is printed overlying the fluoropolymer template having a horizontal second cross-sectional dimension less than the first cross-sectional dimension. In the case of a fluoropolymer line having a template length greater than a template width, where the template width is the first cross-sectional dimension, printing the primary ink entails printing a primary ink line having an ink length greater than an ink width, where the ink width is the second cross-sectional dimension. In one aspect, the method prints a plurality of primary ink layers, each primary ink layer having an ink width less than the template width. Each overlying primary ink layer can be printed prior to solvents in underlying primary ink layers evaporating.

    Abstract translation: 提供了一种使用氟聚合物模板控制印刷油墨水平横截面积的方法。 该方法最初形成覆盖在基底上的氟聚合物模板。 氟聚合物模板具有水平的第一横截面尺寸。 然后，将初级墨水印刷在具有小于第一横截面尺寸的水平第二横截面尺寸的含氟聚合物模板上。 在具有模板长度大于模板宽度的含氟聚合物线的情况下，其中模板宽度是第一横截面尺寸，打印初级墨水需要打印墨水长度大于墨水宽度的主墨水线，其中 油墨宽度是第二横截面尺寸。 在一个方面，该方法印刷多个主油墨层，每个主油墨层的油墨宽度小于模板宽度。 每个上覆的初级墨水层可以在溶剂之前被打印在基本的主油墨层中蒸发。

    Plasma-Polymerized Polymer Coating
    34.
    发明申请
    Plasma-Polymerized Polymer Coating 有权
    等离子体聚合物涂层

    公开(公告)号：US20130033825A1

    公开(公告)日：2013-02-07

    申请号：US13527305

    申请日：2012-06-19

    Applicant: Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

    Inventor： Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

    IPC: H05K1/00 ,  H05K3/22

    CPC classification number: H05K3/284 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2201/10121 ,  H05K2203/095

    Abstract: An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.

    Abstract translation: 一种电气或电光学组件，包括包括绝缘材料的衬底，存在于衬底的至少一个表面上的至少一个导电轨道，至少一个电或电光学部件，其连接到至少一个导电 轨道和连续涂层，其包含完全覆盖基底的至少一个表面，所述至少一个导电轨道和至少一个电或电光部件的一个或多个等离子体聚合的聚合物。

    FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
    36.
    发明申请
    FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    柔性印刷电路及其制造方法

    公开(公告)号：US20120292085A1

    公开(公告)日：2012-11-22

    申请号：US13455312

    申请日：2012-04-25

    Applicant: Hirohito Watanabe

    Inventor： Hirohito Watanabe

    IPC: H05K1/00 ,  H05K3/46

    CPC classification number: H05K1/024 ,  H05K1/0219 ,  H05K1/0393 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/015

    Abstract: Provided is a flexible printed circuit having a multilayered structure including three conductive layers. The flexible printed circuit includes: a first unit substrate formed of a first insulating layer made of liquid crystal polymer or fluorine resin and having a signal transmission circuit formed on one surface of the first insulating layer and a first conductive layer formed on the other surface thereof; a second unit substrate formed of a second insulating layer made of liquid crystal polymer or fluorine resin and having a second conductive layer formed on one surface of the second insulating layer; and an adhesive layer made of an epoxy thermal curing adhesive for bonding the first unit substrate and the second unit substrate in a state that the one surface of the first insulating layer is faced with the other surface of the second insulating layer.

    Abstract translation: 提供一种具有包括三个导电层的多层结构的柔性印刷电路。 柔性印刷电路包括：第一单元基板，由由液晶聚合物或氟树脂制成的第一绝缘层形成，并且具有形成在第一绝缘层的一个表面上的信号传输电路和形成在其另一表面上的第一导电层 ; 第二单元基板，由由液晶聚合物或氟树脂制成的第二绝缘层形成，并且具有形成在所述第二绝缘层的一个表面上的第二导电层; 以及由环氧热固化型粘合剂制成的粘合剂层，用于在第一绝缘层的一个表面面对第二绝缘层的另一个表面的状态下接合第一单元基板和第二单元基板。

    APPARATUS AND METHOD FOR COOLING OR HEATING WORK PIECE IN A VACUUM CHAMBER
    37.
    发明申请
    APPARATUS AND METHOD FOR COOLING OR HEATING WORK PIECE IN A VACUUM CHAMBER 审中-公开
    用于在真空室中冷却或加热工作层的装置和方法

    公开(公告)号：US20120207916A1

    公开(公告)日：2012-08-16

    申请号：US13171728

    申请日：2011-06-29

    Applicant: George X. Guo

    Inventor： George X. Guo

    IPC: H05K3/22 ,  C23C16/44

    CPC classification number: H05K3/28 ,  C23C14/541 ,  C23C16/463 ,  H05K2201/015 ,  H05K2203/1121

    Abstract: A vacuum processing system includes a vacuum chamber in connection with a vacuum pump that can exhaust air or vapor in the vacuum chamber, and a container in the vacuum chamber configured to contain one or more work pieces therein and to receive a heat-exchange liquid that comes into contact with the one or more work pieces to allow heat exchange with the one or more work pieces. The vacuum pump can exhaust at least a portion of the vapor evaporated from the heat-exchange liquid on the work pieces or in the container. A deposition source unit can provide material to be deposited on the one or more work pieces in vacuum. The one or more work pieces can be brought a predetermined temperature by the heat-exchange liquid.

    Abstract translation: 真空处理系统包括与可以排出真空室中的空气或蒸汽的真空泵相连的真空室，以及真空室中的容器，其构造成在其中容纳一个或多个工件并接收热交换液体， 与一个或多个工件接触以允许与一个或多个工件的热交换。 真空泵可以排出从工件或容器中的热交换液体蒸发的蒸汽的至少一部分。 沉积源单元可以在真空中提供待沉积在一个或多个工件上的材料。 一个或多个工件可以通过热交换液体达到预定温度。

    MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
    38.
    发明申请
    MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE 审中-公开
    多层印刷线路板，具有填充的结构

    公开(公告)号：US20120103680A1

    公开(公告)日：2012-05-03

    申请号：US13348708

    申请日：2012-01-12

    Applicant: Seiji SHIRAI ,  Kenichi SHIMADA ,  Motoo ASAI

    Inventor： Seiji SHIRAI ,  Kenichi SHIMADA ,  Motoo ASAI

    IPC: H05K1/11

    CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

    Abstract: A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer.

    Abstract translation: 多层印刷线路板包括具有导体电路层和层间绝缘层的多层结构，所述层间绝缘层包括最外层间绝缘层，所述导体电路层包括形成在最外层间绝缘体上的最外导体电路层，填充通孔 形成在最外层间绝缘层中并且具有一个或多个金属电镀填充物并且完全闭合通过最外层间绝缘层形成的孔，使得填充通孔的金属镀层延伸出孔并形成基本平坦的表面，并且 焊料凸点包括形成在填充通孔的基本上平坦的表面上的第一焊料凸块和形成在最外导体电路层的表面部分上的第二焊料凸点。 填充通孔的基本上平坦的表面基本上与最外面的导体电路层的表面部分的高度平齐。

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