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公开(公告)号：US07403369B2
公开(公告)日：2008-07-22
申请号：US11457636
申请日：2006-07-14
Applicant: Apurba Roy
Inventor： Apurba Roy
Abstract: A low-inductance multilayer parallel plate capacitor in the form of a rectangular parallelepiped includes at least one pair of consecutive composite layers stacked parallel to each other in the vertical direction, each having a dielectric substrate and a conductor plate. Each conductor plate includes one or more lead portions to enable connection to terminations, and plates on consecutive composite layers are connected to terminations of opposite polarity. Each conductor plate advantageously includes one or more non-conductive regions that provide directionality to the currents flowing through the plates, resulting in a capacitor structure with greatly reduced inductance.
Abstract translation: 长方体形式的低电感多层平行平板电容器包括在垂直方向上彼此平行堆叠的至少一对连续复合层，每层具有电介质基板和导体板。 每个导体板包括一个或多个引线部分以使得能够连接到终端，并且连续的复合层上的板连接到相反极性的端子。 每个导体板有利地包括一个或多个非导电区域，其提供流过板的电流的方向性，导致电感器结构具有大大降低的电感。
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公开(公告)号：US06750396B2
公开(公告)日：2004-06-15
申请号：US09737303
申请日：2000-12-15
Applicant: Apurba Roy
Inventor： Apurba Roy
IPC: H05K500
CPC classification number: H01R12/57 , H01L23/49811 , H01L2924/0002 , H01L2924/3011 , H01R12/52 , H05K3/3426 , H05K3/368 , H05K2201/1031 , H05K2201/10666 , H05K2201/10856 , Y02P70/611 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49211 , H01L2924/00
Abstract: A low impedance surface-mount connector includes a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.
Abstract translation: 低阻表面安装连接器包括具有I形横截面的圆柱形杆的长度。 该器件允许通过拾取和放置技术进行互连，并且互连具有低电阻，低电感，机械符合性和易于制造的优点。 具有一个或多个电路部件的第一电路装置通过将这种连接器表面安装在第一电路装置上而与第二电路装置互连，在第二电路装置上提供相应的焊盘，并将第一电路装置的连接器安装到焊盘 的第二。
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公开(公告)号：US06175500B1
公开(公告)日：2001-01-16
申请号：US09158671
申请日：1998-09-22
Applicant: Apurba Roy
Inventor： Apurba Roy
IPC: H05K720
CPC classification number: H05K7/20509 , H05K1/0209 , H05K3/341 , H05K2201/09781 , H05K2201/10204
Abstract: In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.
Abstract translation: 根据本发明，多个高导热体结合到组分填充的基底表面的相对热点，以提供从表面到上覆热平面的热传导。 高导电体可以配置用于拾取和放置应用，并在焊接中自对准。 接收衬底上的焊盘有助于低热阻焊接和自对准。 在优选实施例中，本体是具有分叉结合表面的矩形平行镊子。
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公开(公告)号：US07251116B2
公开(公告)日：2007-07-31
申请号：US11457523
申请日：2006-07-14
Applicant: Apurba Roy
Inventor： Apurba Roy
Abstract: A multilayer parallel plate capacitor with an extremely low inductance comprises a generally rectangular parallelepiped that includes at least one pair of generally rectangular consecutive composite layers stacked parallel to each other in the vertical direction, each composite layer of the pair comprising a dielectric substrate and a conductor plate thereon. Each conductor plate includes two or more lead portions to enable connection to terminal electrodes, and plates on consecutive composite layers are connected to terminal electrodes of opposite polarity. Each conductor plate advantageously includes one or more non-conductive regions comprising slots in the transverse direction, and one or more non-conductive regions comprising slots in the longitudinal direction. These slots provide directionality to the electrical currents through the plates, resulting in a capacitor structure with greatly reduced inductance.
