公开(公告)号：US20080080154A1

公开(公告)日：2008-04-03

申请号：US11892600

申请日：2007-08-24

Applicant: Masahiro Tagano ,  Teruyuki Kitahara

Inventor： Masahiro Tagano ,  Teruyuki Kitahara

IPC: H01R9/22 ,  H01R12/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract translation: 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。

公开(公告)号：US20070211443A1

公开(公告)日：2007-09-13

申请号：US11371838

申请日：2006-03-09

Applicant: David Wechter ,  Richard Lukaszewski ,  Sharon Renard ,  Jon Simons ,  David Danek ,  Michael Kreiter ,  Thomas Fuller

Inventor： David Wechter ,  Richard Lukaszewski ,  Sharon Renard ,  Jon Simons ,  David Danek ,  Michael Kreiter ,  Thomas Fuller

IPC: H05K7/00

CPC classification number: H05K7/1432 ,  H05K1/0286 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10856

Abstract: A method and product produced includes a power layer board that is manufactured by providing a printed circuit board having an input configured to receive an input power and an output configured to deliver an output power conditioned to power a motor. The method also includes soldering a first component to the printed circuit board. Thereafter, a request to manufacture the power layer board is received that includes parameters of the input power and/or the output power. Therefrom, characteristics of a second component including a resistor, a capacitor, and/or an inductor is identified based on the parameters of the input power and/or the output power. Accordingly, the identified second component is mounted to the printed circuit board through a solder-less cold-weld connector to complete the power layer board.

Abstract translation: 所生产的方法和产品包括功率层板，其通过提供具有被配置为接收输入功率的输入的印刷电路板和被配置为递送调节以为电动机供电的输出功率的输出而制造。 该方法还包括将第一组件焊接到印刷电路板。 此后，接收到包括输入功率和/或输出功率的参数的制造功率层板的请求。 因此，基于输入功率和/或输出功率的参数来识别包括电阻器，电容器和/或电感器的第二部件的特性。 因此，所识别的第二部件通过无焊料冷焊接连接器安装到印刷电路板，以完成电源层板。

公开(公告)号：US07189081B2

公开(公告)日：2007-03-13

申请号：US10341468

申请日：2003-01-14

Applicant: Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

Inventor： Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

IPC: H01R12/00

CPC classification number: B60R16/0238 ,  H01R9/2466 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/2036 ,  Y10S439/949

Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.

Abstract translation: 端子安装结构包括板（21）。 该结构包括安装在板上的端子（26）。 端子包括可移除地连接到连接部件（16,17,18）的第一端部（26a）。 端子包括在升高位置焊接到板的第二端（26b）。 端子包括在端子的中间并相对于相应的第一和第二端成各个角度的弯曲部分（26d）。 该结构包括面对板的保持构件（30,40），并且保持弯曲部分。

公开(公告)号：US20060107523A1

公开(公告)日：2006-05-25

申请号：US10996935

申请日：2004-11-24

Applicant: Mike Blossfeld ,  Luis Sanchez

Inventor： Mike Blossfeld ,  Luis Sanchez

IPC: H05K3/36

CPC classification number: H05K3/3415 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49163

Abstract: a method of making a printed circuit board including the steps of: providing a board with electrical conductor traces; applying a solder material to at least one selected location on a first side of the board; placing a first component on the first side of the board; heating the board and solder material to reflow the solder applied to the first side of the board to provide an electrical connection of the first component with a first conductor trace portion of the board; and then connecting a second component to the board and providing a nonsoldered electrical connection between the second component and a second electrical conductor trace portion of the board.

