公开(公告)号：US20060038649A1

公开(公告)日：2006-02-23

申请号：US10922064

申请日：2004-08-19

Applicant: Vivek Mehrotra ,  Jian Sun

Inventor： Vivek Mehrotra ,  Jian Sun

IPC: H01F27/02

CPC classification number: H01F27/2804 ,  H01F27/34 ,  H01F2027/2819 ,  H02M3/28

Abstract: Cutout and/or keep away regions are etched in the winding structure near the gapped center leg of a magnetic core. This reduces eddy current losses caused by the leakage field and improves current uniformity and current sharing between windings thereby increasing converter efficiency. Windings closest to the air gap are suitably formed with both keep away regions and cutouts. Windings a little further away are formed with only cutouts and the windings furthest away are unchanged. This approach keeps the net winding losses low in the presence of a fringing field. The precise configuration is determined by the core structure, air gap and winding arrangements.

Abstract translation: 在磁芯的有间隙的中心腿附近的绕组结构中蚀刻切割区域和/或远离区域。 这减少了由漏电场引起的涡流损耗，并提高了绕组之间的电流均匀性和电流共享，从而提高了转换器的效率。 最靠近气隙的绕组适当地形成有两个保持区域和切口。 只有切口形成更远的绕组，最远的绕组不变。 这种方法在存在边缘场的情况下保持了净绕组损耗低。 精确的配置由核心结构，气隙和绕组布置决定。

公开(公告)号：US20060038549A1

公开(公告)日：2006-02-23

申请号：US10922062

申请日：2004-08-19

Applicant: Vivek Mehrotra ,  Jian Sun ,  Sriram Chandrasekaran

Inventor： Vivek Mehrotra ,  Jian Sun ,  Sriram Chandrasekaran

IPC: G05F3/06

CPC classification number: H02M7/003 ,  H01F27/2804 ,  H01F2038/006 ,  H05K1/144

Abstract: A vertically packaged cellular power converter solves the problems associated with conventional designs and paves the way for a cellular circuit architecture with ultra-low interconnect resistance and inductance. The vertical packaging results in a power flow in the vertical direction (from the bottom to the top) with very short internal interconnects, thereby minimizing the associated conduction losses and permitting high conversion efficiency at high currents. The cellular architecture is ideally suited for generating multiple supply voltages.

Abstract translation: 垂直封装的蜂窝功率转换器解决了与常规设计相关的问题，为具有超低互连电阻和电感的蜂窝电路架构铺平了道路。 垂直封装导致垂直方向（从底部到顶部）的功率流具有非常短的内部互连，从而最小化相关联的传导损耗并且在高电流下允许高的转换效率。 蜂窝结构非常适合产生多个电源电压。

公开(公告)号：US20050024179A1

公开(公告)日：2005-02-03

申请号：US10922067

申请日：2004-08-19

Applicant: Sriram Chandrasekaran ,  Vivek Mehrotra

Inventor： Sriram Chandrasekaran ,  Vivek Mehrotra

IPC: H01F3/08 ,  H01F17/04 ,  H01F30/06 ,  H02M7/04 ,  H01F17/06

CPC classification number: H01F27/24 ,  H01F3/08 ,  H01F17/04 ,  H01F27/255 ,  H01F30/06 ,  H01F2038/006 ,  H02M7/043 ,  Y10T29/4902

Abstract: A matrix integrated magnetics (MIM) “Extended E” core in which a plurality of outer legs are disposed on a base and separated along a first outer edge to define windows there between. A center leg is disposed on the top region of the base and separated from the outer legs to define a center window. The center leg is suitably positioned along a second outer edge opposite the first or between outer legs positioned along opposing outer edges. A plate is disposed on the outer legs opposite the base.

