公开(公告)号：US08234773B2

公开(公告)日：2012-08-07

申请号：US12751308

申请日：2010-03-31

Applicant: Sarah S. Bedair ,  Brian Morgan ,  Christopher D. Meyer

Inventor： Sarah S. Bedair ,  Brian Morgan ,  Christopher D. Meyer

IPC: G01N15/06 ,  G01N33/00 ,  G01N33/48

CPC classification number: H05K3/1258 ,  H05K1/16 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/09909 ,  H05K2203/105 ,  Y10T29/49002

Abstract: A method of forming at least one electronic device on a substrate comprising creating a depository and an attached capillary; providing a liquid containing particles in the range 1 nanometer to 1 millimeter for deposit into the depository; the liquid flowing into the at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; whereby the agglomerate is used to form a part of the at least one electronic device. An microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate formed by at least one wall, a capillary channel coupled to said depository adapted to be filled with liquid comprising nanoparticles by capillary action, whereby as the liquid evaporates, an agglomerate forms in the capillary channel having a substantially uniform distribution of the particles.

Abstract translation: 一种在衬底上形成至少一个电子器件的方法，包括形成存放器和附着的毛细管; 提供含有1纳米至1毫米范围内的颗粒的液体沉积到储存库中; 所述液体通过毛细管作用流入所述至少一个毛细管; 蒸发液体，使得颗粒形成从至少一个毛细管的末端开始的附聚物，其中颗粒在附聚物内具有基本均匀的分布; 由此所述附聚物用于形成所述至少一个电子装置的一部分。 一种微电子集成电路器件，包括衬底; 耦合到由至少一个壁形成的所述基底的储存器，耦合到所述储存器的毛细通道，其适于通过毛细管作用填充包含纳米颗粒的液体，由此当液体蒸发时，在毛细通道中形成具有基本均匀分布的附聚物 的颗粒。

公开(公告)号：US20120074563A1

公开(公告)日：2012-03-29

申请号：US13200377

申请日：2011-09-23

Applicant: Yuji Iizuka

Inventor： Yuji Iizuka

IPC: H01L23/488 ,  B23K31/02 ,  B23K1/20

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/26145 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81905 ,  H01L2224/8384 ,  H01L2224/92242 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0263 ,  H05K3/32 ,  H05K3/328 ,  H05K3/4046 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10303 ,  H05K2203/0425 ,  H01L2924/01046 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/81815 ,  H01L2924/00

Abstract: A semiconductor apparatus includes a semiconductor chip, a post electrode positioned on the front surface electrode, and a metal particle layer having metal particles bonded actively to each other. The front surface electrode and the post electrode are bonded with each other through the metal particle layer. A method of manufacturing a semiconductor apparatus includes the steps of coating metal particles protected with organic coating films to at least one of the front surface electrode of a semiconductor chip or the post electrode; pressing and heating the metal particles between the front surface electrode of the semiconductor chip and post electrode for breaking the organic coating films and for exposing the metal particles; and actively bonding the exposed metal particles to each other for bonding the front surface electrode and post electrode.

Abstract translation: 半导体装置包括半导体芯片，位于前表面电极上的柱状电极和具有彼此主动结合的金属颗粒的金属颗粒层。 前表面电极和后电极通过金属颗粒层彼此接合。 制造半导体装置的方法包括以下步骤：将被有机涂膜保护的金属颗粒涂覆到半导体芯片的前表面电极或柱电极中的至少一个; 在半导体芯片的前表面电极和柱电极之间压制和加热金属颗粒，用于破坏有机涂膜并暴露金属颗粒; 并且将暴露的金属颗粒彼此主动结合，以便粘结前表面电极和柱电极。

公开(公告)号：US08102063B2

公开(公告)日：2012-01-24

申请号：US12684969

申请日：2010-01-11

Applicant: Lee-Sheng Yen

Inventor： Lee-Sheng Yen

IPC: H01L23/48 ,  H05K1/09

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H05K3/244 ,  H05K3/247 ,  H05K3/249 ,  H05K2201/0257 ,  H05K2201/0329 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A pad structure includes a copper circuit pattern on a substrate, at least a gold layer stacked on the copper circuit pattern, and a nano-structured coating film stacked on the gold layer.

Abstract translation: 衬垫结构包括在衬底上的铜电路图案，至少堆叠在铜电路图案上的金层和堆叠在金层上的纳米结构涂层膜。

公开(公告)号：US20120009353A1

公开(公告)日：2012-01-12

申请号：US13234344

申请日：2011-09-16

Applicant: Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yi-Ting Cheng

Inventor： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yi-Ting Cheng

IPC: B05D3/06

CPC classification number: H05K3/102 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

Abstract: A manufacturing method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed.

Abstract translation: 描述了通过使用光热效应制造具有表面基板的基板的制造方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有预定图案的层的衬底。

公开(公告)号：US08063315B2

公开(公告)日：2011-11-22

申请号：US11802434

申请日：2007-05-23

Applicant: Rabindra N. Das ,  Kostas I. Papathomas ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  Kostas I. Papathomas ,  Voya R. Markovich

IPC: H05K1/11

CPC classification number: H05K1/0313 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/52 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/097 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0257 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.

Abstract translation: 一种电路化基板，包括用于提供电连接的导电浆料。 在一个实施方案中，糊状物包括包含纳米颗粒的金属组分，并且可以包括附加元素，例如焊料或其它金属微粒，以及导电聚合物和有机物。 糊料组合物的颗粒烧结并且根据添加的另外的元素而熔化，因为层压，从而形成通过糊料的有效连续的电路。 还提供了制造这种基板的方法，以及利用该基板并且包括诸如与其耦合的半导体芯片的电子部件的电组件。

公开(公告)号：US20110260115A1

公开(公告)日：2011-10-27

申请号：US13155367

申请日：2011-06-07

Applicant: Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

Inventor： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

IPC: H01B1/24 ,  H01B1/22 ,  B82Y99/00

CPC classification number: H01B1/22 ,  B82Y10/00 ,  C09D11/52 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.