Abstract translation: 一种制造印刷电路板的方法，包括以下步骤：为电路板提供导电迹线; 将焊料材料施加到所述板的第一侧上的至少一个选定位置; 将第一个部件放在电路板的第一面上; 加热板和焊料材料以回流焊接到板的第一侧的焊料，以提供第一部件与板的第一导体迹线部分的电连接; 然后将第二部件连接到电路板上，并在第二部件和电路板的第二电导体迹线部分之间提供非复杂的电连接。

公开(公告)号：US06875056B1

公开(公告)日：2005-04-05

申请号：US10668793

申请日：2003-09-22

Applicant: Gioni Bianchini ,  Iggoni Fajardo

Inventor： Gioni Bianchini ,  Iggoni Fajardo

IPC: H01R12/57 ,  H05K3/30 ,  H01R13/648

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/10371 ,  H05K2201/10856

Abstract: A package for a fiber optic transceiver that integrates the intermediate rear gasket into the lower body of the transceiver package. As such, the EMI fingers are much thicker than current art EMI fingers, 0.010″ thick as compared to current art 0.002″ thick. In current art devices, providing such robust EMI fingers is not possible. The connecting pins that secure the transceiver cage to the PCB are self-centering press-fit pins formed from a plurality of legs. At least one of the legs provides an electrical connection point for the transceiver on which the pins are used. The connecting pin is formed so that the legs act as leaf springs to securely hold the connector in place in the proper installation hole in the board on which the transceiver is installed. The pins are stamped from sheet metal with a progressive die process. By changing the amount of flexion in the legs of the pin, the pressure required to insert the pin into a connection hole, and hence the retaining pressure, can be varied.

Abstract translation: 用于光纤收发器的封装，将中间后垫圈集成到收发器封装的下部。 因此，与现有技术的0.002“厚度相比，EMI指状物比当前的EMI指针厚0.010英寸厚。 在当前的艺术设备中，提供这种鲁棒的EMI指针是不可能的。 将收发器笼固定到PCB的连接销是由多个腿形成的自定心压配销。 腿中的至少一个提供用于其上使用销的收发器的电连接点。 连接销形成为使得腿部用作板簧，以将连接器牢固地保持在安装有收发器的板的正确安装孔中的适当位置。 这些销钉是用金属板冲压成型的。 通过改变销的腿部的弯曲量，可以改变将销插入连接孔所需的压力以及因此的保持压力。

公开(公告)号：US20040248437A1

公开(公告)日：2004-12-09

申请号：US10453119

申请日：2003-06-03

Inventor： Marvin Glenn Wong

IPC: H01R012/00

CPC classification number: H05K3/3405 ,  H01R12/721 ,  H01R43/205 ,  H05K1/0306 ,  H05K1/117 ,  H05K3/0061 ,  H05K2201/10386 ,  H05K2201/10856

Abstract: Devices and methods are disclosed for reinforcing substrates having edge-mount connectors. In one embodiment, the device comprises a fragile substrate, a reinforcement plate bonded to the substrate, and an edge-mount connector mated with the substrate and the reinforcement plate.

Abstract translation: 公开了用于加强具有边缘安装连接器的基板的装置和方法。 在一个实施例中，该装置包括易碎基板，与基板结合的加强板，以及与基板和加强板配合的边缘安装连接器。

公开(公告)号：US06750396B2

公开(公告)日：2004-06-15

申请号：US09737303

申请日：2000-12-15

Applicant: Apurba Roy

Inventor： Apurba Roy

IPC: H05K500

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: A low impedance surface-mount connector includes a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

Abstract translation: 低阻表面安装连接器包括具有I形横截面的圆柱形杆的长度。 该器件允许通过拾取和放置技术进行互连，并且互连具有低电阻，低电感，机械符合性和易于制造的优点。 具有一个或多个电路部件的第一电路装置通过将这种连接器表面安装在第一电路装置上而与第二电路装置互连，在第二电路装置上提供相应的焊盘，并将第一电路装置的连接器安装到焊盘 的第二。

公开(公告)号：US20030114027A1

公开(公告)日：2003-06-19

申请号：US10023181

申请日：2001-12-17

Inventor： Woody Wurster

IPC: H05K001/00

CPC classification number: H01R12/52 ,  H01R12/585 ,  H01R12/716 ,  H01R12/718 ,  H01R12/737 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856 ,  Y10S439/943

