中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

65 records (took 0.018 seconds)

    Digital technique for precise measurement of variable capacitance
    41.
    发明授权
    Digital technique for precise measurement of variable capacitance 失效
    用于精确测量可变电容的数字技术

    公开(公告)号：US4860232A

    公开(公告)日：1989-08-22

    申请号：US41773

    申请日：1987-04-22

    Applicant: Hae-Seung Lee ,  Roger T. Howe ,  Joseph T. Kung

    Inventor： Hae-Seung Lee ,  Roger T. Howe ,  Joseph T. Kung

    IPC: G01D5/241 ,  G01L9/12 ,  G01R17/06 ,  G01R27/26

    CPC classification number: G01D5/2415 ,  G01L9/125 ,  G01R17/06 ,  G01R27/2605

    Abstract: The present invention comprises a circuit for measuring the capacitive differences of small capacitors. The circuit comprises a reference capacitor and a sensor capacitor. Connected to one of the plates of each capacitor is a switch which connects the capacitors to one of two reference voltages. The other plate of the capacitors are connected to an input terminal of a voltage comparator. The comparator compares the input voltage with a third reference voltage. Differences in voltages detected by the comparator are applied to a feedback loop for generating an offset voltage at the input terminal. The offset voltage applied at the input terminal is proportional to the capacitive difference between the reference capacitor and the sensor capacitor. The feedback loop comprises a successive approximation register for digitizing the offset voltages and a digital to analog converter for converting the digitized voltages into analog voltages which are applied at the input terminal. Digitized offset voltages can be measured at the output of the successive approximation register.

    Abstract translation: 本发明包括用于测量小电容器的电容差的电路。 该电路包括参考电容器和传感器电容器。 连接到每个电容器的一个板的是将电容器连接到两个参考电压之一的开关。 电容器的另一个电极连接到电压比较器的输入端。 比较器将输入电压与第三参考电压进行比较。 由比较器检测的电压的差异被施加到用于在输入端产生偏移电压的反馈回路。 施加在输入端子的偏移电压与参考电容器和传感器电容器之间的电容差成正比。 反馈回路包括用于数字化偏移电压的逐次逼近寄存器和用于将数字化电压转换成在输入端施加的模拟电压的数模转换器。 可以在逐次逼近寄存器的输出端测量数字化偏移电压。

    Electro-diffusion enhanced bio-molecule charge detection using electrostatic interaction
    42.
    发明授权
    Electro-diffusion enhanced bio-molecule charge detection using electrostatic interaction 有权
    电扩散增强生物分子电荷检测使用静电相互作用

    公开(公告)号：US08864969B2

    公开(公告)日：2014-10-21

    申请号：US12822971

    申请日：2010-06-24

    Applicant: Yang Liu ,  Robert W. Dutton ,  Roger T. Howe

    Inventor： Yang Liu ,  Robert W. Dutton ,  Roger T. Howe

    IPC: G01N33/487

    CPC classification number: G01N33/48721 ,  C12Q1/68 ,  G01N27/04 ,  G01N27/4145 ,  G01N27/44791 ,  G01N33/68

    Abstract: According to one aspect, the disclosure is directed to an example embodiment in which a circuit-based arrangement includes a circuit-based substrate securing a channel, with an effective width that is not limited by the Debye screening length, along a surface of the substrate. A pair of reservoirs are included in or on the substrate and configured for containing and presenting a sample having bio-molecules for delivery in the channel. A pair of electrodes electrically couple a charge in the sample to enhance ionic current flow therein (e.g., to overcome the electrolyte screening), and a sense electrode is located along the channel for sensing a characteristic of the biological sample by using the electrostatic interaction between the enhanced ionic current flow of the sample and the sense electrode. Actual detection occurs by using a charge-signal processing circuit to process the sensed charge signal and, therefrom, provide an output indicative of a signature for the bio-molecules delivered in the channel.

    Abstract translation: 根据一个方面，本发明涉及一个示例性实施例，其中基于电路的布置包括沿着基板的表面固定通道的电路基板，具有不受德拜屏蔽长度限制的有效宽度 。 一对储存器包含在基底中或基底上，并且被配置为容纳和呈现具有用于在通道中递送的生物分子的样品。 一对电极将样品中的电荷电耦合以增强其中的离子电流（例如，以克服电解质屏蔽），并且感测电极沿着通道定位，以通过使用 样品和感测电极的增强的离子电流流动。 通过使用电荷信号处理电路来处理所感测的电荷信号，从而提供指示在通道中递送的生物分子的签名的输出，发生实际检测。

    MEMS coupler and method to form the same
    43.
    发明授权
    MEMS coupler and method to form the same 有权
    MEMS耦合器和方法形成相同

    公开(公告)号：US08716815B2

    公开(公告)日：2014-05-06

    申请号：US12927312

    申请日：2010-11-10

    Applicant: Emmanuel P. Quevy ,  Roger T. Howe

    Inventor： Emmanuel P. Quevy ,  Roger T. Howe

    IPC: H01L27/14

    CPC classification number: B81C1/00039 ,  B81B2201/0271

    Abstract: A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.