Abstract translation: 提供含有银纳米颗粒的导电糊料和设置有导电电路板的导电电路板。 含有银纳米颗粒的导电糊料包含基于导电浆料的总重量的15至50重量％的银纳米颗粒，银纳米颗粒具有1至100nm的平均粒径; 0.1至2.5重量％的碳纳米管，基于导电浆料的总重量，碳纳米管的平均直径为2至40nm; 1〜15重量％的粘合剂，基于导电浆料的总重量; 和溶剂。

公开(公告)号：US08039107B2

公开(公告)日：2011-10-18

申请号：US11915659

申请日：2006-05-23

Applicant: Ken Asada ,  Fumiaki Kikui

Inventor： Ken Asada ,  Fumiaki Kikui

IPC: B32B15/02 ,  B22B1/02

CPC classification number: B22F1/02 ,  B23K35/02 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15182 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/10234 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A silver-coated ball 10 according to the present invention includes: a spherical core 1; and a coating layer 2 including silver superfine particles, which is arranged so as to surround the core 1. The silver superfine particles included in the coating layer 2 have a mean particle size of 1 nm to 50 nm.

Abstract translation: 根据本发明的镀银球10包括：球形芯1; 以及包含银超细颗粒的涂层2，其被布置为围绕芯体1。包覆在涂层2中的银超微粒的平均粒径为1nm〜50nm。

公开(公告)号：US07923110B2

公开(公告)日：2011-04-12

申请号：US11653889

申请日：2007-01-17

Applicant: Jong Jin Park ,  Dong Woo Shin ,  Sung Woong Kim

Inventor： Jong Jin Park ,  Dong Woo Shin ,  Sung Woong Kim

IPC: B32B5/16

CPC classification number: G03F7/0047 ,  B05D1/185 ,  C03C17/06 ,  H05K3/02 ,  H05K2201/0257 ,  H05K2203/0514 ,  Y10S977/777 ,  Y10S977/778 ,  Y10S977/779 ,  Y10T428/2991

Abstract: A metal nanoparticle which is prepared by forming a self-assembled monolayer including a terminal reactive group on the surface thereof, and introducing a functional group capable of being removed by the action of an acid or an base into the terminal reactive group wherein the self-assembled monolayer is built up of a thiol, an isocyanide, an amine, a carboxylate or a phosphate compound having the terminal reactive group, or built up of a thiol, an isocyanide, an amine, a carboxylate or a phosphate compound having no terminal reactive group followed by introducing the terminal reactive group thereto; and a method for forming a conductive pattern using the same are provided. Since the metal nanoparticle of exemplary embodiments of the present invention can easily form a high conductive film or a high conductive pattern through photo-irradiation and photo-degradation and randomly regulate its conductivity when occasions demand, it can be advantageously applied to an antistatic washable sticky film, antistatic shoes, a conductive polyurethane printer roller, an electromagnetic interference shielding, and the like.

Abstract translation: 一种金属纳米颗粒，其通过在其表面上形成包括末端反应性基团的自组装单层并将能够通过酸或碱的作用除去的官能团引入末端反应性基团而制备， 组装的单层由硫醇，异氰化物，胺，羧酸酯或具有末端反应性基团的磷酸酯化合物构成，或由硫醇，异氰化物，胺，羧酸酯或不具有末端反应性的磷酸酯化合物 然后引入末端反应性基团; 并且提供了使用其形成导电图案的方法。 由于本发明的示例性实施方案的金属纳米颗粒可以通过光照射和光降解容易地形成高导电膜或高导电图案，并且当需要时随机调节其导电性，因此可以有利地应用于抗静电可洗粘性 薄膜，抗静电鞋，导电性聚氨酯打印辊，电磁干扰屏蔽等。

公开(公告)号：US20110061908A1

公开(公告)日：2011-03-17

申请号：US12875184

申请日：2010-09-03

Applicant: Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

Inventor： Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K3/06 ,  H01L51/442 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/121 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T428/12063

Abstract: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing solution on a portion of the conductive layer, which is to be removed, and a step of washing the resulting printed material, whereby the portion of the conductive layer on which the metal particle removing solution has been printed is removed to form a non-conductive portion.

Abstract translation: 公开了一种制造导电性，透明性和蚀刻性优异的图形电极的方法以及图案电极，所述方法包括将含金属颗粒的溶液涂布在基板上以形成导电层的步骤，图案印刷步骤 将要除去的导电层的一部分上的金属颗粒去除溶液和洗涤所得印刷材料的步骤，从而去除已经印刷有金属颗粒去除溶液的导电层的部分以形成 非导电部分。

公开(公告)号：US20110059234A1

公开(公告)日：2011-03-10

申请号：US12879596

申请日：2010-09-10

Applicant: Young-Hun BYUN ,  Jae-Ho LEE ,  Young-Hwan KIM

Inventor： Young-Hun BYUN ,  Jae-Ho LEE ,  Young-Hwan KIM

IPC: B05D5/12 ,  H01B1/22

CPC classification number: H01B1/22 ,  C23C18/08 ,  H01B1/026 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2203/1105 ,  H05K2203/121

Abstract: Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.

Abstract translation: 公开了包含导电金属或导电金属前体化合物和羧酸 - 胺碱离子对盐的金属图案组合物。