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    Silicon-Based Heat Dissipation Device For Heat-Generating Devices
    44.
    发明申请
    Silicon-Based Heat Dissipation Device For Heat-Generating Devices 审中-公开
    用于发热装置的硅基热耗散装置

    公开(公告)号：US20140293543A1

    公开(公告)日：2014-10-02

    申请号：US13929791

    申请日：2013-06-28

    Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

    Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

    IPC: H01L23/373

    CPC classification number: H01L23/3738 ,  F28F3/048 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The board includes a first primary side and a second primary side opposite the first primary side. The at least one heat-generating device is disposed on the first primary side of the board. The primary heat dissipation module includes at least one silicon-based heat dissipation device disposed on the at least one heat-generating device.

    Abstract translation: 描述了硅基散热装置和利用硅基散热装置的芯片模块组件的实施例。 一方面，芯片模块组件包括芯片模块和主散热模块。 芯片模块包括板和至少一个发热装置。 板包括与第一初级侧相对的第一初级侧和第二初级侧。 至少一个发热装置设置在板的第一初级侧上。 主散热模块包括设置在至少一个发热装置上的至少一个硅基散热装置。

    Apparatus and Method of Precision-Controlled Distribution of Lighting of High Uniformity
    45.
    发明申请
    Apparatus and Method of Precision-Controlled Distribution of Lighting of High Uniformity 审中-公开
    高均匀照明精密控制分布的装置与方法

    公开(公告)号：US20140268859A1

    公开(公告)日：2014-09-18

    申请号：US13831518

    申请日：2013-03-14

    Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

    Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

    IPC: F21V8/00

    CPC classification number: G02B6/0096

    Abstract: An apparatus for illumination is provided. In one aspect, the apparatus comprises a light guide device including a hollow light pipe portion, an opening, and a distal end longitudinally opposite from the opening. The opening is configured to receive at least a portion of an illumination device therein. Either or both of the light pipe portion and the distal end has a textured surface thereof.

    Abstract translation: 提供一种用于照明的装置。 一方面，该装置包括导光装置，其包括中空的光管部分，开口和与开口纵向相对的远端。 开口构造成在其中容纳照明装置的至少一部分。 光管部分和远端中的任一个或两者具有纹理表面。

    Silicon-based cooling package for laser gain medium
    46.
    发明授权
    Silicon-based cooling package for laser gain medium 有权

    公开(公告)号：US08514901B2

    公开(公告)日：2013-08-20

    申请号：US13286992

    申请日：2011-11-01

    Applicant: Gerald Ho Kim

    Inventor： Gerald Ho Kim

    IPC: H01S3/00

    CPC classification number: F28F1/00 ,  F28F1/12 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0604

    Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

    Silicon-Based Cooling Package with Diamond Coating for Heat-Generating Devices
    47.
    发明申请
    Silicon-Based Cooling Package with Diamond Coating for Heat-Generating Devices 审中-公开
    基于硅的冷却封装，具有用于发热器件的金刚石涂层

    公开(公告)号：US20120211199A1

    公开(公告)日：2012-08-23

    申请号：US13401808

    申请日：2012-02-21

    Applicant: Gerald Ho Kim

    Inventor： Gerald Ho Kim

    IPC: F28D15/00 ,  B21D53/02

    CPC classification number: H01L23/3732 ,  F28D2021/0028 ,  F28F21/00 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/00 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a heat-generating device are described. In one aspect, a thermal energy transfer apparatus comprises a silicon-based manifold having an internal cavity, a first primary side, and a second primary side opposite the first primary side. The second primary side of the manifold has at least one coolant inlet port and at least one coolant outlet port that are connected to the internal cavity of the manifold, the at least one coolant inlet port being at a position directly opposite a position on the diamond layer where the heat-generating device is received. A diamond layer covers at least a portion of the first primary side of the manifold such that the heat-generating device is in direct contact with the diamond layer when the heat-generating device is received on the first primary side of the manifold.

