公开(公告)号：US08413907B2

公开(公告)日：2013-04-09

申请号：US13468058

申请日：2012-05-10

Applicant: Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

Inventor： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC: G06K19/06

CPC classification number: H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Abstract translation: 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US08326223B2

公开(公告)日：2012-12-04

申请号：US12714607

申请日：2010-03-01

Applicant: Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

Inventor： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC: H04B5/00 ,  H04B1/16

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Abstract translation: 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US20120006904A1

公开(公告)日：2012-01-12

申请号：US13241823

申请日：2011-09-23

Applicant: Noboru KATO ,  Yuya DOKAI

Inventor： Noboru KATO ,  Yuya DOKAI

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07749 ,  G06K19/07756 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q9/285

Abstract: A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.

Abstract translation: 无线IC器件包括无线IC芯片，耦合电极和辐射板。 耦合电极包括被布置成耦合到无线IC芯片的耦合部分和一对相对的端部。 一对相对的端部彼此电容耦合并且与待耦合到辐射板的辐射板相对。 无线IC芯片使用辐射板作为天线来发射和接收具有一定频率的信号到RFID系统。

公开(公告)号：US20110127337A1

公开(公告)日：2011-06-02

申请号：US13022695

申请日：2011-02-08

Applicant: Nobuo IKEMOTO ,  Satoshi ISHINO ,  Yuya DOKAI ,  Noboru KATO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Mikiko TANAKA

Inventor： Nobuo IKEMOTO ,  Satoshi ISHINO ,  Yuya DOKAI ,  Noboru KATO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Mikiko TANAKA

IPC: G06K19/077

CPC classification number: H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Abstract translation: 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US20110074584A1

公开(公告)日：2011-03-31

申请号：US12959454

申请日：2010-12-03

Applicant: Takeshi KATAYA ,  Noboru KATO ,  Satoshi ISHINO ,  Nobuo IKEMOTO ,  Ikuhel KIMURA ,  Yuya DOKAI

Inventor： Takeshi KATAYA ,  Noboru KATO ,  Satoshi ISHINO ,  Nobuo IKEMOTO ,  Ikuhel KIMURA ,  Yuya DOKAI

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H04Q2213/13095 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/10098

Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

Abstract translation: 射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极 电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。 电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。 包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。

公开(公告)号：US20100103058A1

公开(公告)日：2010-04-29

申请号：US12688072

申请日：2010-01-15

Applicant: Noboru KATO ,  Satoshi ISHINO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Nobuo IKEMOTO ,  Yuya DOKAI

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Nobuo IKEMOTO ,  Yuya DOKAI

IPC: H01Q1/24

CPC classification number: G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

Abstract translation: 无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。 馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。 屏蔽壳或接线电缆用作辐射板。 无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。 金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

公开(公告)号：US20100038437A1

公开(公告)日：2010-02-18

申请号：US12603608

申请日：2009-10-22

Applicant: Noboru KATO ,  Yuya DOKAI

Inventor： Noboru KATO ,  Yuya DOKAI

IPC: G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00

Abstract: A wireless IC device has a structure such that the size of a radiation plate and a radiation characteristic may be determined irrespective of an impedance of a wireless IC chip. The wireless IC device includes a wireless IC chip that is arranged to process transmission and reception signals, a spiral matching inductance element and a plane electrode that are located on a surface of a feeder circuit substrate, and a coil-shaped radiation plate located on a radiation substrate. Plane electrodes connected to both ends of the radiation plate are electromagnetically coupled respectively to the inductance element and the plane electrode. The wireless IC chip is operated by a signal received by the radiation plate, and a response signal from the wireless IC chip is radiated outside from the radiation plate.

Abstract translation: 无线IC器件具有能够确定辐射板的尺寸和辐射特性而不考虑无线IC芯片的阻抗的结构。 无线IC器件包括布置成处理发送和接收信号的无线IC芯片，位于馈电电路基板的表面上的螺旋匹配电感元件和平面电极以及位于馈电电路基板的表面上的线圈形辐射板 辐射基板。 连接到辐射板两端的平面电极分别电磁耦合到电感元件和平面电极。 无线IC芯片由辐射板接收的信号操作，并且来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US20090277966A1

公开(公告)日：2009-11-12

申请号：US12510340

申请日：2009-07-28

Applicant: Noboru Kato ,  Yuya Dokai

Inventor： Noboru Kato ,  Yuya Dokai

IPC: G06K19/06

CPC classification number: H01Q7/00 ,  G06K19/0723 ,  G06K19/07749 ,  H01Q1/2208

Abstract: A wireless IC device includes a wireless IC chip arranged to process a transmission/received signal, a matching inductance element and a planar electrode which are provided on the surface of a feeder circuit board formed by a flexible dielectric, and a loop-shaped radiation plate provided on the undersurface of the feeder circuit board. Both ends of the radiation plate are coupled to a resonance circuit including an inductance element by electromagnetic field coupling. The wireless IC chip is operated using a signal received by the radiation plate. A response signal transmitted from the wireless IC chip is externally transmitted from the radiation plate.

Abstract translation: 无线IC器件包括布置成处理发送/接收信号的无线IC芯片，设置在由柔性电介质形成的馈电电路板的表面上的匹配电感元件和平面电极，以及环形辐射板 提供在馈电电路板的下表面上。 辐射板的两端通过电磁场耦合耦合到包括电感元件的谐振电路。 使用由辐射板接收的信号来操作无线IC芯片。 从无线IC芯片发送的响应信号从辐射板外部传输。

公开(公告)号：US20090262041A1

公开(公告)日：2009-10-22

申请号：US12496709

申请日：2009-07-02

Applicant: Nobuo Ikemoto ,  Yuya Dokai ,  Noboru Kato

Inventor： Nobuo Ikemoto ,  Yuya Dokai ,  Noboru Kato

IPC: H01Q1/50

CPC classification number: G06K19/0723 ,  G06K19/073 ,  G06K19/07749 ,  G06K19/07756 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/20 ,  H04B5/0012

Abstract: An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

Abstract translation: 电磁耦合模块包括无线IC芯片和功能基板。 电磁耦合模块例如安装在辐射板上，优选使用粘合剂。 在辐射板的基材的上表面上设置两个长的辐射电极。 在功能基板的下表面上，设置分别面对辐射电极内端的电容耦合电极。 布置成执行无线IC芯片和每个辐射电极之间的阻抗匹配的匹配电路包括电容耦合电极。 结果，可以减小无线IC器件的尺寸，便于设计和降低成本。

公开(公告)号：USD589828S1

公开(公告)日：2009-04-07

申请号：US29282221

申请日：2007-07-13

Applicant: Yuya Dokai ,  Mikiko Kimura

Designer： Yuya Dokai ,  Mikiko Kimura