公开(公告)号：US10103046B2

公开(公告)日：2018-10-16

申请号：US15099760

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US20160284578A1

公开(公告)日：2016-09-29

申请号：US15172180

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract translation: 公开了包括具有温度控制能力的批量装载锁定装置的晶片处理系统的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了操作批量装载锁定装置的方法，以及许多其它方面。

公开(公告)号：US09378994B2

公开(公告)日：2016-06-28

申请号：US14211123

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, Jr. ,  Robert Mitchell

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。

公开(公告)号：US20140271050A1

公开(公告)日：2014-09-18

申请号：US14203237

申请日：2014-03-10

Applicant: Applied Materials, Inc.

Inventor： William Tyler Weaver ,  Malcolm N. Daniel, JR. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67742

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract translation: 晶片处理系统可以包括可以在半导体处理系统的腔室之间沿着非线性轨迹移动晶片的上部和下部连接的机器人臂。 这些特征可以导致半导体处理系统可以操作的更小的占地面积，更小的传送室，处理室中的较小的开口和更小的狭缝阀，同时保持高的晶片生产量。 在一些实施例中，可以提供两个分开的室之间的同时快速晶片交换，例如负载锁和ALD（原子层沉积）转盘。 还提供了晶片处理的方法，以及其它方面。

公开(公告)号：US12074042B2

公开(公告)日：2024-08-27

申请号：US18161968

申请日：2023-01-31

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Steve Hongkham ,  Charles T. Carlson ,  Tuan A. Nguyen ,  Swaminathan T. Srinivasan ,  Khokan Chandra Paul

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6719 ,  H01L21/67167 ,  H01L21/68707 ,  H01L21/68742

Abstract: Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.

公开(公告)号：US20240153733A1

公开(公告)日：2024-05-09

申请号：US17981188

申请日：2022-11-04

Applicant: Applied Materials, Inc.

Inventor： Michael Mason Carrell ,  Jason M. Schaller ,  Victor Flores Iracheta

IPC: H01J37/20 ,  C23C14/48 ,  C23C14/56 ,  H01J37/317 ,  H01L21/67

CPC classification number: H01J37/20 ,  C23C14/48 ,  C23C14/566 ,  H01J37/3171 ,  H01L21/67201 ,  H01J2237/201 ,  H01J2237/204

Abstract: An ion implantation system including an ion source for generating an ion beam, an end station containing a platen for supporting a substrate to be implanted by the ion beam, and a load lock disposed adjacent the end station and adapted to transfer substrates between an external environment and the end station. The load lock may include a transfer chamber having a hollow interior, a first isolation door affixed to a first side of the transfer chamber and openable to the external environment, a second isolation door affixed to a second side of the transfer chamber and openable to an interior of the end station, and a volume filling cassette disposed within the hollow interior of the transfer chamber and adapted to hold at least one substrate.

公开(公告)号：US11948817B2

公开(公告)日：2024-04-02

申请号：US17965491

申请日：2022-10-13

Applicant: Applied Materials, Inc.

Inventor： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/67196 ,  B65G47/907 ,  H01L21/68 ,  H01L21/68707 ,  H01L21/67167

Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

公开(公告)号：US11499666B2

公开(公告)日：2022-11-15

申请号：US16400090

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Michael P. Rohrer ,  Tuan Anh Nguyen

IPC: F16M11/18 ,  F16M11/12 ,  F16F1/12 ,  C23C16/44 ,  H01L21/687 ,  F16M11/04 ,  H01L21/68

Abstract: Embodiments described herein relate to a precision dynamic leveling mechanism for repeatedly positioning the pedestal within a process. The precision dynamic leveling mechanism includes bearing assemblies. Bearing assemblies having inner races forced against a pedestal assembly carrier and outer races forced against a guide adaptor provide nominal clearance between the inner races and outer races to allow the inner races and the outer races to slide on each other with minimal or no radial motion.

公开(公告)号：US20220009106A1

公开(公告)日：2022-01-13

申请号：US17473188

申请日：2021-09-13

Applicant: Applied Materials, Inc.

Inventor： Paul Z. Wirth ,  Charles T. Carlson ,  Jason M. Schaller

IPC: B25J11/00 ,  B25J9/12 ,  B25J9/00 ,  H01L21/687 ,  B25J9/04 ,  H01L21/677

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

公开(公告)号：US20210013068A1

公开(公告)日：2021-01-14

申请号：US16922536

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Charles T. Carlson ,  Luke Bonecutter ,  David Blahnik ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68 ,  H01L21/687

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.