公开(公告)号：US07915727B2

公开(公告)日：2011-03-29

申请号：US12385731

申请日：2009-04-17

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01L23/498 ,  H01L23/36

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US07904148B2

公开(公告)日：2011-03-08

申请号：US11517860

申请日：2006-09-07

Applicant: Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20090223047A1

公开(公告)日：2009-09-10

申请号：US12467535

申请日：2009-05-18

Applicant: Peter A. Hochstein

Inventor： Peter A. Hochstein

IPC: H01R43/20

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V23/00 ,  F21V29/89 ,  G09F9/33 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/056 ,  H05K3/202 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/1028 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: An L.E.D. lamp assembly (20) includes an electrically insulative coating (24) disposed on a thermally conductive substrate (22). A plurality of light emitting diodes (26) are secured to the coating (24) and a circuit (40) is adhesively secured to the coating (24) in predetermined spaced lengths (42) along the coating (24) to establish discrete and electrically conductive spaced lengths (42) with the light emitting diodes (26) disposed between the spaced lengths (42). LED electrical leads (32) are secured to the spaced lengths (42) of the circuit (40) to electrically interconnect the light emitting diodes (26). The circuit (40) includes a foil tape (46) having an electrically conductive tape portion (48) and a coupling portion (50) disposed on the tape portion (48) for securing the foil tape (46) to the insulated substrate (22). Heat generated by the light emitting diodes (26) is transferred through the insulative coating (24) to the electrically and thermally conductive substrate (22) for dissipating the heat.

Abstract translation: 一个L.E.D. 灯组件（20）包括设置在导热基板（22）上的电绝缘涂层（24）。 多个发光二极管（26）固定到涂层（24）上，并且电路（40）沿着涂层（24）以预定间隔的长度（42）以固定方式固定到涂层（24）上，以建立离散和电气 导电间隔的长度（42），其中发光二极管（26）设置在间隔开的长度（42）之间。 LED电引线（32）固定到电路（40）的间隔长度（42）以电连接发光二极管（26）。 电路（40）包括具有导电带部分（48）和设置在带部分（48）上的耦合部分（50）的箔带（46），用于将箔带（46）固定到绝缘基底（22） ）。 由发光二极管（26）产生的热量通过绝缘涂层（24）传递到导电和导热基板（22）以散热。

公开(公告)号：US20080142071A1

公开(公告)日：2008-06-19

申请号：US11639428

申请日：2006-12-15

Applicant: Randy Dorn ,  Bruce Hachtmann ,  David Harris ,  Ilan Gur ,  David Pearce ,  William Sanders ,  Ben Tarbell

Inventor： Randy Dorn ,  Bruce Hachtmann ,  David Harris ,  Ilan Gur ,  David Pearce ,  William Sanders ,  Ben Tarbell

IPC: H01L31/045 ,  H01L31/042

CPC classification number: H05K3/222 ,  H01L31/02021 ,  H01L31/0504 ,  H02S30/20 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/326 ,  H05K3/4084 ,  H05K2201/1028 ,  H05K2201/1059 ,  H05K2203/1189 ,  H05K2203/173 ,  Y02E10/50

Abstract: A photovoltaic (PV) module includes a plurality of PV cells and a plurality of reconfigurable interconnects which electrically interconnect the plurality of PV cells.

Abstract translation: 光伏（PV）模块包括电连接多个PV电池的多个PV电池和多个可重构互连。

公开(公告)号：US20070298663A1

公开(公告)日：2007-12-27

申请号：US11850923

申请日：2007-09-06

Applicant: Joseph Marshall ,  Douglas Weems ,  Richard Bussom ,  David Anderson

Inventor： Joseph Marshall ,  Douglas Weems ,  Richard Bussom ,  David Anderson

IPC: H01R13/66

CPC classification number: H05K3/103 ,  B29C35/0272 ,  B29C70/86 ,  B29C70/885 ,  B64C27/473 ,  B64C2027/7283 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/10151 ,  H05K2201/1028 ,  Y02T50/34 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49087 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T428/24942

Abstract: A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract translation: 提供具有集成电路的复合结构件。 结构构件包括多层结构增强材料，并且两个或更多个电气装置至少部分地设置在层之间，其中结构增强材料的中间层设置在电气装置之间。 至少一个电气总线设置在结构构件中，并且每个电气装置通过导电电极连接到总线。 因此，电极可以延伸穿过结构增强材料的中间层，以将每个电气设备连接到一个或多个总线。

公开(公告)号：US07211103B2

公开(公告)日：2007-05-01

申请号：US10174349

申请日：2002-06-17

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

IPC: A61N1/00

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封的电子封装通过几种方法之一直接接合到柔性电路或电极，包括通过导电粘合剂（例如环氧树脂或聚酰亚胺）附着，其包含生物相容性胶中的铂金属薄片; 由绝缘层覆盖的铂凸块的扩散接合; 线钉热焊接; 或集成互连制造。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20070046728A1

公开(公告)日：2007-03-01

申请号：US11592984

申请日：2006-11-06

Applicant: Kia Silverbrook ,  Norman Berry ,  Garry Jackson ,  Akira Nakazawa

Inventor： Kia Silverbrook ,  Norman Berry ,  Garry Jackson ,  Akira Nakazawa

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14427 ,  B41J2/155 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H01R12/721 ,  H01R12/79 ,  H01R13/2414 ,  H01R13/6315 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/1028 ,  H05K2201/10424

Abstract: A printhead assembly is provided having at least one printhead module of at least two printhead integrated circuits having nozzles for delivering printing fluid onto the surface of print media and a support member supporting and carrying the printing fluid to the printhead integrated circuits, a support frame supporting the printhead module, a controller for processing print data and controlling the printhead integrated circuits to print the processed print data, electrical conductors for providing power to the controller and the printhead integrated circuits, and a mounting element mounting the controller and the electrical conductors to the support frame. The mounting element has a clamping arrangement for clamping the support member to the support frame.

