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    Optical component package and device using same
    41.
    发明授权
    Optical component package and device using same 有权

    公开(公告)号：US11545596B2

    公开(公告)日：2023-01-03

    申请号：US17351019

    申请日：2021-06-17

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64

    Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.

    Optical component package and device using same
    45.
    发明授权
    Optical component package and device using same 有权

    公开(公告)号：US11069839B2

    公开(公告)日：2021-07-20

    申请号：US16738827

    申请日：2020-01-09

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64

    Abstract: Disclosed is an optical component package. The optical component package according to the present invention includes: a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a sub-substrate provided in a cavity of the main substrate, and electrically connected to each of the metal bodies with the vertical insulation part interposed therebetween; an optical component mounted on the sub-substrate; and a light transmitting member provided above the optical component, wherein the sub-substrate includes: an insulating body; a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component.

    Micro LED transfer head
    46.
    发明授权
    Micro LED transfer head 有权

    公开(公告)号：US11049759B2

    公开(公告)日：2021-06-29

    申请号：US16447852

    申请日：2019-06-20

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L21/683 ,  H01L33/00 ,  B25J15/06

    Abstract: The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.

    Unit substrate for optical device and optical device package having same
    47.
    发明授权
    Unit substrate for optical device and optical device package having same 有权

    公开(公告)号：US10658549B2

    公开(公告)日：2020-05-19

    申请号：US16144857

    申请日：2018-09-27

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/60

    Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.

    SYSTEM HAVING TRANSFER HEAD FOR TRANSFERRING MICRO LED
    48.
    发明申请
    SYSTEM HAVING TRANSFER HEAD FOR TRANSFERRING MICRO LED 审中-公开

    公开(公告)号：US20190305178A1

    公开(公告)日：2019-10-03

    申请号：US16370674

    申请日：2019-03-29

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L33/00 ,  H01L33/20 ,  H01L21/02

    Abstract: The present invention relates to a system having a transfer head for transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a system having a transfer head for transferring a micro LED, the system being configured such that the transfer head does not use an electrostatic force and preventing the generation of an electrostatic force which may cause a problem. In addition, the present invention relates to a system having a transfer head for transferring a micro LED, the system employing a suction structure using a suction force to transfer a micro LED by a porous member, thereby solving problems of the related art.

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