公开(公告)号：US10701833B2

公开(公告)日：2020-06-30

申请号：US15712068

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  James A. Bertin ,  Eric M. Bennett ,  Simon C. Helmore ,  Melissa A. Wah ,  Matthew D. Hill ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H01M10/44 ,  H01M10/46 ,  H05K7/20 ,  G06F1/16 ,  H05K9/00 ,  H05K1/14 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.

公开(公告)号：US10386970B2

公开(公告)日：2019-08-20

申请号：US14766639

申请日：2014-02-06

Applicant: Apple Inc.

Inventor： Jonah A. Harley ,  Peter W. Richards ,  Brian Q. Huppi ,  Omar Sze Leung ,  Dhaval N. Shah ,  Martin P. Grunthaner ,  Steven P. Hotelling ,  Miguel C Christophy ,  Vivek Katiyar ,  Tang Yew Tan ,  Christopher J. Butler ,  Erik G. de Jong ,  Ming Sartee ,  Rui Qiao ,  Steven J. Martisauskas ,  Storrs T. Hoen ,  Richard Hung Minh Dinh ,  Lee E. Hooton ,  Ian A. Spraggs ,  Sawyer I. Cohen ,  David A. Pakula

IPC: G06F3/044 ,  G06F3/041

Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.

公开(公告)号：US10156874B2

公开(公告)日：2018-12-18

申请号：US15146825

申请日：2016-05-04

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Ian A. Spraggs ,  Marwan Rammah ,  Seth Reightler ,  Tyler Kakuda

IPC: G09F13/04 ,  G06F1/20 ,  G06F1/16

Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.

公开(公告)号：US20180092213A1

公开(公告)日：2018-03-29

申请号：US15710579

申请日：2017-09-20

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Meng Chi Lee ,  Derek J. Walters ,  Ian A. Spraggs ,  Flynn P. Carson ,  Shakti S. Chauhan ,  Daniel W. Jarvis ,  David A. Pakula ,  Jun Zhai ,  Michael V. Yeh ,  Alex J. Crumlin ,  Dennis R. Pyper ,  Amir Salehi ,  Vu T. Vo ,  Gregory N. Stephens

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/1316 ,  Y02P70/611

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

公开(公告)号：US20150072727A1

公开(公告)日：2015-03-12

申请号：US14278649

申请日：2014-05-15

Applicant: Apple Inc.

Inventor： Benjamin J. Pope ,  Ian A. Spraggs ,  Richard Hung Minh Dinh ,  Rasamy Phouthavong ,  Vincent Yan

IPC: H04M1/02 ,  B05D1/32 ,  B05D1/36 ,  B05D1/02 ,  B05D3/12

CPC classification number: H04M1/0264

Abstract: An electronic device has a camera assembly disposed in a housing of the electronic device that includes a light source assembly having a primary purpose for illuminating a subject during an imaging operation. The light source assembly includes a light source and a light window. A light block can be applied to lateral surfaces of the light window to prevent light passing through the light window from propagating along an outer surface of the housing, or other components of the electronic device. In some embodiments, the light block can include multiple layers having various reflective and absorptive characteristics.

Abstract translation: 电子设备具有设置在电子设备的壳体中的相机组件，其包括在成像操作期间具有用于照亮被摄体的主要目的的光源组件。 光源组件包括光源和光窗。 可以将光块施加到光窗的侧表面，以防止通过光窗的光沿着壳体的外表面或电子设备的其它部件传播。 在一些实施例中，光块可以包括具有各种反射和吸收特性的多个层。