Abstract translation: 矩阵集成磁体（MIM）“扩展E”核心，其中多个外部腿部设置在基部上并沿着第一外部边缘分离以在其间限定窗口。 中心腿设置在基部的顶部区域上并与外腿分离以限定中心窗口。 中心腿沿着沿着相对的外边缘定位的第一外侧或第二外腿的第二外边缘适当地定位。 在与底座相对的外腿上设置板。

公开(公告)号：US6118651A

公开(公告)日：2000-09-12

申请号：US998047

申请日：1997-12-24

Applicant: Vivek Mehrotra ,  Jose Azevedo ,  Shri Sridhar

Inventor： Vivek Mehrotra ,  Jose Azevedo ,  Shri Sridhar

IPC: H01G9/28 ,  H01G9/00 ,  H01G9/008 ,  H01G9/048 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H01G9/035 ,  H01G9/08

CPC classification number: H05K1/18 ,  H01G9/00 ,  H05K1/16 ,  H05K1/0201 ,  H05K1/162 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10446

Abstract: Anodized aluminum anode and cathode foils are interleaved in a stack separated by spacers saturated with electrolyte in an enclosure. The anode foils and cathode foils have tabs which protrude from the housing and are cold welded to leads outside the housing, where they are not exposed to electrolyte. This permits using copper leads, which can be soldered to traces on a printed circuit board. A flat capacitor can be fixed underneath a PCB or even used as the substrate for a circuit, resulting in high volume efficiencies and the possibility of using it as a heat sink for other components.

Abstract translation: 阳极氧化的铝阳极和阴极箔在叠层中交错，由隔离物中的电解质饱和的间隔隔开。 阳极箔和阴极箔具有从壳体突出并且被冷焊接以引导到壳体外部的突片，在那里它们不暴露于电解质。 这允许使用铜引线，其可以焊接到印刷电路板上的迹线。 扁平电容器可以固定在PCB下面，甚至可以用作电路的基板，从而产生高体积效率，也可以将其用作其它部件的散热片。

公开(公告)号：US08313797B2

公开(公告)日：2012-11-20

申请号：US12424465

申请日：2009-04-15

Applicant: Julia J. Mack ,  Brian N. Cox ,  Vivek Mehrotra ,  Ten-Luen T. Liao ,  Rahul Ganguli

Inventor： Julia J. Mack ,  Brian N. Cox ,  Vivek Mehrotra ,  Ten-Luen T. Liao ,  Rahul Ganguli

IPC: H01F1/04

CPC classification number: H01F1/0063 ,  B22F1/0018 ,  B22F7/04 ,  B22F9/24 ,  B22F2998/00 ,  B82Y25/00 ,  B82Y30/00 ,  C23C18/08 ,  C23C26/02 ,  B22F2301/15 ,  B22F2301/35 ,  B22F2301/10 ,  B22F2301/205

Abstract: Provided is a method for in-situ coating a substrate or matrix with magnetic metal nanoparticles. A metal salt, which may be organic or inorganic, is introduced into a solution of liquid polyol. In the presence of mechanical stirring and heat, a reduction process occurs wherein the magnetic metal nanoparticles precipitate out of solution and deposit or attach to one or more surfaces of the substrate. The concentration of reaction precursors, combined with the polyol, may be varied to control the size and shape of the magnetic nanoparticles.

Abstract translation: 提供了一种用磁性金属纳米颗粒原位涂覆基底或基质的方法。 可以将有机或无机金属盐引入液体多元醇溶液中。 在存在机械搅拌和加热的情况下，发生还原过程，其中磁性金属纳米颗粒从溶液中沉淀并沉积或附着到基底的一个或多个表面。 可以改变与多元醇结合的反应前体的浓度以控制磁性纳米颗粒的尺寸和形状。

公开(公告)号：US08209409B2

公开(公告)日：2012-06-26

申请号：US12099685

申请日：2008-04-08

Applicant: Satish Kumar Mopur ,  Unnikrishnan Ponnan Katangot ,  Sathya Prakash Dhanabal ,  Mukesh Gupta ,  Vivek Mehrotra ,  Karthigeyan Kasthurirengan

Inventor： Satish Kumar Mopur ,  Unnikrishnan Ponnan Katangot ,  Sathya Prakash Dhanabal ,  Mukesh Gupta ,  Vivek Mehrotra ,  Karthigeyan Kasthurirengan