Abstract translation: 具有极低电感的多层平行平板电容器包括大致长方体，其包括在垂直方向上彼此平行堆叠的至少一对大致矩形的连续复合层，该对中的每个复合层包括电介质基板和导体 在其上。 每个导体板包括两个或更多个引线部分，以使得能够连接到端子电极，并且连续复合层上的板连接到相反极性的端子电极。 每个导体板有利地包括一个或多个在横向方向上包括槽的非导电区域，以及一个或多个在纵向上包括槽的非导电区域。 这些槽提供了通过板的电流的方向性，导致电感器结构大大降低了电感。
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公开(公告)号：US20070019365A1
公开(公告)日：2007-01-25
申请号：US11457636
申请日：2006-07-14
Applicant: Apurba Roy
Inventor： Apurba Roy
IPC: H01G4/005
Abstract: A multilayer parallel plate capacitor with an extremely low inductance in the form of a generally rectangular parallelepiped includes at least one pair of generally rectangular consecutive composite layers stacked parallel to each other in the vertical direction, each composite layer of the pair comprising a dielectric substrate and a conductor plate thereon. Each conductor plate includes one or more lead portions to enable connection to terminations, and plates on consecutive composite layers are connected to terminations of opposite polarity. Each conductor plate advantageously includes one or more non-conductive regions, comprising slots, that provide directionality to the currents through the plates, resulting in a capacitor structure with greatly reduced inductance.
Abstract translation: 具有大体上长方体形式的极低电感的多层平行平板电容器包括在垂直方向上彼此平行堆叠的至少一对大致矩形的连续复合层，该对中的每个复合层包括电介质基片和 其上的导体板。 每个导体板包括一个或多个引线部分以使得能够连接到终端，并且连续的复合层上的板连接到相反极性的端子。 每个导体板有利地包括一个或多个非导电区域，包括槽，其提供通过板的电流的方向性，导致电感器结构具有大大降低的电感。
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Patent Agency Ranking
公开(公告)号：US06692269B2
公开(公告)日：2004-02-17
申请号：US09737410
申请日：2000-12-15
Applicant: Apurba Roy , Milivoje Slobodan Brkovic
Inventor： Apurba Roy , Milivoje Slobodan Brkovic
IPC: H01R1200
CPC classification number: H01R43/0256 , H01R12/52 , H05K3/3426 , H05K3/368 , H05K2201/0949 , H05K2201/09954 , H05K2201/10303 , H05K2201/1031 , Y02P70/611
Abstract: In accordance with the invention, a circuit module is provided with a plurality of dual capacity connector pads, each pad holding a miniature surface mount connector and/or a connection pin. The preferred I-channel surface mount connector is sufficiently small that the module can be connected by either surface mount or pin to the same region of the circuit board.
Abstract translation: 根据本发明，电路模块设置有多个双电容连接器焊盘，每个焊盘保持微型表面安装连接器和/或连接引脚。 优选的I通道表面安装连接器足够小，使得模块可以通过表面安装或引脚连接到电路板的相同区域。
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公开(公告)号：US5479695A
公开(公告)日：1996-01-02
申请号：US270197
申请日：1994-07-01
Applicant: Gideon S. Grader , David W. Johnson, Jr. , Apurba Roy , John Thomson, Jr.
Inventor： Gideon S. Grader , David W. Johnson, Jr. , Apurba Roy , John Thomson, Jr.
CPC classification number: H01F41/16 , H01F17/0033 , Y10T29/4902
Abstract: Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic material to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.
Abstract translation: 使用多层共烧陶瓷带技术将磁性部件制成为整体式结构。 这些磁性部件的制造涉及构造多层磁性材料和绝缘非磁性材料，以形成具有良好限定的磁性和绝缘非磁性区域的整体结构。 通过导电通孔，通过多层结构连接的丝网印刷导体形成绕线。
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公开(公告)号：US5239744A
公开(公告)日：1993-08-31
申请号：US818669
申请日：1992-01-09
Applicant: Debra A. Fleming , David W. Johnson, Jr. , Warren W. Rhodes , Apurba Roy , John Thomson, Jr.