    Abstract translation: 描述了从发热装置去除热能的热能传递装置的各种实施例。 一方面，热能传递装置包括具有内腔，第一初级侧和与第一初级侧相对的第二初级侧的硅基歧管。 歧管的第二初级侧具有至少一个冷却剂入口端口和至少一个冷却剂出口端口，该至少一个冷却剂出口端口连接到歧管的内部空腔，所述至少一个冷却剂入口端口处于与钻石上的位置正好相对的位置 接收发热装置的层。 金刚石层覆盖歧管的第一初级侧的至少一部分，使得当发热装置被接收在歧管的第一初级侧时，发热装置与金刚石层直接接触。

    Silicon-based lens support structure for diode laser
    48.
    发明授权
    Silicon-based lens support structure for diode laser 有权
    用于二极管激光器的硅基透镜支撑结构

    公开(公告)号：US08238401B2

    公开(公告)日：2012-08-07

    申请号：US12546287

    申请日：2009-08-24

    Applicant: Gerald Ho Kim

    Inventor： Gerald Ho Kim

    IPC: H01S3/08

    CPC classification number: H01S5/02252 ,  H01S5/02288 ,  H01S5/4031

    Abstract: An apparatus that includes a first diode laser and a silicon-based support structure is provided. The first diode laser is configured to emit a first laser beam when powered. The support structure includes a silicon-based support plate, a silicon-based first fin structure, and a silicon-based second fin structure. The support plate has a first primary surface and a second primary surface opposite the first primary surface. The first fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges between the first and the second primary surfaces including a first edge and a second edge opposite the first edge. The first fin structure is physically coupled to the support plate with the first edge of the first fin structure attached to the first primary surface of the support plate. The second fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges between the first and the second primary surfaces including a first edge and a second edge opposite the first edge. The second fin structure is physically coupled to the support plate with the first edge of the second fin structure attached to the first primary surface of the support plate. The first diode laser is physically coupled between the first and the second fin structures to emit the first laser beam in a direction away from the support plate.

    Abstract translation: 提供一种包括第一二极管激光器和硅基支撑结构的装置。 第一二极管激光器被配置为在通电时发射第一激光束。 支撑结构包括硅基支撑板，硅基第一翅片结构和硅基第二鳍结构。 支撑板具有与第一主表面相对的第一主表面和第二主表面。 第一翅片结构具有第一主表面，与第一主表面相对的第二主表面，以及在第一和第二主表面之间的多个边缘包括第一边缘和与第一边缘相对的第二边缘。 第一翅片结构物理耦合到支撑板，第一翅片结构的第一边缘附接到支撑板的第一主表面。 第二鳍片结构具有第一主表面，与第一主表面相对的第二主表面，以及在第一和第二主表面之间的多个边缘包括第一边缘和与第一边缘相对的第二边缘。 第二翅片结构物理耦合到支撑板，第二鳍片结构的第一边缘附接到支撑板的第一主表面。 第一二极管激光器物理耦合在第一和第二鳍结构之间以沿远离支撑板的方向发射第一激光束。

    UV-C LED disinfection device
    50.
    发明授权
    UV-C LED disinfection device 有权

    公开(公告)号：US11771782B2

    公开(公告)日：2023-10-03

    申请号：US17023294

    申请日：2020-09-16

    Applicant: Gerald Ho Kim

    Inventor： Gerald Ho Kim

    IPC: A61L2/10 ,  A61L2/26 ,  A61L2/24

    CPC classification number: A61L2/10 ,  A61L2/24 ,  A61L2/26 ,  A61L2202/11 ,  A61L2202/121 ,  A61L2202/122 ,  A61L2202/14

    Abstract: An ultraviolet C (UV-C) disinfection device includes a UV-C light-emitting diode (LED) illuminator which includes a UV-C source module and a UV-C LED coupling module. The UV-C source module includes a heat spreader and a UV LED chip that is mounted on the heat spreader which is configured to be mounted on a printed circuit board (PCB). The UV-C LED coupling module includes a holder and a rod configured to carry a UV-C light emitted from the UV-C LED chip from a first distal end of the rod to an opposite second distal end of the rod such that the UV-C light gets leaks out from a side of the rod to deliver at least a portion of the UV-C light to a surrounding of the rod, with the rod secured with the holder positioning the rod onto the UV-C chip.

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