    Abstract translation: 描述了MEMS耦合器和形成具有这种耦合器的MEMS结构的方法。 在一个实施例中，MEMS结构包括构件和衬底。 耦合器延伸穿过构件的一部分并将构件与衬底连接。 该构件由第一材料构成，并且该耦合器由第二材料构成。 在一个实施例中，第一和第二材料基本相同。 在一个实施例中，第二材料是导电的并且不同于第一材料。 在另一个实施例中，一种用于制造MEMS结构的方法包括首先在衬底上形成构件。 然后形成由导电材料构成的耦合器，以将该构件与衬底连接。

    Method of making a sub-ground plane for a micromachined device
    46.
    发明授权
    Method of making a sub-ground plane for a micromachined device 失效
    制造微加工装置的亚接地平面的方法

    公开(公告)号：US5879963A

    公开(公告)日：1999-03-09

    申请号：US820248

    申请日：1997-03-18

    Applicant: Roger T. Howe ,  Richard S. Payne ,  Stephen F. Bart

    Inventor： Roger T. Howe ,  Richard S. Payne ,  Stephen F. Bart

    IPC: B81B7/00 ,  G01P15/08 ,  H05K3/34

    CPC classification number: B81B7/0006 ,  G01P15/0802 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

    Abstract: A method and apparatus for providing a sub-ground plane for a micromachined device. The sub-ground plane is formed in or on the substrate. Above the sub-ground plane is a dielectric and then a discontinuous conductive layer used for interconnects for parts of the micromachined device. A movable microstructure is suspended above the interconnect layer. A conductive layer can be suspended above the movable microstructure. In one embodiment, the sub-ground plane is diffused into the substrate or a well in the substrate, and is of an opposite type from the type of silicon into which it is diffused. Alternatively, the sub-ground plane is formed from a conductive layer, deposited over the substrate before the layer used for interconnects.

    Abstract translation: 一种用于提供微加工装置的子接地平面的方法和装置。 子接地平面形成在基底中或基底上。 在子接地平面之上是电介质，然后是用于微加工装置的部件的互连的不连续导电层。 可移动微结构悬浮在互连层上方。 导电层可以悬浮在可移动微结构的上方。 在一个实施例中，子接地平面扩散到衬底或衬底中的阱中，并且与其被扩散的硅的类型相反。 或者，子接地平面由导电层形成，在用于互连的层之前沉积在衬底上。

    Conductive plane beneath suspended microstructure
    47.
    发明授权
    Conductive plane beneath suspended microstructure 失效
    悬浮微结构下面的导电平面

    公开(公告)号：US5640039A

    公开(公告)日：1997-06-17

    申请号：US347702

    申请日：1994-12-01

    Applicant: Kevin Hin-Leung Chau ,  Roger T. Howe ,  Richard S. Payne ,  Yang Zhao ,  Theresa A. Core ,  Steven J. Sherman

    Inventor： Kevin Hin-Leung Chau ,  Roger T. Howe ,  Richard S. Payne ,  Yang Zhao ,  Theresa A. Core ,  Steven J. Sherman

    IPC: G01P15/08 ,  G01P15/125 ,  H01L29/82

    CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P2015/0814

    Abstract: A method and apparatus for providing a conductive plane beneath a suspended microstructure. A conductive region is diffused into a substrate. A dielectric layer is added, covering the substrate, and then removed from a portion of the conductive region. A spacer layer is deposited over the dielectric and exposed conductive region. A polysilicon layer is deposited over the spacer layer, and formed into the shape of the suspended microstructure. After removal of the spacer layer, the suspended microstructure is left free to move above an exposed conductive plane. The conductive plane is driven to the same potential as the microstructure.

    Abstract translation: 一种用于在悬浮微结构下方提供导电平面的方法和装置。 导电区域扩散到衬底中。 添加介电层，覆盖基板，然后从导电区域的一部分去除。 间隔层沉积在电介质和暴露的导电区域上。 多晶硅层沉积在间隔层上，并形成悬浮微结构的形状。 在去除间隔层之后，使悬浮的微结构自由地在暴露的导电平面上移动。 导电平面被驱动到与微结构相同的电位。

    Microelectromechanical signal processors
    49.
    发明授权
    Microelectromechanical signal processors 失效
    微机电信号处理器

    公开(公告)号：US5455547A

    公开(公告)日：1995-10-03

    申请号：US332981

    申请日：1994-10-31

    Applicant: Liwei Lin ,  Clark T.-C. Nguyen ,  Roger T. Howe ,  Albert P. Pisano

    Inventor： Liwei Lin ,  Clark T.-C. Nguyen ,  Roger T. Howe ,  Albert P. Pisano

    IPC: H03H9/46 ,  H03H9/00

    CPC classification number: H03H9/02275 ,  H03H9/02377 ,  H03H9/46 ,  H03H9/462

    Abstract: A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.

    Abstract translation: 具有平面部件的微机械滤波器，并且可使用非常大规模的集成电路微加工技术制造。 输入和输出换能器是叉指梳状电极。 输入和输出换能器之间的机械耦合包括平面弯曲，电极的位移产生弯曲元件的弯曲。 通过在真空中密封微机械滤波器并提供板上电路，可以实现高信噪比和质量因素。 构建使用许多微机械谐振器的实时频谱分析仪，为设备提供高精度和短的采样时间。

Patent Agency Ranking