IPC: G06F15/173

CPC classification number: H04L67/1097 ,  G06F11/008 ,  G06F11/0727 ,  G06F11/0781 ,  G06F11/2007 ,  G06F11/2094 ,  H04L69/40

Abstract: A method of determining a state of a Storage Area Network SAN is provided comprising analyzing data collected from components in the SAN, calculating a redundancy level of the SAN based on the analyzed data, and determining the state of the SAN based on the calculated redundancy level. The redundancy levels indicate the sensitivity of the SAN to a fault in one of the components. The method also includes receiving user policy settings allowing automatic correction of the SAN and auto-correcting the SAN in response to a change in the SAN state and in dependence on the user policy settings. The redundancy levels can be used by an administrator to set the user policy settings. An apparatus for carrying out the method is also provided.

Abstract translation: 提供了一种确定存储区域网络SAN的状态的方法，包括分析从SAN中的组件收集的数据，基于分析的数据计算SAN的冗余级别，以及基于所计算的冗余级别来确定SAN的状态 。 冗余级别表示SAN中某个组件中故障的灵敏度。 该方法还包括接收用户策略设置，允许对SAN进行自动校正，并根据SAN状态的变化以及根据用户策略设置自动更正SAN。 管理员可以使用冗余级别来设置用户策略设置。 还提供了一种用于执行该方法的装置。

公开(公告)号：US20120076974A1

公开(公告)日：2012-03-29

申请号：US12894043

申请日：2010-09-29

Applicant: Dennis Strauss ,  Vivek Mehrotra

Inventor： Dennis Strauss ,  Vivek Mehrotra

IPC: B32B3/10 ,  B05C5/00 ,  B05D3/06 ,  B82Y99/00

CPC classification number: C01B31/0226 ,  B05C9/02 ,  B82B3/0014 ,  B82B3/0066 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B32/172 ,  C01B32/174 ,  C01B2202/36 ,  Y10T428/24132 ,  Y10T428/24802

Abstract: A method and device for producing an aligned carbon nanotube array. The arrays of aligned carbon nanotubes (CNTs) may be formed by drying liquid dispersions of CNTs on a nanoporous substrate under an applied electrostatic field. The array may be used in a number of applications including electronics, optics, and filtration, including desalination.

Abstract translation: 一种用于制备取向碳纳米管阵列的方法和装置。 对准的碳纳米管（CNT）的阵列可以通过在所施加的静电场下干燥纳米多孔衬底上的CNT的液体分散体来形成。 该阵列可用于许多应用，包括电子，光学和过滤，包括脱盐。

公开(公告)号：US20100293316A1

公开(公告)日：2010-11-18

申请号：US12466395

申请日：2009-05-15

Applicant: Vivek MEHROTRA ,  Satish Kumar Mopur ,  Saikat Mukherjee ,  Satyaprakash Rao ,  Gunalan Perumal Vijayan ,  Sridhar Balachandriah

Inventor： Vivek MEHROTRA ,  Satish Kumar Mopur ,  Saikat Mukherjee ,  Satyaprakash Rao ,  Gunalan Perumal Vijayan ,  Sridhar Balachandriah

IPC: G06F13/00 ,  G06F12/00

CPC classification number: H04L41/0813 ,  H04L41/147 ,  H04L67/1097

Abstract: A method, system and computer program product for migrating at least one switch in a storage area network is disclosed. The migration is done by analysing the I/O traffic to identify patterns in the I/O traffic of the switch; forecasting future I/O workload of the switch based on one or more identified patterns in the I/O traffic, determining appropriate timing for migration based on the identified patterns and administrator inputs; processing the storage area network configuration data to identify the storage network physical and logical access paths to the or each selected switch to create a first connectivity map; generating a second connectivity map based on the first connectivity map and administrator inputs; and migrating the or each switch migration based on the second connectivity map and the appropriate timing. The migration may comprise routing the I/O traffic from the switch to be migrated to the alternate switches in the storage area network. The migration may further comprising transforming zones on the switch to be migrated and deploying the transformed zones to the new switch

