Thermal module assembling structure

    公开(公告)号:US10190830B2

    公开(公告)日:2019-01-29

    申请号:US15060607

    申请日:2016-03-04

    Abstract: A thermal module assembling structure includes a base seat and a heat pipe. The base seat is formed with a channel and at least one hole recessed and formed on one side of the base seat in adjacency to the channel. The channel has at least one protrusion section corresponding to the hole. One end of the heat pipe is received in the channel. The heat pipe has at least one insertion recess. The protrusion section is tightly fitted and inserted in the corresponding insertion recess of the heat pipe.

    Latch device for heat dissipation component
    43.
    发明授权
    Latch device for heat dissipation component 有权
    用于散热部件的锁定装置

    公开(公告)号:US09572244B1

    公开(公告)日:2017-02-14

    申请号:US14882390

    申请日:2015-10-13

    Inventor: Sheng-Huang Lin

    Abstract: A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.

    Abstract translation: 用于散热部件的闩锁装置包括主体,第一和第二弹性部件,第一和第二旋转单元。 主体的两侧分别形成有第一和第二穿孔。 第一和第二弹性构件固定地设置在主板的一个面上。 第一和第二钩/闩锁部分分别从对应于第一和第二穿孔的第一和第二弹性部件伸出。 通过第一和第二钩/闩构件,第一和第二旋转单元相应地与第一和第二钩/闩锁部分钩挂/锁定。 然后,第一和第二旋转单元被旋转以向上拉第一和第二钩/闩构件; 此外,第一和第二钩/闩锁部分可以固定主体。 因此,用户可以在不使用任何手动工具的情况下组装/拆卸主体。

    THERMAL MODULE ASSEMBLING STRUCTURE
    44.
    发明申请
    THERMAL MODULE ASSEMBLING STRUCTURE 审中-公开
    热模块组装结构

    公开(公告)号:US20150233646A1

    公开(公告)日:2015-08-20

    申请号:US14184433

    申请日:2014-02-19

    CPC classification number: F28D15/0275 F28D15/0233

    Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

    Abstract translation: 热模块组装结构包括散热板和至少一个热管。 散热板具有用于将热管装配到其中的接收通道。 接收通道的上侧的两侧分别形成有两个肋。 肋骨水平地突出并且朝向容纳通道的中部延伸,以面对装配在接收通道中的热管。 至少一个变形的凹部形成在每个肋的上表面上,由此肋的下表面和热管的表面变形以在肋的下表面之间形成至少一个变形的连接部分, 热管表面。 通过变形连接部的限制,防止热管从接收通道中抽出。

    LED HEAT SINK AND MANUFACTURING METHOD THEREOF
    46.
    发明申请
    LED HEAT SINK AND MANUFACTURING METHOD THEREOF 审中-公开
    LED散热及其制造方法

    公开(公告)号:US20140090795A1

    公开(公告)日:2014-04-03

    申请号:US14090710

    申请日:2013-11-26

    Abstract: An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink.

    Abstract translation: 公开了一种LED散热器及其制造方法。 LED散热器包括具有热接收部分和延伸传热部分的主体。 传热部分外部设置有多个接收槽,用于与多个散热片相对应地连接。 LED散热器制造方法包括使用半熔融金属材料成型主体并冷却主体的步骤,使得冷却的主体与多个散热片连接以形成一体的单元。 利用LED散热器制造方法,可以制造具有相对复杂的散热片结构或由两种或更多种材料形成的LED散热器,并且大大减少LED热时间,人力和材料成本 水槽。

    Heat dissipation fastener structure

    公开(公告)号:US12272617B2

    公开(公告)日:2025-04-08

    申请号:US18133505

    申请日:2023-04-11

    Abstract: A heat dissipation fastener structure includes a support body, a heat sink, a cover body and an operation unit assembly. The support body comprises a window formed on an upper side and support legs extended from a lower side to together define a reciprocating space in communication with the window. The heat sink is formed with perforations at four corners and disposed in the reciprocating space. Threaded locking members, around which elastic members are fitted, are correspondingly passed through the perforations to mount the heat sink above a heat source in a floating state. The cover body is disposed on the support body and comprises at least one vertical folded edge. The operation unit assembly is disposed on the heat sink to drive the cover body to shield the threaded locking members and make the heat sink get close to or away from the heat source.

    Heat dissipation device assembly
    48.
    发明授权

    公开(公告)号:US12146714B2

    公开(公告)日:2024-11-19

    申请号:US18064290

    申请日:2022-12-12

    Abstract: A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.

    HEAT DISSIPATION DEVICE
    49.
    发明公开

    公开(公告)号:US20230243596A1

    公开(公告)日:2023-08-03

    申请号:US18064289

    申请日:2022-12-12

    CPC classification number: F28D15/0275 H05K7/20336 F28F3/048

    Abstract: A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

    THERMAL MODULE ASSEMBLING STRUCTURE
    50.
    发明公开

    公开(公告)号:US20230243595A1

    公开(公告)日:2023-08-03

    申请号:US18064287

    申请日:2022-12-12

    CPC classification number: F28D15/0275 F28F9/268 F28F21/085

    Abstract: A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.

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