Modular Electronics
    42.
    发明申请
    Modular Electronics 审中-公开
    模块化电子

    公开(公告)号:US20170033841A1

    公开(公告)日:2017-02-02

    申请号:US15290342

    申请日:2016-10-11

    Applicant: Keyssa, Inc.

    Abstract: A computing device includes an integrated unit having a plurality of functional components, and an extremely high frequency (EHF) communication unit operatively coupled to the integrated unit. The EHF communication unit includes a transducer configured to transmit and receive EHF electromagnetic signals, and convert between electrical signals and electromagnetic signals. The computing device includes a transceiver operatively coupled to the transducer. The EHF communication unit may enable at least one of the functional components of the computing device to be supplemented by a functional component of an external computing device.

    Abstract translation: 计算设备包括具有多个功能组件的集成单元和可操作地耦合到集成单元的极高频(EHF)通信单元。 EHF通信单元包括被配置为发送和接收EHF电磁信号并在电信号和电磁信号之间转换的换能器。 计算设备包括可操作地耦合到换能器的收发器。 EHF通信单元可以使计算设备的功能组件中的至少一个由外部计算设备的功能组件来补充。

    Virtualized physical layer adapted for EHF contactless communication
    44.
    发明授权
    Virtualized physical layer adapted for EHF contactless communication 有权
    适用于EHF非接触式通信的虚拟物理层

    公开(公告)号:US09559753B2

    公开(公告)日:2017-01-31

    申请号:US14205658

    申请日:2014-03-12

    Applicant: Keyssa, Inc.

    CPC classification number: H04B5/0031 H04B5/0037 H04W76/10 H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    Abstract translation: 电子设备的主机系统的物理层(PHY)可以实现为用于极高频(EHF)非接触通信的无触点PHY(cPHY)和EHF发射机(TX),接收机(RX)和收发器 EHF-XCVR)在电子设备的极高频集成电路(EHF IC)中。 Host-cPHY将来自链路层(LINK)的逻辑通信请求转换为特定于硬件的操作,以影响通过EHF非接触式链路传输或接收信号。 链路层(LINK)也可以被优化为用于EHF非接触通信的非接触式链路层(cLINK)。 虚拟化非接触物理层(VcPHY)可以包括用于将常规链路层(LINK)与非接触物理层(Host-cPHY)耦合的非接触式物理层(Host-cPHY)和非接触式链路层(cLINK)。 多个数据流可以在一个频率范围上通过EHF非接触式链路传输。

    Extremely high frequency communication chip
    45.
    发明授权
    Extremely high frequency communication chip 有权
    极高频通信芯片

    公开(公告)号:US09553616B2

    公开(公告)日:2017-01-24

    申请号:US14215069

    申请日:2014-03-17

    Applicant: Keyssa, Inc.

    CPC classification number: H04B1/04 H04B1/44 H04B5/0031

    Abstract: An electromagnetic Extremely High Frequency (EHF) communication chip includes one or more local oscillator circuits, a transducer circuit and at least one of a modulator or a demodulator coupled to the transducer circuit. Each of the local oscillator circuits may have a local oscillator and configured collectively to generate first and second carrier signals having respective first and second EHF frequencies. The first EHF frequency may be different than the second EHF frequency. The transducer circuit may have a first transducer for transmitting and receiving EHF communication signals. The modulator may be coupled to the local oscillator circuits for modulating the first carrier signal or the second carrier signal with a first transmit base data signal. The demodulator may be for demodulating the first carrier signal or the second carrier signal to produce a first receive base data signal.

    Abstract translation: 电磁极高频(EHF)通信芯片包括一个或多个本地振荡器电路,换能器电路和耦合到换能器电路的调制器或解调器中的至少一个。 本地振荡器电路中的每一个可以具有本地振荡器并且被共同配置以产生具有相应的第一和第二EHF频率的第一和第二载波信号。 第一个EHF频率可能不同于第二个EHF频率。 换能器电路可以具有用于发送和接收EHF通信信号的第一换能器。 调制器可以耦合到本地振荡器电路,用于利用第一发射基础数据信号来调制第一载波信号或第二载波信号。 解调器可以用于解调第一载波信号或第二载波信号以产生第一接收基本数据信号。

    Wireless communication with dielectric medium

    公开(公告)号:US09525451B2

    公开(公告)日:2016-12-20

    申请号:US14533545

    申请日:2014-11-05

    Applicant: Keyssa, Inc.

    Abstract: An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

    CONTACTLESS SIGNAL SPLICING
    48.
    发明申请

    公开(公告)号:US20160323009A1

    公开(公告)日:2016-11-03

    申请号:US15204988

    申请日:2016-07-07

    Applicant: Keyssa, Inc.

    Abstract: A first electronic device may include a first electronic circuit and a second electronic circuit is provided. The first electronic device may include an internal communication link providing a signal path for conducting communication signals between the first electronic circuit and the second electronic circuit. An interface circuit may be operatively coupled to the internal communication link. The interface circuit may include an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from another EHF communications circuit of a second electronic device. This EHF electromagnetic signal may enable the second electronic device to control or monitor the first electronic device.

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