Abstract translation: 公开了用于迁移存储区域网络中的至少一个交换机的方法，系统和计算机程序产品。 通过分析I / O流量来识别交换机的I / O流量中的模式来完成迁移; 基于I / O流量中的一个或多个识别的模式预测交换机的未来I / O工作负载，基于所识别的模式和管理员输入确定适当的迁移时序; 处理存储区域网络配置数据以识别存储网络物理和逻辑访问路径到或每个所选择的交换机以创建第一连接图; 基于所述第一连接图和管理员输入生成第二连接图; 以及基于第二连接图和适当的定时迁移或每个交换机迁移。 迁移可以包括将I / O流量从要迁移的交换机路由到存储区域网络中的备用交换机。 迁移可以进一步包括转换交换机上要迁移的区域并将转换的区域部署到新交换机

公开(公告)号：US20100107013A1

公开(公告)日：2010-04-29

申请号：US12332358

申请日：2008-12-11

Applicant: Satish Kumar MOPUR ,  Karthigeyan KASTHURIRENGAN ,  Vivek MEHROTRA ,  Vijay KUMAR ,  Mukesh GUPTA

Inventor： Satish Kumar MOPUR ,  Karthigeyan KASTHURIRENGAN ,  Vivek MEHROTRA ,  Vijay KUMAR ,  Mukesh GUPTA

IPC: G06F11/28

CPC classification number: G06F11/3433 ,  G06F3/0613 ,  G06F3/0635 ,  G06F3/067 ,  G06F11/3409 ,  G06F11/3438 ,  G06F11/3485 ,  G06F11/349 ,  H04L41/147 ,  H04L43/024 ,  H04L43/16 ,  H04L67/1097

Abstract: A system and method of input/output (I/O) workload analysis of the components in a storage area network (SAN) is disclosed. In one embodiment, a method for analyzing I/O workloads of components in the SAN includes determining host bus adapter (HBA) to storage port oversubscription ratios and HBA to inter-switch link (ISL) oversubscription ratios in the SAN, selecting a subset of the components for monitoring based on the HBA to storage port oversubscription ratios and the HBA to ISL oversubscription ratios, continuously monitoring the subset of the components and storing I/O statistics of the subset of the components, and forecasting expected I/O workloads of the subset of the components based on current I/O workloads associated with the I/O statistics of the subset of the components and respective I/O workload threshold values of the subset of the components.

Abstract translation: 公开了一种存储区域网络（SAN）中组件的输入/输出（I / O）工作负载分析的系统和方法。 在一个实施例中，用于分析SAN中组件的I / O工作负载的方法包括：确定主机总线适配器（HBA）到存储端口超额订阅率和HBA到SAN中的交换机间链路（ISL）超额预订比率， 基于HBA到存储端口超额订阅率的HBA到ISL超额订阅比例的监控组件，连续监视组件的子集并存储组件子集的I / O统计信息，并预测组件的预期I / O工作负载 基于与组件子集的I / O统计信息相关联的当前I / O工作负载的组件的子集以及组件子集的相应I / O工作负载阈值。

公开(公告)号：US07659614B2

公开(公告)日：2010-02-09

申请号：US12116916

申请日：2008-05-07

Applicant: Vivek Mehrotra

Inventor： Vivek Mehrotra

IPC: H01L23/12

CPC classification number: H05K3/3463 ,  H01L23/3735 ,  H01L23/4924 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48739 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83455 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00012

Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.

Abstract translation: 一种形成包含SiC或其他半导体器件的封装的方法，其利用瞬态液相（TLP）接合结合到其它部件或导电表面，以使用导电金属的原位形成的三元或四元混合物和使用TLP产生的器件产生高温熔点键 三元或四元材料的键。 组合物满足互连或接头的相互冲突的要求，其可以暴露于高温下，并且在导热，导电，空隙和抗蠕变性，耐腐蚀性以及在温度和功率循环方面是可靠的。