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    PIVOTABLE SUBSTRATE RETAINING RING
    41.
    发明申请
    PIVOTABLE SUBSTRATE RETAINING RING 有权

    公开(公告)号：US20210060726A1

    公开(公告)日：2021-03-04

    申请号：US16689655

    申请日：2019-11-20

    Applicant: Applied Materials, Inc.

    Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

    IPC: B24B37/32 ,  B24B37/10

    Abstract: A carrier head includes a base assembly, a substrate mounting surface connected to the base assembly, and a plurality of segments disposed circumferentially around the substrate mounting surface to provide a retaining ring to surround a substrate mounted on the substrate mounting surface. An inner surface of each of the plurality of segments is configured to engage the substrate, and each segment of the plurality of segments of the retaining ring is pivotally connected to the base assembly such that a lower portion of each segment of the retaining ring is swingable toward and away from the substrate.

    Polishing Head with Membrane Position Control
    42.
    发明申请
    Polishing Head with Membrane Position Control 有权

    公开(公告)号：US20210053178A1

    公开(公告)日：2021-02-25

    申请号：US16706489

    申请日：2019-12-06

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Steven M. Zuniga ,  Jay Gurusamy

    IPC: B24B37/005 ,  B24B37/32

    Abstract: A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from the sensor to the membrane assembly.

    Polishing System with Platen for Substrate Edge Control
    43.
    发明申请
    Polishing System with Platen for Substrate Edge Control 审中-公开

    公开(公告)号：US20200206866A1

    公开(公告)日：2020-07-02

    申请号：US16716213

    申请日：2019-12-16

    Applicant: Applied Materials, Inc.

    Inventor： Jay Gurusamy ,  Steven M. Zuniga ,  Jeonghoon Oh

    IPC: B24B37/013 ,  B24B37/27 ,  B24B37/26 ,  B24B37/14

    Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.

    ORBITAL POLISHING WITH SMALL PAD
    46.
    发明申请
    ORBITAL POLISHING WITH SMALL PAD 审中-公开
    ORBITAL POLISHING WITH SMAD PAD

    公开(公告)号：US20160016280A1

    公开(公告)日：2016-01-21

    申请号：US14334608

    申请日：2014-07-17

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Paul D. Butterfield ,  Jay Gurusamy ,  Jason Garcheung Fung ,  Shou-Sung Chang ,  Jimin Zhang ,  Eric Lau

    IPC: B24B37/10 ,  H01L21/768 ,  H01L21/67

    CPC classification number: B24B37/10

    Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.

    Abstract translation: 化学机械抛光装置包括其上容纳有基底的板，以及可抛光垫支撑和耦合的抛光垫，其在抛光操作期间移动穿过基板并且在基板的局部区域上轨道。 可以改变衬垫抵靠衬底的载荷，垫的转速以及衬垫的尺寸，形状和组成，以控制衬垫移除的材料的速率。

    MODIFYING SUBSTRATE THICKNESS PROFILES
    47.
    发明申请
    MODIFYING SUBSTRATE THICKNESS PROFILES 有权
    修改衬底厚度剖面

    公开(公告)号：US20160016279A1

    公开(公告)日：2016-01-21

    申请号：US14334948

    申请日：2014-07-18

    Applicant: Applied Materials, Inc.

    Inventor： Jay Gurusamy ,  Hung Chih Chen

    IPC: B24B37/04 ,  H01L21/306 ,  B24B37/34

    CPC classification number: B24B37/042 ,  B24B37/34 ,  H01L21/30625

    Abstract: A polishing system include a support to hold a substrate having a substrate surface to be polished, a carrier to hold a polishing pad in contact with the substrate surface, and a pressure applicator to apply pressure at a selected region of a back surface of the polishing pad. The back surface is opposite to the polishing surface. The pressure applicator includes an actuator and a body configured to be moved by the actuator into and out of contact with the selected region of the back surface of the polishing pad.

    Abstract translation: 抛光系统包括用于保持具有待抛光的衬底表面的衬底的支撑件，用于保持抛光垫与衬底表面接触的载体，以及压力施加器，以在抛光的后表面的选定区域处施加压力 垫。 后表面与抛光表面相对。 压力施加器包括致动器和构造成被致动器移动到与抛光垫的后表面的选定区域接触的本体。

    Polishing head retaining ring tilting moment control
    49.
    发明授权
    Polishing head retaining ring tilting moment control 有权

    公开(公告)号：US12214469B2

    公开(公告)日：2025-02-04

    申请号：US17501687

    申请日：2021-10-14

    Applicant: Applied Materials, Inc.

    Inventor： Andrew Nagengast ,  Steven M. Zuniga ,  Jay Gurusamy

    IPC: B24B37/32 ,  B24B37/005 ,  B24B49/16 ,  H01L21/306

    Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring configured to surround a substrate during a polishing process. The retaining ring includes a first surface that is configured to contact a surface of a polishing pad during the polishing process, a second surface that is on a side of the retaining ring that is opposite to the first surface, and an array of recesses formed in the second surface. The substrate carrier for polishing a surface of a substrate also includes a plurality of load bearing pins where each load bearing pin of the plurality of load bearing pins includes a contact surface and a body that has a length, and at least a portion of the length of each load bearing pin of the plurality of load bearing pins is disposed within each recess of the array of recesses and the contact surface of each load bearing pin of the plurality of load bearing pins is positionable relative to a surface of the recess in which it is disposed during the polishing process.

    CONTROL OF PLATEN SHAPE IN CHEMICAL MECHANICAL POLISHING
    50.
    发明申请
    CONTROL OF PLATEN SHAPE IN CHEMICAL MECHANICAL POLISHING 有权

    公开(公告)号：US20240424636A1

    公开(公告)日：2024-12-26

    申请号：US18214456

    申请日：2023-06-26

    Applicant: Applied Materials, Inc.

    Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Jeonghoon Oh

    IPC: B24B37/27 ,  B24B41/02 ,  B24B41/06

    Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, an actuator, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate. The platen has a central section with an upper surface and an annular flexure surrounding or surrounded by the central section and having a top surface with a first edge adjacent to and coplanar with the upper surface and a second edge farther from the central section. The actuator is arranged to bend the annular flexure along an entire circumference of the annular flexure so as to modify a vertical position of the second edge of the annular flexure relative to the central section.

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