公开(公告)号：US08738149B2

公开(公告)日：2014-05-27

申请号：US13397604

申请日：2012-02-15

Applicant: Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

Inventor： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

IPC: A61N1/04

CPC classification number: A61N1/05 ,  A61N1/0541 ,  A61N1/0543 ,  B23K26/361 ,  B23K26/362

Abstract: The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

Abstract translation: 本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

公开(公告)号：US08501547B2

公开(公告)日：2013-08-06

申请号：US13567366

申请日：2012-08-06

Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC: H01L21/56

CPC classification number: A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

Abstract translation: 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US08473048B2

公开(公告)日：2013-06-25

申请号：US11385314

申请日：2006-03-20

Applicant: Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin ,  Neil Hamilton Talbot ,  Da-Yu Chang

Inventor： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin ,  Neil Hamilton Talbot ,  Da-Yu Chang

IPC: A61N1/375

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

Abstract translation: 本发明是用于植入人体的改进的密封包装。 本发明的可植入装置包括包含通过基底的导电通路的折衷不导电的低音。 电路倒装芯片结合到通孔的子集。 第二电路被引线接合到通孔的另一子集。 最后，将覆盖物粘合到基底上，使得盖，基底和通孔形成密封包装。

公开(公告)号：US08322027B1

公开(公告)日：2012-12-04

申请号：US11926498

申请日：2007-10-29

Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok

IPC: H05K3/00 ,  H05K3/10 ,  H05K1/00

CPC classification number: H05K3/06 ,  A61N1/0543 ,  H05K1/118 ,  H05K3/0041 ,  H05K3/28 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0554 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/1163 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on said insulator polymer base layer; b) applying a layer of photoresist on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; c) activating said insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with said base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of said insulator polymer layer and selective etching said insulator layer and said top coating layer to obtain at least one via; and e) filling said via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.

Abstract translation: 一种制造柔性电路电极阵列的方法，包括：a）在所述绝缘体聚合物基底层上沉积包含基底涂层，导电层和顶部涂层的金属迹线层; b）在所述金属迹线层上施加一层光致抗蚀剂，并图案化所述金属迹线层并在所述绝缘体聚合物基底层上形成金属迹线; c）激活所述绝缘体聚合物基层并沉积顶部绝缘体聚合物层并与所述基础绝缘体聚合物层形成单个绝缘聚合物层; d）在所述绝缘体聚合物层的表面上施加薄金属层和光致抗蚀剂层，并选择性地蚀刻所述绝缘体层和所述顶部涂层以获得至少一个通孔; 和e）用电极材料填充所述通孔。 放置一层聚合物。 将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。 将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。 因此阵列及其供电电缆由单体形成。 或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。 该方法提供了聚合物基底层和聚合物顶层之间的极好的粘合性，并且痕迹金属和电极的绝缘性。

公开(公告)号：US20120296444A1

公开(公告)日：2012-11-22

申请号：US13473470

申请日：2012-05-16

Applicant: Robert J. Greenberg ,  David Daomin Zhou ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Rongqing Dai ,  Richard Agustin Castro ,  Kelly H. McClure

Inventor： Robert J. Greenberg ,  David Daomin Zhou ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Rongqing Dai ,  Richard Agustin Castro ,  Kelly H. McClure

IPC: A61F2/72 ,  A61N1/04 ,  A61B5/0476

CPC classification number: A61N1/36082 ,  A61B5/04001 ,  A61B5/4064 ,  A61B5/6868 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/0539 ,  A61N1/375 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85099 ,  H01L2224/85399 ,  H01L2924/3011 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/10098 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to the at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. The output signals provide control for a motor prosthesis and the inputs signals provide sensory feedback for the motor prosthesis. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

Abstract translation: 本发明包括具有至少一个封装的可植入装置，所述至少一个封装容纳电子装置，所述电子装置通过连接到所述至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号，并且选择性地供电，并处理数据，包括 记录神经活动，并通过连接到至少一个包装的多个电极的至少一个阵列将电脉冲传递给神经组织。 该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。 输出信号提供对电动机假体的控制，并且输入信号为电动机假体提供感觉反馈。 本发明或其组分旨在安装在头部，或在头颅或硬脑膜上，或脑中或脑中。