Abstract: A pair of circuit boards (60, 62) with holes (50, 56), are connected by right angle contacts (10) that are each formed of a single piece of metal with a 90null bend forming first and second elongated contact portions (20, 22) extending along perpendicular axes (24, 26). Each elongated portion has a resiliently compressible pin end (30, 32) for pushing into a circuit board hole, and has a distal end at the bend. A slot (70) at the bend extends into each distal end, with each end of the slot forming a push surface (80, 82) that lies on the corresponding axis. Each pin end of the connector can be installed by a tool projection that enters one end of a slot and pushes the corresponding pin end (20) along its axis. One of the elongated portions (22) can be longer than the other one (20), and an insulative body (64) is attached to the longer elongated portion.

Abstract translation: 具有孔（50,56）的一对电路板（60,62）通过直角接触件（10）连接，每个直角接触件（10）由具有90°弯曲形成的第一和第二细长接触部分的单个金属构成 20,22）沿垂直轴线（24,26）延伸。 每个细长部分具有可弹性压缩的销端（30,32），用于推入电路板孔中，并且在弯曲处具有远端。 弯曲处的狭槽（70）延伸到每个远端，槽的每个端部形成位于相应轴线上的推动表面（80,82）。 连接器的每个销端可以通过进入槽的一端并沿其轴线推动相应销端（20）的工具突起来安装。 细长部分（22）中的一个可以比另一个（20）长，并且绝缘体（64）附接到较长的细长部分。

公开(公告)号：US20020131255A1

公开(公告)日：2002-09-19

申请号：US10138173

申请日：2002-05-02

Inventor： Apurba Roy

IPC: H01R012/14

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

公开(公告)号：US06428329B2

公开(公告)日：2002-08-06

申请号：US09753986

申请日：2001-01-03

Applicant: Kazuya Orui ,  Yasuhiro Nagashima ,  Toshiaki Harigaya ,  Manabu Shimizu ,  Chiharu Nunokawa

Inventor： Kazuya Orui ,  Yasuhiro Nagashima ,  Toshiaki Harigaya ,  Manabu Shimizu ,  Chiharu Nunokawa

IPC: H01R458

CPC classification number: H05K3/368 ,  H01L2924/00013 ,  H01R12/523 ,  H01R12/585 ,  H01R43/205 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10863 ,  H05K2201/2036 ,  H01L2224/29099

Abstract: An interposition structure interposed between substrates and capable of guiding the insertion of a connection pin for electrically connecting the substrates to each other, whereby the connection pin can be inserted properly even in cases where the substrates to be connected or other members have a dimensional error caused during production thereof, a positioning error or the like. The interposition structure has an interposition body in which a through hole is formed such that connection pin inlet and outlet portions thereof each have an inner diameter gradually increasing in a direction from the inner part to the corresponding outer open end thereof, and also has a positioning protuberance provided on the underside of the interposition body. The interposition structure is interposed between upper and lower substrates with the positioning protuberance received in a recess formed in the upper surface of the lower substrate, and the connection pin is inserted through a hole in the upper substrate, the through hole, and a hole in the lower substrate.

Abstract translation: 插入在基板之间并且能够引导用于将基板彼此电连接的连接销的插入结构，从而即使在要连接的基板或其他构件具有尺寸误差的情况下也可以适当地插入连接销 在其生产期间，定位误差等。 插入结构具有插入体，其中形成通孔，使得连接针入口和出口部分的内径在从内部到其对应的外部开口端的方向上具有逐渐增加的内径，并且还具有定位 设置在插入体下面的凸起。 插入结构插入在上下基板之间，定位突起容纳在形成在下基板的上表面中的凹部中，并且连接销穿过上基板，通孔和孔中的孔 下基板。