Abstract translation: 提供了一种打印头组件，其具有至少两个打印头集成电路的至少一个打印头模块，该打印头集成电路具有用于将打印流体输送到打印介质的表面上的喷嘴和支撑并将打印流体运送到打印头集成电路的支撑部件， 打印头模块，用于处理打印数据和控制打印头集成电路以打印经处理的打印数据的控制器，用于向控制器和打印头集成电路提供电力的电导体以及将控制器和电导体安装到 支持框架。 安装元件具有用于将支撑构件夹紧到支撑框架的夹紧装置。

公开(公告)号：US20040207496A1

公开(公告)日：2004-10-21

申请号：US10249834

申请日：2003-05-12

Inventor： JIH-HWA LEE ,  CHUN-TSUN LIANG ,  CHIA-FAN YEH

IPC: H01P005/00

CPC classification number: H05K1/025 ,  H01P11/003 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2203/171

Abstract: A method for tuning parameter of RF transmission line and a structure thereof for a printed circuit board (PCB) are provided. When the PCB is being laid out, a transmission line and a plurality of copper foils are formed on the PCB in advance, and at least one tune metal, which is welded directly to the transmission line and partial or at least a copper foil, is used to replace a discrete component such as a transistor, a capacitor, or an inductor, which is working in a low frequency. Therefore, the operation of tuning parameter of the RF element on the PCB makes good use of the open stub or short stub effect occurred between the transmission line and the copper foils, so as to modify the characteristic parameter of the RF transmission line.

Abstract translation: 提供了用于调整RF传输线的参数的方法及其用于印刷电路板（PCB）的结构。 当PCB布置时，预先在PCB上形成传输线和多个铜箔，并且直接焊接到传输线和部分或至少铜箔的至少一个调谐金属是 用于替代以低频工作的诸如晶体管，电容器或电感器的分立元件。 因此，PCB上RF元件的调谐参数的操作很好地利用了传输线和铜箔之间发生的开路短路或短路短路，从而改变了RF传输线的特性参数。

公开(公告)号：US06787706B2

公开(公告)日：2004-09-07

申请号：US10079300

申请日：2002-02-19

Applicant: Tetsuo Hirakawa

Inventor： Tetsuo Hirakawa

IPC: H05K103

CPC classification number: H05K1/0263 ,  H01L23/49861 ,  H01L23/538 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: A ceramic circuit board that protects a metallized wiring layer from fusion when a large electric current is applied thereto. The ceramic circuit board includes a ceramic substrate, a plurality of metallized wiring layers formed on the ceramic substrate, and a metal circuit plate made of copper, which is attached to part of the metallized wiring layers. The condition, S≧6×10−5i2, is fulfilled in the ceramic circuit board, whereby S (mm2) is the sectional area of the metal circuit plate and i (A) the value of a flowing electric current.

Abstract translation: 陶瓷电路板，其在施加大电流时保护金属化布线层不熔化。 陶瓷电路板包括陶瓷基板，形成在陶瓷基板上的多个金属化布线层和连接到金属化布线层的一部分的由铜制成的金属电路板。 在陶瓷电路板中满足条件S> = 6×10 -5 i 2，由此S（mm 2）是金属电路板的截面面积，i（A）a 流动电流。

公开(公告)号：US20040026116A1

公开(公告)日：2004-02-12

申请号：US10399087

申请日：2003-08-21

Inventor： Helmut Kanbach

IPC: H01B007/08

CPC classification number: H01R12/61 ,  H01R4/025 ,  H01R43/0242 ,  H05K3/363 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/175 ,  Y10T29/49149

Abstract: The invention relates to a method of connecting two flat laminated cable ends. A metal strip tin-plated with a solder coating is placed transversely over the conductor tracks between the two flat laminated cable ends, the flat laminated cable ends are pressed onto each other with the tin-plated metal strip lying in between, current is applied to the metal strip and it is heated until the solder of the metal strip melts and enters into a soldered connection with the conductor tracks of the flat laminated cables, and, after the soldered connection, the metal strip is separated in the intermediate spaces between two neighboring conductor tracks.

Abstract translation: 本发明涉及连接两个扁平层叠电缆端部的方法。 将镀有焊料涂层的金属带横向地放置在两个平的层压电缆端之间的导体轨道上，将平坦的层压电缆端部彼此压在镀锡金属带之间，电流施加到 金属带加热直到金属条的焊料熔化并进入与扁平层压电缆的导体轨道的焊接连接，并且在焊接连接之后，金属带在两个相邻的中间空间之间分离 导轨。