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    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    42.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号：US20140061697A1

    公开(公告)日：2014-03-06

    申请号：US13912211

    申请日：2013-06-07

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    IPC: H01L33/60 ,  H01L33/62

    CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00

    Abstract: An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided.

    Abstract translation: LED封装包括相邻的第一和第二电极，从第一和第二电极向侧面突出的第一和第二延伸电极，围绕第一和第二电极的模制体和LED管芯。 成型体形成位于第一和第二电极上方的反射杯，每个反射杯在其顶面限定一个接收腔，以容纳LED管芯。 第一和第二延伸电极从成形体的外周露出。 第一电极具有第一底面。 第二电极具有第二底面。 第一和第二电极的第一和第二底面从成形体的底面露出。 还提供了用于制造LED封装的方法。

    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE
    43.
    发明申请
    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE 审中-公开
    制造发光二极管的方法

    公开(公告)号：US20130288409A1

    公开(公告)日：2013-10-31

    申请号：US13726193

    申请日：2012-12-23

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.

    Inventor： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

    IPC: H01L33/44

    CPC classification number: H01L33/44 ,  H01L33/0095 ,  H01L33/20 ,  H01L2933/0041

    Abstract: An exemplary method for manufacturing an LED includes steps: providing a substrate with a first electrode and a second electrode; providing an isosceles trapezoidal LED chip and making the LED chip electrically connecting the first electrode and the second electrode; providing a mold with a cavity and setting the mold on the substrate to make the LED chip received in the cavity, an outer periphery of the LED chip spaced from confronting edges of the mold defining the cavity to define a channel therebetween, and a width of the channel being uniform; providing phosphor glue and filling the phosphor glue in the channel to make the phosphor glue enclose the LED chip therein; solidifying the phosphor glue to form a phosphor layer covering the LED chip and removing the mold.

    Abstract translation: 用于制造LED的示例性方法包括以下步骤：向基板提供第一电极和第二电极; 提供等腰梯形LED芯片，并使LED芯片电连接第一电极和第二电极; 提供具有空腔的模具并将模具设置在基板上以使LED芯片容纳在空腔中，LED芯片的外围与模具的相对边缘间隔开，以限定空腔以在其间限定通道，宽度 渠道统一; 提供荧光胶，并在通道中填充磷光胶，使磷光体胶在其中包围LED芯片; 固化磷光胶，形成覆盖LED芯片的荧光体层，并去除模具。

    SURFACE-MOUNTING LED CHIP
    44.
    发明申请
    SURFACE-MOUNTING LED CHIP 审中-公开
    表面安装LED芯片

    公开(公告)号：US20130264603A1

    公开(公告)日：2013-10-10

    申请号：US13723210

    申请日：2012-12-21

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

    IPC: H01L33/36

    CPC classification number: H01L33/36 ,  H01L33/385 ,  H01L33/44

    Abstract: An LED (light emitting diode) chip includes a semiconductor. The semiconductor includes a main emitting surface on a top surface and a mounting surface on a bottom surface thereof. The LED chip further includes a P-type electrode and an N-type electrode protruding from the semiconductor, a first electrode layer extending from the P-type electrode to the mounting surface, a second electrode layer extending from the N-type electrode to the mounting surface and an insulating layer insulating the first electrode layer and the second electrode from the semiconductor. The first and second electrode layers are for surface mounting to a substrate. Each of the P-type and N-type electrodes includes a plurality of interdigital structures.

    Abstract translation: LED（发光二极管）芯片包括半导体。 半导体包括顶表面上的主发射表面和其底表面上的安装表面。 LED芯片还包括从半导体突出的P型电极和N型电极，从P型电极延伸到安装表面的第一电极层，从N型电极延伸到第二电极层 安装表面和绝缘层，使第一电极层和第二电极与半导体绝缘。 第一和第二电极层用于表面安装到基底。 P型和N型电极中的每一个包括多个叉指结构。

    LED PACKAGE WITH REFLECTING CUP
    46.
    发明申请
    LED PACKAGE WITH REFLECTING CUP 有权
    LED包装与反光杯

    公开(公告)号：US20160118557A1

    公开(公告)日：2016-04-28

    申请号：US14826446

    申请日：2015-08-14

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

    IPC: H01L33/60 ,  H01L33/54 ,  H01L33/48 ,  H01L33/38

    CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257

    Abstract: The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes.

    Abstract translation: 本公开提供一种LED封装，其包括电极，与所述电极电连接的LED管芯，覆盖所述LED管芯的封装; 以及围绕封装和LED管芯的外壳。 壳体包括基座，反射杯和支撑部分。 反射杯从底座向上延伸，反射杯围绕LED模具，支撑部分位于反射杯内部并穿过电极。

    LIGHT EMITTING DIODE PACKAGE
    49.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20150069441A1

    公开(公告)日：2015-03-12

    申请号：US14476147

    申请日：2014-09-03

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HOU-TE LIN ,  FU-HSIANG YEH ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

    IPC: H01L33/38 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

    Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.

    Abstract translation: 发光二极管（LED）封装包括：衬底，第一电极和安装在衬底的相对侧上的第二电极，安装在一个电极的顶表面上的LED芯片，并电连接第一电极和第二电极 以及包围第一电极和第二电极的外周的反射杯，以暴露第一电极和第二电极的顶表面以及第一电极和第二电极的第二电极和底表面。

    LENS AND LIGHT EMITTING ELEMENT USING THE SAME
    50.
    发明申请
    LENS AND LIGHT EMITTING ELEMENT USING THE SAME 审中-公开
    使用相同的镜头和发光元件

    公开(公告)号：US20150009680A1

    公开(公告)日：2015-01-08

    申请号：US14321765

    申请日：2014-07-01

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    IPC: F21K99/00 ,  F21V7/04 ,  F21V5/04

    CPC classification number: F21V5/04 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061

    Abstract: An exemplary lens includes a bottom surface, a first light exit surface extending upwardly from an outer periphery of the bottom surface, a second light exit surface extending upwardly from a top of the first light exit surface, and a reflecting surface extending inwardly and downwardly from a top of the second light exit surface towards the bottom surface to have a funnel-shaped configuration. A receiving space is defined in the bottom surface to receive a light source therein. The receiving space is defined by a top surface and a side surface interconnecting the top surface and the bottom surface. A pyramid surface is in the middle of the top surface and recessed upwardly and inwardly away from the bottom surface.

    Abstract translation: 示例性透镜包括底表面，从底表面的外周向上延伸的第一光出射表面，从第一光出射表面的顶部向上延伸的第二光出射表面和从第一光出射表面的顶部向上延伸的反射表面 第二光出射表面的顶部朝向底表面以具有漏斗形构造。 接收空间被限定在底表面中以在其中接收光源。 接收空间由互连顶表面和底表面的顶表面和侧表面限定。 金字塔表面位于顶表面的中间，并且从底表面向上和向内凹陷。

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