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公开(公告)号：US20180304441A1
公开(公告)日：2018-10-25
申请号：US16017689
申请日：2018-06-25
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Mario David Silvetti , Yin Yuan , Samuel Chu-Chiang Hsu , Huanbo Zhang , Gautam Shashank Dandavate
CPC classification number: B24B41/06 , B24B37/32 , B24B41/067
Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.
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公开(公告)号：US20160045997A1
公开(公告)日：2016-02-18
申请号：US14927193
申请日：2015-10-29
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC: B24B37/32
CPC classification number: B24B37/32 , Y10T29/49815
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
Abstract translation: 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。
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公开(公告)号：US20160016282A1
公开(公告)日：2016-01-21
申请号：US14464633
申请日：2014-08-20
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen
CPC classification number: B24B37/26 , B24B37/10 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/30 , H01L21/30625 , H01L21/31051 , H01L21/32115 , H01L21/3212 , H01L21/7684
Abstract: A polishing pad includes and upper portion and one or more lower portions. The upper portion has an upper surface for attachment to a pad carrier and a first lateral dimension. The one or more lower portions project downward from the upper portion. A bottom surface of the one or more lower portions provide a contact surface to contact a substrate during chemical mechanical polishing. Each lower portion has a second lateral dimension that is less than the first lateral dimension. A total surface area of the contact surface from the one or more lower portions is no more than 10% of a surface area of the upper surface.
Abstract translation: 抛光垫包括上部和一个或多个下部。 上部具有用于附接到衬垫托架的上表面和第一横向尺寸。 一个或多个下部从上部向下突出。 所述一个或多个下部的底表面在化学机械抛光期间提供与衬底接触的接触表面。 每个下部具有小于第一横向尺寸的第二横向尺寸。 来自一个或多个下部的接触表面的总表面积不超过上表面的表面积的10％。
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Patent Agency Ranking
公开(公告)号：US09050699B2
公开(公告)日：2015-06-09
申请号：US13893030
申请日：2013-05-13
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate , Denis M. Koosau
Abstract: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
Abstract translation: 提供了一种用于化学机械抛光的方法和装置，更具体地涉及一种用于化学机械抛光的载体的方法和装置。 在一个实施例中，承载头组件包括用于向衬底提供支撑的基座组件，安装在基座组件上的柔性膜，该柔性膜具有大致圆形中心部分，下表面提供衬底安装表面，以及多个可独立加压的腔室 形成在基部组件和柔性膜之间，包括环形外室和非圆形内腔。
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公开(公告)号：US20150038065A1
公开(公告)日：2015-02-05
申请号：US14462303
申请日：2014-08-18
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon Oh , Tsz-Sin Siu , Hung Chih Chen , Andrew J. Nagengast , Steven M. Zuniga , Thomas B. Brezoczky
CPC classification number: B24B37/30 , B24B41/06 , B29C33/424 , B29C35/02 , B29K2023/00 , B29K2083/00 , B29K2995/0074 , B29L2031/755
Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
Abstract translation: 用于载体头部的柔性膜具有大致圆形的主要部分，具有下表面，用于连接到基座组件的环形外部部分和从主体部分在与下表面相对的一侧延伸的环形挡片，用于连接到 基座组件。 翼片的至少一个表面具有表面纹理以防止粘附。
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公开(公告)号：US08808062B2
公开(公告)日：2014-08-19
申请号：US13908774
申请日：2013-06-03
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon Oh , Tsz-Sin Siu , Hung Chih Chen , Andrew J. Nagengast , Steven M. Zuniga , Thomas B. Brezoczky
IPC: B24B41/06
CPC classification number: B24B37/30 , B24B41/06 , B29C33/424 , B29C35/02 , B29K2023/00 , B29K2083/00 , B29K2995/0074 , B29L2031/755
Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
Abstract translation: 用于载体头部的柔性膜具有大致圆形的主要部分，具有下表面，用于连接到基座组件的环形外部部分和从主体部分在与下表面相对的一侧延伸的环形挡片，用于连接到 基座组件。 翼片的至少一个表面具有表面纹理以防止粘附。
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公开(公告)号：US20140027407A1
公开(公告)日：2014-01-30
申请号：US13791761
申请日：2013-03-08
Applicant: Applied Materials, Inc.
Inventor： Sameer Deshpande , Zhihong Wang , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate , Hung Chih Chen , Wen-Chiang Tu
IPC: B24B37/005
CPC classification number: B24B37/005 , B24B37/30 , B24B49/105
Abstract: A chemical mechanical polishing apparatus includes a carrier head including a retaining ring having a plastic portion with a bottom surface to contact a polishing pad, an in-situ monitoring system including a sensor that generates a signal that depends on a thickness of the plastic portion, and a controller configured to receive the signal from the in-situ monitoring system and to adjust at least one polishing parameter in response to the signal to compensate for non-uniformity caused by changes in the thickness of the plastic portion of the retaining ring.
Abstract translation: 一种化学机械抛光装置，包括：承载头，包括具有接触抛光垫的底表面的塑料部分的保持环，包括产生取决于塑料部分的厚度的信号的传感器的原位监测系统， 以及控制器，被配置为从原位监测系统接收信号并且响应于信号调整至少一个抛光参数以补偿由保持环的塑料部分的厚度变化引起的不均匀性。
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公开(公告)号：US08535121B2
公开(公告)日：2013-09-17
申请号：US13768314
申请日：2013-02-15
Applicant: Applied Materials, Inc.
Inventor： Doyle E. Bennett , Andrew J. Nagengast , Hung Chih Chen
IPC: B24B7/00
Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
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