公开(公告)号：US20180284923A1

公开(公告)日：2018-10-04

申请号：US15937244

申请日：2018-03-27

Applicant: Japan Display Inc.

Inventor： Yoichi KAMIJO ,  Yoshikatsu IMAZEKI ,  Shuichi OSAWA ,  Yoshihiro WATANABE

IPC: G06F3/044 ,  H05K1/14 ,  H05K1/11 ,  H05K3/40

CPC classification number: G06F3/044 ,  G06F3/0412 ,  G06F3/0416 ,  G06F2203/04103 ,  H05K1/115 ,  H05K1/144 ,  H05K3/4053 ,  H05K2201/09827

Abstract: According to one embodiment, a display device includes an organic insulating layer located between an first basement and an second basement, a first hole penetrating the second basement and the organic insulating layer, a connecting material provided via the first hole to electrically connects a first terminal and a second terminal to each other and a filling member covering the connecting material and filled in the first hole, and the protective member includes an exposure area in which the filling member is disposed, and a thickness from the second basement to an upper surface of the filling member is substantially equal to a thickness from the second basement to an upper surface of the protective member.

公开(公告)号：US20180213638A1

公开(公告)日：2018-07-26

申请号：US15879794

申请日：2018-01-25

Applicant: Japan Display Inc.

Inventor： Shuichi OSAWA ,  Shoji HINATA ,  Yoshikatsu IMAZEKI ,  Yoichi KAMIJO ,  Yoshihiro WATANABE

IPC: H05K1/02 ,  H05K1/11 ,  H05K5/00 ,  H05K1/03 ,  H01B1/08

CPC classification number: H05K1/0298 ,  G02F1/13338 ,  G02F2201/42 ,  G06F3/0412 ,  G06F3/044 ,  H01B1/08 ,  H05K1/0313 ,  H05K1/117 ,  H05K5/0017

Abstract: According to one embodiment, a display device includes a first substrate including a first basement and a first terminal, a second substrate including a second basement including a first surface opposing the first terminal and a second surface on an opposite side to the first surface, a second terminal located on a side of the second surface, and a first hole, an organic insulating layer located between the first terminal and the second basement and including a second hole connecting to the first hole and a connecting material provided on the first hole to electrically connect the first terminal and the second terminal to each other, at least one of the first terminal and the second terminal including an oxide electrode in contact with the connecting material.

公开(公告)号：US20180031938A1

公开(公告)日：2018-02-01

申请号：US15661443

申请日：2017-07-27

Applicant: Japan Display Inc.

Inventor： Yoshihiro WATANABE ,  Yoshikatsu IMAZEKI ,  Yoichi KAMIJO ,  Shuichi OSAWA

IPC: G02F1/1362 ,  G02F1/1339 ,  H05K3/36 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  G02F1/1333 ,  H05K1/14

CPC classification number: G02F1/136286 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/133512 ,  G02F1/133514 ,  G02F1/133528 ,  G02F1/1339 ,  G02F1/134363 ,  G02F1/136213 ,  G02F1/1368 ,  G02F2001/133519 ,  G02F2001/13629 ,  G02F2001/136295 ,  G02F2201/121 ,  G02F2201/123 ,  G02F2201/42 ,  H05K1/115 ,  H05K1/144 ,  H05K3/002 ,  H05K3/0026 ,  H05K3/366 ,  H05K3/4038 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/10136 ,  H05K2203/107

Abstract: According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, and a connecting material. The second substrate includes a second basement and a second conductive layer. The second basement has a third surface opposed to the first conductive layer and a fourth surface and is spaced apart from the first conductive layer. The second substrate has a first hole penetrating the second basement. The first substrate has a second hole. A third opening of the second hole is smaller than a first opening of the first hole. A connecting material connects the first conductive layer and the second conductive layer via the first hole.

公开(公告)号：US20180031934A1

公开(公告)日：2018-02-01

申请号：US15662899

申请日：2017-07-28

Applicant: Japan Display Inc.

Inventor： Yoshihiro WATANABE ,  Yoshikatsu IMAZEKI ,  Yoichi KAMIJO ,  Shuichi OSAWA

IPC: G02F1/1362 ,  H01L21/02 ,  B32B7/12 ,  H01L21/50 ,  H01L21/28

CPC classification number: G02F1/136227 ,  B32B3/266 ,  B32B7/12 ,  B32B7/14 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B17/00 ,  B32B27/06 ,  B32B27/308 ,  B32B2250/44 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/404 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/42 ,  B32B2457/20 ,  B32B2457/202 ,  G02F1/1339 ,  G02F1/136213 ,  G02F2001/133388 ,  H01L21/02063 ,  H01L21/28273 ,  H01L21/50 ,  H01L2021/60075

Abstract: According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement opposed to the first basement and the first conductive layer, and a second conductive layer, a sealing material located between the first substrate and the second substrate to bond the first substrate to the second substrate, a contact hole penetrating the second basement, the sealing material and the first conductive layer, and a connecting material electrically connecting the first conductive layer with the second conductive layer via the contact hole.