Inventor： Debra A. Fleming , David W. Johnson, Jr. , Warren W. Rhodes , Apurba Roy , John Thomson, Jr.
CPC classification number: H01F41/16 , B28B1/48 , B28B7/342 , Y10T29/4902 , Y10T29/49833
Abstract: Multilayer magnetic components can be made with reduced cracking and magnetic degradation by forming layers having patterns of magnetic and insulating regions separated by regions that are removable during sintering. Advantageously, when the layers are stacked, layers of removable material are also disposed between magnetic regions and insulating regions so as to produce upon sintering a magnetic core within an insulating body wherein the core is substantially completely surrounded by a thin layer of free space.
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公开(公告)号：US06792667B2
公开(公告)日：2004-09-21
申请号：US10041792
申请日：2001-10-23
Applicant: Apurba Roy , Florencio Eiranova
Inventor： Apurba Roy , Florencio Eiranova
IPC: H01F706
CPC classification number: H01F27/263 , H01F27/266 , H01F27/2804 , H01F2027/2814 , H05K1/165 , Y10T29/49002 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
Abstract: In accordance with the invention, a high quality magnetic device is produced without manual intervention by the step of providing a substrate including an aperture and conductive coil extending peripherally around the aperture and bonding together two parts of a magnetic body extending through the aperture. The two parts have substantially planar mating surfaces, and the bonding is effected by securing one of the parts to the substrate, applying adhesive to the portion of its mating surface exposed within the aperture, and pressing the mating surface of the second part into contact with the mating surface of the first part. During pressing, the mating surfaces are rotated in a reciprocating fashion to spread the adhesive into a thin, highly uniform film.
Abstract translation: 根据本发明，通过提供包括孔径的基板和在孔周围周向延伸的导电线圈并且将延伸穿过该孔的磁体的两部分结合在一起的步骤，制造高质量的磁性装置。 这两个部分具有基本上平面的配合表面，并且通过将部件中的一个固定到基板上来实现粘合，将粘合剂施加到其在孔内露出的配合表面的部分，并且将第二部分的配合表面按压与 第一部分的配合表面。 在挤压期间，配合表面以往复方式旋转，以将粘合剂分散成薄而高度均匀的膜。
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10.发明授权公开(公告)号：US06560105B1
公开(公告)日：2003-05-06
申请号：US10134214
申请日：2002-04-26
Applicant: Apurba Roy , Michael Zimmerman
Inventor： Apurba Roy , Michael Zimmerman
IPC: H05K720
CPC classification number: H05K7/20154
Abstract: In accordance with the invention, an open frame circuit assembly mounted on a planar substrate is provided with a composite low flow impedance voltage guard. The composite guard comprises an ESD protective cover portion and a clip portion to capture the cover portion and clip to the circuit board. The cover portion comprises a lower frame member extending peripherally around the assembly, an apertured top member overlying the assembly and a plurality of spaced apart struts supporting the top member from the frame. The top member and struts have rounded surfaces to preserve streamlines in air flowing over the assembly, and all openings and spacings are sufficiently small to preclude accidental human contact with the assembly. Large area portions of the cover portion are preferably made of polymer containing conductive fillers for ESD protection. The clip portion is preferably made of high elongation polymer for secure holding and clipping.
Abstract translation: 根据本发明，安装在平面基板上的开放式框架电路组件设置有复合低流阻抗电压保护。 复合护罩包括ESD保护盖部分和夹持部分，以捕获覆盖部分并夹紧到电路板。 盖部分包括围绕组件周向延伸的下框架构件，覆盖组件的有孔顶部构件和从框架支撑顶部构件的多个间隔开的支柱。 顶部构件和支柱具有圆形表面以保持流过组件的空气中的流线，并且所有开口和间隔足够小以防止意外的人体接触组件。 盖部分的大面积部分优选由含有用于ESD保护的导电填料的聚合物制成。 夹部分优选由高伸长率聚合物制成，用于固定和夹紧。
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