公开(公告)号：US08180460B2

公开(公告)日：2012-05-15

申请号：US11934627

申请日：2007-11-02

Applicant: Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Brian V. Mech ,  Robert J. Greenberg ,  Qingfang Yao ,  Dao Min Zhou

Inventor： Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Brian V. Mech ,  Robert J. Greenberg ,  Qingfang Yao ,  Dao Min Zhou

IPC: A61N1/05

CPC classification number: A61N1/0543 ,  A61N1/0541 ,  A61N1/36046 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/188 ,  H05K3/22 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/0154 ,  Y10T29/49156 ,  Y10T29/49158

Abstract: A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

Abstract translation: 一种具有多于一层金属迹线的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的多于一层由聚合物层隔开的金属痕迹层，包括适于刺激神经组织的电极; 以及沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层。 聚合物材料可用作神经刺激的电极阵列体。 它们对视网膜刺激特别有用，用于创建人造视觉，人工耳蜗刺激以创建人造听觉或皮质刺激许多目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。

公开(公告)号：US07937153B2

公开(公告)日：2011-05-03

申请号：US11820744

申请日：2007-06-19

Applicant: Dao Min Zhou ,  Jerry Ok ,  Neil Hamilton Talbot ,  Brian V. Mech ,  James Singleton Little ,  Robert J. Greenberg

Inventor： Dao Min Zhou ,  Jerry Ok ,  Neil Hamilton Talbot ,  Brian V. Mech ,  James Singleton Little ,  Robert J. Greenberg

IPC: A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046

Abstract: An implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. An implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.

Abstract translation: 具有增加的稳定性的可植入电极具有聚集结构，其中电极的表面被包括充满棒或柱的开口的材料覆盖。 具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。

公开(公告)号：US07750076B2

公开(公告)日：2010-07-06

申请号：US11595516

申请日：2006-11-10

Applicant: Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

IPC: C08L83/04

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/204 ,  H05K1/0289 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2203/016 ,  H05K2203/1105

Abstract: A polymer layer comprising silicone contains oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and one or more metal traces embedded in the polymer layer, where the metal trace is bonded to the polymer silicon metal bond.

Abstract translation: 包含硅氧烷的聚合物层包含SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒，以及嵌入聚合物层中的一种或多种金属迹线， 聚合物硅金属键。

公开(公告)号：US07631424B2

公开(公告)日：2009-12-15

申请号：US11928698

申请日：2007-10-30

Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

IPC: H01R41/00 ,  A61B5/04 ,  A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape.The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。

公开(公告)号：US20090118805A1

公开(公告)日：2009-05-07

申请号：US12168740

申请日：2008-07-07

Applicant: Robert J. Greenberg ,  Jordan Matthew Neysmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Rongqing Dai ,  David Daomin Zhou ,  Gaillard R. Nolan

Inventor： Robert J. Greenberg ,  Jordan Matthew Neysmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Rongqing Dai ,  David Daomin Zhou ,  Gaillard R. Nolan

IPC: A61F9/08 ,  A61N1/05

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/118

Abstract: In a visual prosthesis electrodes stimulate retinal tissue to induce the perception of light to a user implanted with the prosthesis. The prosthesis must have a return, or common, electrode to make a complete circuit with the retinal tissue. To avoid stimulating tissue with the return electrode, it is advantageous if the electrode is large.The invention involver a flexible circuit electrode array comprising a polymer base layer, metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue a polymer top layer deposited on said polymer base layer and said metal traces, and a return electrode separate from said stimulating electrodes.The flexible circuit electrode array comprises a secondary coil for receiving visual data; an electronics package electrically coupled to said receiving coil, and a plurality of stimulating electrode electrically coupled to said electronics package.

Abstract translation: 在视觉假体中，电极刺激视网膜组织以诱导植入假体的使用者对光的感知。 假体必须具有返回或常见的电极以与视网膜组织形成完整的电路。 为了避免用返回电极刺激组织，如果电极很大，则是有利的。 本发明涉及柔性电路电极阵列，其包括聚合物基底层，沉积在所述聚合物基底层上的金属迹线，包括适于刺激沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层的神经组织的电极和分离的回流电极 从所述刺激电极。 柔性电路电极阵列包括用于接收视觉数据的次级线圈; 电耦合到所述接收线圈的电子封装，以及电耦合到所述电子封装的多个刺激电极。